being disposed in different wiring levels

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H01L2224/06169

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/06169being disposed in different wiring levels

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices with redistribution pads
- Patent number 9,859,204
- Issue date Jan 2, 2018
- Samsung Electronics Co., Ltd.
- Myeong Soon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 8,581,361
- Issue date Nov 12, 2013
- Canon Kabushiki Kaisha
- Masanori Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with die pad pattern
- Patent number 7,834,466
- Issue date Nov 16, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Robert J. Wenzel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230387054
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Junyoung KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20120153367
- Publication date Jun 21, 2012
- Canon Kabushiki Kaisha
- Masanori Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH DIE PAD PATTERN
- Publication number 20090152718
- Publication date Jun 18, 2009
- Robert J. Wenzel
- H01 - BASIC ELECTRIC ELEMENTS