being disposed in a single wiring level

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CPC
H01L2224/06168

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/06168being disposed in a single wiring level

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die with die pad pattern
- Patent number 7,834,466
- Issue date Nov 16, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Robert J. Wenzel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE WITH DIE PAD PATTERN
- Publication number 20090152718
- Publication date Jun 18, 2009
- Robert J. Wenzel
- H01 - BASIC ELECTRIC ELEMENTS