being circular or elliptic

Industry

CPC
H01L2224/29014

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29014being circular or elliptic

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Electroconductive film, roll, connected structure, and process for...
- Patent number 11,667,817
- Issue date Jun 6, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Takashi Tatsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,626,352
- Issue date Apr 11, 2023
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a cooling body with a groove
- Patent number 11,088,045
- Issue date Aug 10, 2021
- Mitsubishi Electric Corporation
- Noboru Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bonding substrates
- Patent number 10,131,126
- Issue date Nov 20, 2018
- Applied Materials, Inc.
- Kadthala Ramaya Narendrnath
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for coating conductive substrate with adhesive
- Patent number 10,056,534
- Issue date Aug 21, 2018
- G-SMATT CO., LTD.
- Hak Ryul Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 9,972,555
- Issue date May 15, 2018
- Renesas Electronics Corporation
- Soshi Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stack protection seal
- Patent number 9,768,089
- Issue date Sep 19, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ranjan Rajoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing thermal interface sheet
- Patent number 9,704,775
- Issue date Jul 11, 2017
- Fujitsu Limited
- Naoaki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate composite, method and device for bonding of substrates
- Patent number 9,682,539
- Issue date Jun 20, 2017
- Erich Thallner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device
- Patent number 9,653,623
- Issue date May 16, 2017
- Samsung Electronics Co., Ltd.
- Yi-Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing structure for a bonded wafer and method of forming the seal...
- Patent number 9,653,312
- Issue date May 16, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yuankun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bonding substrates
- Patent number 9,627,231
- Issue date Apr 18, 2017
- Applied Materials, Inc.
- Kadthala Ramaya Narendrnath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer bonding process and structures
- Patent number 9,613,926
- Issue date Apr 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 9,595,488
- Issue date Mar 14, 2017
- J-DEVICES CORPORATION
- Yoshihiro Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a wafer and wafer structure
- Patent number 9,589,880
- Issue date Mar 7, 2017
- Infineon Technologies AG
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stack protection seal
- Patent number 9,406,577
- Issue date Aug 2, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ranjan Rajoo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interposer package-on-package structure
- Patent number 9,406,636
- Issue date Aug 2, 2016
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package systems
- Patent number 9,355,896
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,324,684
- Issue date Apr 26, 2016
- Mitsubishi Electric Corporation
- Yasunari Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-Nitride device with solderable front metal
- Patent number 9,312,375
- Issue date Apr 12, 2016
- Infineon Technologies Americas Corp.
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module and production method
- Patent number 9,253,886
- Issue date Feb 2, 2016
- EPCOS AG
- Kim Choong Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Embedded electrical component surface interconnect
- Patent number 9,245,819
- Issue date Jan 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. Vincent
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package systems and manufacturing methods thereof
- Patent number 9,112,001
- Issue date Aug 18, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with alternating thermal interface and adhesi...
- Patent number 8,981,550
- Issue date Mar 17, 2015
- Amkor Technology, Inc.
- Joon Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-axial restraint for connectors within flip-chip packages
- Patent number 8,970,041
- Issue date Mar 3, 2015
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device with solderable front metal
- Patent number 8,853,744
- Issue date Oct 7, 2014
- International Rectifier Corporation
- Chuan Cheah
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Package systems having a eutectic bonding material and manufacturin...
- Patent number 8,674,495
- Issue date Mar 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Co-axial restraint for connectors within flip-chip packages
- Patent number 8,507,325
- Issue date Aug 13, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method for fabricating the same
- Patent number 8,487,437
- Issue date Jul 16, 2013
- Optopac Co., Ltd.
- Peter Elenius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-nitride power device with solderable front metal
- Patent number 8,399,912
- Issue date Mar 19, 2013
- International Rectifier Corporation
- Chuan Cheah
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240178125
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
- Publication number 20240145420
- Publication date May 2, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230207432
- Publication date Jun 29, 2023
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...
- Publication number 20230137299
- Publication date May 4, 2023
- Showa Denko Materials Co., Ltd.
- Takashi TATSUZAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE
- Publication number 20180233440
- Publication date Aug 16, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Edward Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20180033709
- Publication date Feb 1, 2018
- RENESAS ELECTRONICS CORPORATION
- Soshi KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING THERMAL INTERFACE SHEET
- Publication number 20170047269
- Publication date Feb 16, 2017
- Fujitsu Limited
- Naoaki Nakamura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE
- Publication number 20160284958
- Publication date Sep 29, 2016
- G-SMATT CO., LTD.
- Hak Ryul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACK PROTECTION SEAL
- Publication number 20140264762
- Publication date Sep 18, 2014
- GLOBAL FOUNDRIES SINGAPORE PTE LTD.
- Ranjan RAJOO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF
- Publication number 20140170849
- Publication date Jun 19, 2014
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Chia-Pao SHU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR BONDING SUBSTRATES
- Publication number 20140099485
- Publication date Apr 10, 2014
- Kadthala Ramaya NARENDRNATH
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER LEVEL PACKAGE, CHIP SIZE PACKAGE DEVICE AND METHOD OF MANUFAC...
- Publication number 20140008779
- Publication date Jan 9, 2014
- Omron Corporation
- Toshiaki Okuno
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130214402
- Publication date Aug 22, 2013
- Amkor Technology, Inc.
- Joon Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Electrical Component Surface Interconnect
- Publication number 20130215583
- Publication date Aug 22, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Device with Solderable Front Metal
- Publication number 20130207120
- Publication date Aug 15, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Chuan Cheah
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MODULE AND PRODUCTION METHOD
- Publication number 20130176686
- Publication date Jul 11, 2013
- EPCOS AG
- Kim Choong Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EPOXY COATING ON SUBSTRATE FOR DIE ATTACH
- Publication number 20120279651
- Publication date Nov 8, 2012
- Wei Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-AXIAL RESTRAINT FOR CONNECTORS WITHIN FLIP-CHIP PACKAGES
- Publication number 20120223434
- Publication date Sep 6, 2012
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF
- Publication number 20120086127
- Publication date Apr 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao SHU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
III-Nitride Power Device with Solderable Front Metal
- Publication number 20110198611
- Publication date Aug 18, 2011
- INTERNATIONAL RECTIFIER CORPORATION
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20110193231
- Publication date Aug 11, 2011
- OPTOPAC CO., LTD.
- Peter ELENIUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-AXIAL RESTRAINT FOR CONNECTORS WITHIN FLIP-CHIP PACKAGES
- Publication number 20110180920
- Publication date Jul 28, 2011
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING ELECTRONIC COMPONENTS
- Publication number 20080196245
- Publication date Aug 21, 2008
- Fujitsu Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOOLS STRUCTURE FOR CHIP REDISTRIBUTION AND METHOD OF THE SAME
- Publication number 20080142939
- Publication date Jun 19, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component
- Publication number 20070181891
- Publication date Aug 9, 2007
- Dominik Eisert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component and production method
- Publication number 20060065905
- Publication date Mar 30, 2006
- Dominik Eisert
- H01 - BASIC ELECTRIC ELEMENTS

being circular or elliptic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electroconductive film, roll, connected structure, and process for...

Semiconductor device and method for manufacturing the same

Semiconductor device having a cooling body with a groove

Methods for bonding substrates

Method for coating conductive substrate with adhesive

Semiconductor device and method of manufacturing same

Wafer stack protection seal

Method for manufacturing thermal interface sheet

Substrate composite, method and device for bonding of substrates

Methods of manufacturing a semiconductor device

Sealing structure for a bonded wafer and method of forming the seal...

Methods for bonding substrates

Wafer to wafer bonding process and structures

Semiconductor device

Method for processing a wafer and wafer structure

Wafer stack protection seal

Interposer package-on-package structure

Package systems

Semiconductor device and manufacturing method thereof

III-Nitride device with solderable front metal

Module and production method

Embedded electrical component surface interconnect

Package systems and manufacturing methods thereof

Semiconductor package with alternating thermal interface and adhesi...

Co-axial restraint for connectors within flip-chip packages

Power device with solderable front metal

Package systems having a eutectic bonding material and manufacturin...

Co-axial restraint for connectors within flip-chip packages

Electronic device package and method for fabricating the same

III-nitride power device with solderable front metal

Patents Applicationslast 30 patents

WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE

LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...

RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

METHOD FOR MANUFACTURING THERMAL INTERFACE SHEET

METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE

WAFER STACK PROTECTION SEAL

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

METHODS FOR BONDING SUBSTRATES

WAFER LEVEL PACKAGE, CHIP SIZE PACKAGE DEVICE AND METHOD OF MANUFAC...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Embedded Electrical Component Surface Interconnect

Power Device with Solderable Front Metal

MODULE AND PRODUCTION METHOD

EPOXY COATING ON SUBSTRATE FOR DIE ATTACH

CO-AXIAL RESTRAINT FOR CONNECTORS WITHIN FLIP-CHIP PACKAGES

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

III-Nitride Power Device with Solderable Front Metal

ELECTRONIC DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME

CO-AXIAL RESTRAINT FOR CONNECTORS WITHIN FLIP-CHIP PACKAGES

METHOD FOR MOUNTING ELECTRONIC COMPONENTS

TOOLS STRUCTURE FOR CHIP REDISTRIBUTION AND METHOD OF THE SAME

Semiconductor component

Semiconductor component and production method