TREA

being disposed in a single wiring level

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  • CPC
  • H01L2224/06158
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/06158being disposed in a single wiring level
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor package
    • Patent number 11,948,903
    • Issue date Apr 2, 2024
    • Samsung Electronics Co., Ltd.
    • Sang-Sick Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,616,039
    • Issue date Mar 28, 2023
    • Samsung Electronics Co., Ltd.
    • Sang-Sick Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor memory including pads arranged in parallel
    • Patent number 10,665,558
    • Issue date May 26, 2020
    • Samsung Electronics Co., Ltd.
    • Sihong Kim
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents