being disposed in different wiring levels

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H01L2224/06139

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/06139being disposed in different wiring levels

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating semiconductor device with redistribution plugs
- Patent number 12,112,978
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package module
- Patent number 10,340,245
- Issue date Jul 2, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Yong Jin Seol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor logic device and system and method of embedded packag...
- Patent number 10,276,523
- Issue date Apr 30, 2019
- General Electric Company
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package module
- Patent number 10,192,844
- Issue date Jan 29, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Yong Jin Seol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package module
- Patent number 9,991,219
- Issue date Jun 5, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Yong Jin Seol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with redistribution pads
- Patent number 9,859,204
- Issue date Jan 2, 2018
- Samsung Electronics Co., Ltd.
- Myeong Soon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die with corner IO pads
- Patent number 9,633,959
- Issue date Apr 25, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Shailesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor package
- Patent number 9,418,960
- Issue date Aug 16, 2016
- Kabushiki Kaisha Toshiba
- Shohei Fukuda
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS
- Publication number 20230395489
- Publication date Dec 7, 2023
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LOGIC DEVICE AND SYSTEM AND METHOD OF EMBEDDED PACKAG...
- Publication number 20190157226
- Publication date May 23, 2019
- GENERAL ELECTRIC COMPANY
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE MODULE
- Publication number 20180158791
- Publication date Jun 7, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Yong Jin SEOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE MODULE
- Publication number 20180061801
- Publication date Mar 1, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Yong Jin SEOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE MODULE
- Publication number 20170373035
- Publication date Dec 28, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Yong Jin SEOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES HAVING LAYERED INTERCONNECT STRUCTURES AND...
- Publication number 20150115454
- Publication date Apr 30, 2015
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING DECOUPLING SEMICONDUCTOR CAPACITOR
- Publication number 20120068306
- Publication date Mar 22, 2012
- Sang-Sub SONG
- H01 - BASIC ELECTRIC ELEMENTS

being disposed in different wiring levels

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for fabricating semiconductor device with redistribution plugs

Fan-out semiconductor package module

Semiconductor logic device and system and method of embedded packag...

Fan-out semiconductor package module

Fan-out semiconductor package module

Semiconductor devices with redistribution pads

Integrated circuit die with corner IO pads

Semiconductor chip and semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS

SEMICONDUCTOR LOGIC DEVICE AND SYSTEM AND METHOD OF EMBEDDED PACKAG...

FAN-OUT SEMICONDUCTOR PACKAGE MODULE

FAN-OUT SEMICONDUCTOR PACKAGE MODULE

FAN-OUT SEMICONDUCTOR PACKAGE MODULE

MICROELECTRONIC PACKAGES HAVING LAYERED INTERCONNECT STRUCTURES AND...

SEMICONDUCTOR PACKAGE INCLUDING DECOUPLING SEMICONDUCTOR CAPACITOR