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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and semiconductor package
- Patent number 10,950,517
- Issue date Mar 16, 2021
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor package
- Patent number 10,586,748
- Issue date Mar 10, 2020
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a semiconductor die having redistri...
- Patent number 10,103,076
- Issue date Oct 16, 2018
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding device
- Patent number 9,437,571
- Issue date Sep 6, 2016
- Shibuya Kogyo Co., Ltd.
- Hiroyuki Yasuyoshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20200176344
- Publication date Jun 4, 2020
- Samsung Electronics Co. Ltd.
- Soo-Jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...
- Publication number 20180366380
- Publication date Dec 20, 2018
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20170309559
- Publication date Oct 26, 2017
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...
- Publication number 20170148692
- Publication date May 25, 2017
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE
- Publication number 20150171048
- Publication date Jun 18, 2015
- SHIBUYA KOGYO CO., LTD.
- Hiroyuki YASUYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION METHOD AND RECIPE FOR SACRIFICIAL MATERIAL PATTERNIN...
- Publication number 20150072515
- Publication date Mar 12, 2015
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS