being an ohmic electrical conductor

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H01L2924/0781

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/0781being an ohmic electrical conductor

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Patents Grantslast 30 patents

Information Patent Grant
Adhesive bonding composition and electronic components prepared fro...
- Patent number 11,901,331
- Issue date Feb 13, 2024
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
- Patent number 11,862,539
- Issue date Jan 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and measurement device
- Patent number 11,854,952
- Issue date Dec 26, 2023
- Lapis Semiconductor Co., Ltd.
- Toshihisa Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connectors for making connections between analyte sensors and other...
- Patent number 11,806,141
- Issue date Nov 7, 2023
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device with improved flexural resistance and electri...
- Patent number 11,784,290
- Issue date Oct 10, 2023
- Nichia Corporation
- Keiichi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Filler disposition film
- Patent number 11,732,105
- Issue date Aug 22, 2023
- Dexerials Corporation
- Yasushi Akutsu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 11,683,963
- Issue date Jun 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package and method of manufacturing the same
- Patent number 11,615,967
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitor mounted on an integrated circuit die, and meth...
- Patent number 11,562,978
- Issue date Jan 24, 2023
- Intel Corporation
- Florence R. Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connectors for making connections between analyte sensors and other...
- Patent number 11,471,080
- Issue date Oct 18, 2022
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method of making flexible semiconductor device with graphene tape
- Patent number 11,456,188
- Issue date Sep 27, 2022
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
- Patent number 11,410,916
- Issue date Aug 9, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging photon building blocks with top side connections and inte...
- Patent number 11,411,152
- Issue date Aug 9, 2022
- Bridgelux, Inc.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with lead frame with improved lead design for discrete elec...
- Patent number 11,404,355
- Issue date Aug 2, 2022
- STMicroelectronics Pte Ltd
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connectors for making connections between analyte sensors and other...
- Patent number 11,382,542
- Issue date Jul 12, 2022
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,380,862
- Issue date Jul 5, 2022
- Apple Inc.
- Andreas Bibi
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device having an oscillator and an associated integra...
- Patent number 11,309,234
- Issue date Apr 19, 2022
- Lapis Semiconductor Co., Ltd.
- Toshihisa Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and electronic components prepared fro...
- Patent number 11,270,973
- Issue date Mar 8, 2022
- Immunolight, LLC
- Zakaryae Fathi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Connectors for making connections between analyte sensors and other...
- Patent number 11,234,622
- Issue date Feb 1, 2022
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor device
- Patent number 11,201,121
- Issue date Dec 14, 2021
- Fuji Electric Co., Ltd.
- Kohei Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film-like adhesive and method for producing semiconductor package u...
- Patent number 11,139,261
- Issue date Oct 5, 2021
- Furukawa Electric Co., Ltd.
- Minoru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,134,572
- Issue date Sep 28, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package
- Patent number 11,004,698
- Issue date May 11, 2021
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 10,964,900
- Issue date Mar 30, 2021
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connectors for making connections between analyte sensors and other...
- Patent number 10,888,257
- Issue date Jan 12, 2021
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging photon building blocks with top side connections and inte...
- Patent number 10,840,424
- Issue date Nov 17, 2020
- Bridgelux, Inc.
- R. Scott West
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
- Patent number 10,825,755
- Issue date Nov 3, 2020
- Amkor Technology Singapore Holding Pte Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,818,629
- Issue date Oct 27, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20240203839
- Publication date Jun 20, 2024
- Amkor Technology Singapore Holding Pte. Ltd
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...
- Publication number 20240090801
- Publication date Mar 21, 2024
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CONDUCTIVE ADHESIVE ASSEMBLY FOR SEMICONDUCTOR DIE ATTACHMENT
- Publication number 20240063165
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Ramesh NALLAVELLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT
- Publication number 20230395524
- Publication date Dec 7, 2023
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT
- Publication number 20230361076
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Hermann Bechert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH CONDUCTIVE ADHESIVE THAT OVERFLOWS FOR R...
- Publication number 20230238349
- Publication date Jul 27, 2023
- Airoha Technology (HK) Limited
- Chun-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20230026949
- Publication date Jan 26, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...
- Publication number 20230000400
- Publication date Jan 5, 2023
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FRO...
- Publication number 20220181292
- Publication date Jun 9, 2022
- Immunolight, LLC
- Zakaryae FATHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...
- Publication number 20210345914
- Publication date Nov 11, 2021
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...
- Publication number 20210128027
- Publication date May 6, 2021
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20210050284
- Publication date Feb 18, 2021
- Amkor Technology Singapore Holding Pte. Ltd
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FRO...
- Publication number 20210035946
- Publication date Feb 4, 2021
- Immunolight, LLC
- Zakaryae FATHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PACKAGE WITH LEAD FRAME WITH IMPROVED LEAD DESIGN FOR DISCRETE ELEC...
- Publication number 20200365492
- Publication date Nov 19, 2020
- STMicroelectronics Pte Ltd
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE
- Publication number 20200312751
- Publication date Oct 1, 2020
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE WITH IMPROVED FLEXURAL RESISTANCE AND ELECTRI...
- Publication number 20200251630
- Publication date Aug 6, 2020
- TOSHIBA HOKUTO ELECTRONICS CORPORATION
- Keiichi MAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20200144164
- Publication date May 7, 2020
- Amkor Technology, Inc.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20200013975
- Publication date Jan 9, 2020
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20190348347
- Publication date Nov 14, 2019
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVING MECHANICAL AND THERMAL RELIABILITY IN VARYING FORM FACTORS
- Publication number 20190312001
- Publication date Oct 10, 2019
- Intel Corporation
- Veronica A. Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for a Semiconductor Device Having Bi-Material...
- Publication number 20190304881
- Publication date Oct 3, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-LIKE ADHESIVE AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE U...
- Publication number 20190181113
- Publication date Jun 13, 2019
- FURUKAWA ELECTRIC CO., LTD.
- Minoru MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME
- Publication number 20190148478
- Publication date May 16, 2019
- SAMSUNG DISPLAY CO., LTD.
- Chungseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING APPARATUS
- Publication number 20190027667
- Publication date Jan 24, 2019
- Nichia Corporation.
- Ryohei YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TALL AND FINE PITCH INTERCONNECTS
- Publication number 20190013287
- Publication date Jan 10, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FRO...
- Publication number 20180358327
- Publication date Dec 13, 2018
- Immunolight, LLC
- Zakaryae FATHI
- B32 - LAYERED PRODUCTS
Information Patent Application
Method Of Fabricating Low-Profile Footed Power Package
- Publication number 20180330968
- Publication date Nov 15, 2018
- ADVENTIVE IPBANK
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM
- Publication number 20180294242
- Publication date Oct 11, 2018
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION
- Publication number 20180254213
- Publication date Sep 6, 2018
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...
- Publication number 20180218994
- Publication date Aug 2, 2018
- DEXERIALS CORPORATION
- Kouichi SATO
- B32 - LAYERED PRODUCTS

being an ohmic electrical conductor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Adhesive bonding composition and electronic components prepared fro...

Method of forming a packaged semiconductor device having enhanced w...

Semiconductor device and measurement device

Connectors for making connections between analyte sensors and other...

Circuit board structure and method for manufacturing a circuit boar...

Light-emitting device with improved flexural resistance and electri...

Light emitting diode display with redundancy scheme

Filler disposition film

Anisotropic conductive film and display device using the same

Power module package and method of manufacturing the same

Decoupling capacitor mounted on an integrated circuit die, and meth...

Connectors for making connections between analyte sensors and other...

Method of making flexible semiconductor device with graphene tape

Method of forming a packaged semiconductor device having enhanced w...

Packaging photon building blocks with top side connections and inte...

Package with lead frame with improved lead design for discrete elec...

Connectors for making connections between analyte sensors and other...

Light emitting diode display with redundancy scheme

Semiconductor device having an oscillator and an associated integra...

Adhesive bonding composition and electronic components prepared fro...

Connectors for making connections between analyte sensors and other...

Semiconductor device

Film-like adhesive and method for producing semiconductor package u...

Circuit board structure and method for manufacturing a circuit boar...

Power module package

Light emitting diode display with redundancy scheme

Connectors for making connections between analyte sensors and other...

Packaging photon building blocks with top side connections and inte...

Method of forming a packaged semiconductor device having enhanced w...

Tall and fine pitch interconnects

Patents Applicationslast 30 patents

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...

CONDUCTIVE ADHESIVE ASSEMBLY FOR SEMICONDUCTOR DIE ATTACHMENT

EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT

CHIP ARRANGEMENT

SEMICONDUCTOR PACKAGE WITH CONDUCTIVE ADHESIVE THAT OVERFLOWS FOR R...

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...

ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FRO...

CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...

CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FRO...

PACKAGE WITH LEAD FRAME WITH IMPROVED LEAD DESIGN FOR DISCRETE ELEC...

FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE

LIGHT-EMITTING DEVICE WITH IMPROVED FLEXURAL RESISTANCE AND ELECTRI...

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

Die Attach Methods and Semiconductor Devices Manufactured based on...

IMPROVING MECHANICAL AND THERMAL RELIABILITY IN VARYING FORM FACTORS

Methods and Apparatus for a Semiconductor Device Having Bi-Material...

FILM-LIKE ADHESIVE AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE U...

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME

LIGHT EMITTING APPARATUS

TALL AND FINE PITCH INTERCONNECTS

ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FRO...

Method Of Fabricating Low-Profile Footed Power Package

ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM

MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION

ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...