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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29078being disposed next to each other

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Patents Grantslast 30 patents

Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of pre-channeled materials for anisotropic conductors
- Patent number 12,051,670
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 12,014,999
- Issue date Jun 18, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member and display device including the same
- Patent number 12,015,007
- Issue date Jun 18, 2024
- Samsung Display Co., Ltd.
- Hong Am Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric and metallic nanowire bond layers
- Patent number 11,791,296
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,302
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,306
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,626,352
- Issue date Apr 11, 2023
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 11,557,530
- Issue date Jan 17, 2023
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member and display device including the same
- Patent number 11,545,461
- Issue date Jan 3, 2023
- Samsung Display Co., Ltd.
- Hong Am Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of manufacturing the same
- Patent number 11,532,589
- Issue date Dec 20, 2022
- Kioxia Corporation
- Jun Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,476,216
- Issue date Oct 18, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a dielectric layer edge covering cir...
- Patent number 11,410,897
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric and metallic nanowire bond layers
- Patent number 11,195,811
- Issue date Dec 7, 2021
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of pre-channeled materials for anisotropic conductors
- Patent number 11,139,262
- Issue date Oct 5, 2021
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and bonding method of the same
- Patent number 11,038,006
- Issue date Jun 15, 2021
- Jianjun Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 10,818,622
- Issue date Oct 27, 2020
- VueReal Inc.
- Gholamreza Chaji
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for producing a through semiconductor via connection
- Patent number 10,811,315
- Issue date Oct 20, 2020
- Imec VZW
- Gaspard Hiblot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical non-destructive inspection method and optical non-destructi...
- Patent number 10,751,832
- Issue date Aug 25, 2020
- JTEKT Corporation
- Naoki Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,727,170
- Issue date Jul 28, 2020
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film
- Patent number 10,714,444
- Issue date Jul 14, 2020
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film
- Patent number 10,553,554
- Issue date Feb 4, 2020
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method for manufacturing the same
- Patent number 10,494,549
- Issue date Dec 3, 2019
- Samsung Display Co., Ltd.
- Minseok Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Power semiconductor device having void filled with resin
- Patent number 10,468,368
- Issue date Nov 5, 2019
- Mitsubishi Electric Corporation
- Sho Kumada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for cohesively connecting a first component of a power semic...
- Patent number 10,438,924
- Issue date Oct 8, 2019
- Danfoss Silicon Power GmbH
- Martin Becker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, display panel, display device, and electronic...
- Patent number 10,304,787
- Issue date May 28, 2019
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Jun Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...
- Publication number 20240421115
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS
- Publication number 20240387441
- Publication date Nov 21, 2024
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND ME...
- Publication number 20240371722
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Chien Pan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20240297133
- Publication date Sep 5, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240227089
- Publication date Jul 11, 2024
- Sekisui Chemical Co., Ltd.
- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240131633
- Publication date Apr 25, 2024
- Sekisui Chemical Co., Ltd.
- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240128225
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Hajung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT
- Publication number 20230395524
- Publication date Dec 7, 2023
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230207432
- Publication date Jun 29, 2023
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE MEMBER AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20230100980
- Publication date Mar 30, 2023
- SAMSUNG DISPLAY CO., LTD.
- Hong Am KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139856
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139857
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC AND METALLIC NANOWIRE BOND LAYERS
- Publication number 20220102307
- Publication date Mar 31, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Scott Robert SUMMERFELT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE MEMBER AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20210407957
- Publication date Dec 30, 2021
- SAMSUNG DISPLAY CO., LTD.
- Hong Am KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND BONDING METHOD OF THE SAME
- Publication number 20210183980
- Publication date Jun 17, 2021
- Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Jianjun WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC AND METALLIC NANOWIRE BOND LAYERS
- Publication number 20200321304
- Publication date Oct 8, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Scott Robert SUMMERFELT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of Pre-Channeled Materials for Anisotropic Conductors
- Publication number 20200258859
- Publication date Aug 13, 2020
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20200144214
- Publication date May 7, 2020
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PRODUCING A THROUGH SEMICONDUCTOR VIA CONNECTION
- Publication number 20200006142
- Publication date Jan 2, 2020
- IMEC vzw
- Gaspard Hiblot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20190103374
- Publication date Apr 4, 2019
- Mitsubishi Electric Corporation
- Sho KUMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and Method for Immersion Bonding
- Publication number 20170330855
- Publication date Nov 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, DISPLAY PANEL, DISPLAY DEVICE, ELECTRONIC DEV...
- Publication number 20170117262
- Publication date Apr 27, 2017
- SONY CORPORATION
- JUN SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-CONDUCTIVITY BONDING OF METAL NANOWIRE ARRAYS
- Publication number 20160372438
- Publication date Dec 22, 2016
- Northrop Grumman Systems Corporation
- John A. Starkovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES
- Publication number 20160300824
- Publication date Oct 13, 2016
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140367701
- Publication date Dec 18, 2014
- Mitsubishi Electrict Corporation
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACK PROTECTION SEAL
- Publication number 20140264762
- Publication date Sep 18, 2014
- GLOBAL FOUNDRIES SINGAPORE PTE LTD.
- Ranjan RAJOO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTERCONNECT STRUCTURES WITH POLYMER CORE
- Publication number 20140264910
- Publication date Sep 18, 2014
- Sandeep Razdan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor Device and Manufacturing Method Thereof
- Publication number 20140252576
- Publication date Sep 11, 2014
- Hitachi, Ltd
- Hisashi Tanie
- H01 - BASIC ELECTRIC ELEMENTS

being disposed next to each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Selective transfer of micro devices

Use of pre-channeled materials for anisotropic conductors

Integration and bonding of micro-devices into system substrate

Adhesive member and display device including the same

Dielectric and metallic nanowire bond layers

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Semiconductor device and method for manufacturing the same

Semiconductor devices and methods of making the same

Adhesive member and display device including the same

Semiconductor wafer and method of manufacturing the same

Selective micro device transfer to receiver substrate

Semiconductor structure having a dielectric layer edge covering cir...

Dielectric and metallic nanowire bond layers

Use of pre-channeled materials for anisotropic conductors

Display panel and bonding method of the same

Method and apparatus for creating a bond between objects based on f...

Integration and bonding of micro-devices into system substrate

Method for producing a through semiconductor via connection

Optical non-destructive inspection method and optical non-destructi...

Semiconductor devices and methods of making the same

Anisotropic conductive film

Anisotropic conductive film

Anisotropic conductive film and method for manufacturing the same

Power semiconductor device having void filled with resin

Method for cohesively connecting a first component of a power semic...

Semiconductor device, display panel, display device, and electronic...

Patents Applicationslast 30 patents

HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...

USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS

SELECTIVE TRANSFER OF MICRO DEVICES

THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND ME...

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

ADHESIVE MEMBER AND DISPLAY DEVICE INCLUDING THE SAME

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

DIELECTRIC AND METALLIC NANOWIRE BOND LAYERS

ADHESIVE MEMBER AND DISPLAY DEVICE INCLUDING THE SAME

DISPLAY PANEL AND BONDING METHOD OF THE SAME

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

DIELECTRIC AND METALLIC NANOWIRE BOND LAYERS

Use of Pre-Channeled Materials for Anisotropic Conductors

ANISOTROPIC CONDUCTIVE FILM

METHOD FOR PRODUCING A THROUGH SEMICONDUCTOR VIA CONNECTION

POWER SEMICONDUCTOR DEVICE

System and Method for Immersion Bonding

SEMICONDUCTOR DEVICE, DISPLAY PANEL, DISPLAY DEVICE, ELECTRONIC DEV...

HIGH-CONDUCTIVITY BONDING OF METAL NANOWIRE ARRAYS

HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

WAFER STACK PROTECTION SEAL

INTERCONNECT STRUCTURES WITH POLYMER CORE

Semiconductor Device and Manufacturing Method Thereof