being circular or elliptic

Industry

CPC
H01L2224/32055

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32055being circular or elliptic

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 11,955,453
- Issue date Apr 9, 2024
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor arrangement
- Patent number 11,955,450
- Issue date Apr 9, 2024
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method for producing the same
- Patent number 11,688,712
- Issue date Jun 27, 2023
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and forming method thereof
- Patent number 11,296,051
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond materials with enhanced plasma resistant characteristics and a...
- Patent number 10,727,195
- Issue date Jul 28, 2020
- Technetics Group LLC
- Jason Wright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for the fluidic assembly of micro-LEDs utilizing...
- Patent number 10,535,640
- Issue date Jan 14, 2020
- eLux Inc.
- Jong-Jan Lee
- G02 - OPTICS
Information Patent Grant
Qubit die attachment using preforms
- Patent number 10,256,206
- Issue date Apr 9, 2019
- Intel Corporation
- Javier A. Falcon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate composite, method and device for bonding of substrates
- Patent number 9,682,539
- Issue date Jun 20, 2017
- Erich Thallner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with adhesive material pre-printed on the lea...
- Patent number 9,653,424
- Issue date May 16, 2017
- Alpha and Omega Semiconductor Incorporated
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,324,684
- Issue date Apr 26, 2016
- Mitsubishi Electric Corporation
- Yasunari Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed wafer packages
- Patent number 9,287,237
- Issue date Mar 15, 2016
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking method and stacking carrier
- Patent number 8,324,105
- Issue date Dec 4, 2012
- Victory Gain Group Corporation
- Jui-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting electronic components
- Patent number 8,230,590
- Issue date Jul 31, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240387469
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240038725
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Keumhee MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE PREVENTING SOLDER OVERFLOW
- Publication number 20230395553
- Publication date Dec 7, 2023
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230317539
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Bo In NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR ARRANGEMENT
- Publication number 20230275059
- Publication date Aug 31, 2023
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220223567
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND FORMING METHOD THEREOF
- Publication number 20210057384
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Arrangement and Method for Producing the Same
- Publication number 20200266171
- Publication date Aug 20, 2020
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...
- Publication number 20190088613
- Publication date Mar 21, 2019
- TECHNETICS GROUP LLC
- Jason Wright
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
QUBIT DIE ATTACHMENT USING PREFORMS
- Publication number 20190043822
- Publication date Feb 7, 2019
- Intel Corporation
- Javier A. Falcon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160276312
- Publication date Sep 22, 2016
- Kabushiki Kaisha Toshiba
- Shinya SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20160118346
- Publication date Apr 28, 2016
- Meiko Electronics Co., Ltd.
- Mitsuaki Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETICALLY SEALED WAFER PACKAGES
- Publication number 20150262967
- Publication date Sep 17, 2015
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING METHOD AND STACKING CARRIER
- Publication number 20130049230
- Publication date Feb 28, 2013
- VICTORY GAIN GROUP CORPORATION
- Jui-Hung CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETICALLY SEALED WAFER PACKAGES
- Publication number 20120319261
- Publication date Dec 20, 2012
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING METHOD AND STACKING CARRIER
- Publication number 20120038060
- Publication date Feb 16, 2012
- MOS Art Pack Corporation
- Jui-Hung CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING ELECTRONIC COMPONENTS
- Publication number 20080196245
- Publication date Aug 21, 2008
- Fujitsu Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

being circular or elliptic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device

Method for producing a semiconductor arrangement

Semiconductor arrangement and method for producing the same

Semiconductor packages and forming method thereof

Bond materials with enhanced plasma resistant characteristics and a...

System and method for the fluidic assembly of micro-LEDs utilizing...

Qubit die attachment using preforms

Substrate composite, method and device for bonding of substrates

Semiconductor package with adhesive material pre-printed on the lea...

Semiconductor device and manufacturing method thereof

Hermetically sealed wafer packages

Stacking method and stacking carrier

Method for mounting electronic components

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE

PACKAGE DEVICE PREVENTING SOLDER OVERFLOW

SEMICONDUCTOR PACKAGE

METHOD FOR PRODUCING A SEMICONDUCTOR ARRANGEMENT

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGES AND FORMING METHOD THEREOF

Semiconductor Arrangement and Method for Producing the Same

BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...

QUBIT DIE ATTACHMENT USING PREFORMS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF

HERMETICALLY SEALED WAFER PACKAGES

STACKING METHOD AND STACKING CARRIER

HERMETICALLY SEALED WAFER PACKAGES

STACKING METHOD AND STACKING CARRIER

METHOD FOR MOUNTING ELECTRONIC COMPONENTS