Membership
Tour
Register
Log in
being disposed on at least two different sides of the body
Follow
Industry
CPC
H01L2224/2518
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/2518
being disposed on at least two different sides of the body
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Package stacking using chip to wafer bonding
Patent number
11,955,462
Issue date
Apr 9, 2024
Intel Corporation
Georg Seidemann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,948,891
Issue date
Apr 2, 2024
NEPES CO., LTD.
Sang Yong Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die and package structure
Patent number
11,948,904
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring substrate, semiconductor package having the wiring substrate...
Patent number
11,908,783
Issue date
Feb 20, 2024
Amkor Technology Singapore Holding Pte Ltd.
Naoki Hayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,908,759
Issue date
Feb 20, 2024
Mediatek Inc.
Nan-Cheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing optoelectronic semiconductor devices and optoe...
Patent number
11,881,544
Issue date
Jan 23, 2024
OSRAM OLED GmbH
Markus Pindl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and method of manufacturing the same
Patent number
11,862,587
Issue date
Jan 2, 2024
Advanced Semiconductor Engineering, Inc.
Mark Gerber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Asymmetric stackup structure for SoC package substrates
Patent number
11,862,597
Issue date
Jan 2, 2024
Apple Inc.
Yikang Deng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with discrete blocks
Patent number
11,855,045
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Wen Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
Patent number
11,824,033
Issue date
Nov 21, 2023
Samsung Electronics Co., Ltd.
Gyoyoung Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposers for microelectronic devices
Patent number
11,824,010
Issue date
Nov 21, 2023
Micron Technology, Inc.
Owen Fay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
Patent number
11,817,445
Issue date
Nov 14, 2023
Taiwan Semiconductor Manufacturing Company
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and method of manufacturing the same
Patent number
11,804,461
Issue date
Oct 31, 2023
Advanced Semiconductor Engineering, Inc.
Yu-Ping Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
IPD modules with flexible connection scheme in packaging
Patent number
11,798,925
Issue date
Oct 24, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Chia Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for contacting and packetising a semiconductor chip
Patent number
11,749,638
Issue date
Sep 5, 2023
Technische Universität Chemnitz
Johannes Rudolph
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure with warpage-control element
Patent number
11,721,659
Issue date
Aug 8, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Jan Pei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Arrangement with central carrier and two opposing layer stacks, com...
Patent number
11,670,613
Issue date
Jun 6, 2023
AT&S (China) Co. Ltd.
Mikael Tuominen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display with embedded pixel driver chips
Patent number
11,670,626
Issue date
Jun 6, 2023
Hsin-Hua Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked chip package and methods of manufacture thereof
Patent number
11,664,349
Issue date
May 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged die and RDL with bonding structures therebetween
Patent number
11,640,958
Issue date
May 2, 2023
Taiwan Semiconductor Manufacturing Company
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
Patent number
11,605,609
Issue date
Mar 14, 2023
General Electric Company
Arun Virupaksha Gowda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device including semiconductor chips and method for producing such...
Patent number
11,569,186
Issue date
Jan 31, 2023
Infineon Technologies AG
Petteri Palm
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
Patent number
11,552,038
Issue date
Jan 10, 2023
Samsung Electronics Co., Ltd.
Gyoyoung Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and method of making the same
Patent number
11,552,014
Issue date
Jan 10, 2023
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Che-Wei Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded packaging module and manufacturing method for the same
Patent number
11,552,039
Issue date
Jan 10, 2023
Delta Electronics (Shanghai) Co., Ltd.
Zengsheng Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor sub-assembly and semiconductor power module
Patent number
11,538,765
Issue date
Dec 27, 2022
Hyundai Motor Company
Hiyoshi Michiaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing optoelectronic semiconductor devices and optoe...
Patent number
11,508,884
Issue date
Nov 22, 2022
OSRAM OLED GmbH
Markus Pindl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure including a first die and a second die and a brid...
Patent number
11,482,497
Issue date
Oct 25, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,456,268
Issue date
Sep 27, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Jung-Hua Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure with landing pads and manufacturing...
Patent number
11,437,336
Issue date
Sep 6, 2022
Powertech Technology Inc.
Jeffrey Wang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...
Publication number
20240128208
Publication date
Apr 18, 2024
nD-HI Technologies Lab, Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSERS FOR MICROELECTRONIC DEVICES
Publication number
20240120283
Publication date
Apr 11, 2024
Micron Technology, Inc.
Owen Fay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240063163
Publication date
Feb 22, 2024
Advanced Semiconductor Engineering, Inc.
Yu-Pin TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY WITH EMBEDDED PIXEL DRIVER CHIPS
Publication number
20230387097
Publication date
Nov 30, 2023
Apple Inc.
Hsin-Hua Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IPD Modules with Flexible Connection Scheme in Packaging
Publication number
20230369303
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Chia Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
Publication number
20230335525
Publication date
Oct 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hao-Jan PEI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
Publication number
20230253395
Publication date
Aug 10, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
Publication number
20230170319
Publication date
Jun 1, 2023
INFINEON TECHNOLOGIES AG
Petteri PALM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20230133567
Publication date
May 4, 2023
Samsung Electronics Co., Ltd.
Gyoyoung JUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH DIE ATTACH FILM CONNECTIONS
Publication number
20230087367
Publication date
Mar 23, 2023
Intel Corporation
Xiaoxuan Sun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS CORE WITH CAVITY STRUCTURE FOR HETEROGENEOUS PACKAGING ARCHIT...
Publication number
20230085411
Publication date
Mar 16, 2023
Intel Corporation
Sameer Paital
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20230065405
Publication date
Mar 2, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Chih Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME
Publication number
20230036283
Publication date
Feb 2, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE
Publication number
20230005962
Publication date
Jan 5, 2023
LG Display Co., Ltd.
Chang Ho LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSERS FOR MICROELECTRONIC DEVICES
Publication number
20220254723
Publication date
Aug 11, 2022
Micron Technology, Inc.
Owen Fay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE INCLUDING A FIRST DIE AND A SECOND DIE AND A BRID...
Publication number
20220223534
Publication date
Jul 14, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE AND PACKAGE STRUCTURE
Publication number
20220208711
Publication date
Jun 30, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Contacting and Packetising a Semiconductor Chip
Publication number
20220181291
Publication date
Jun 9, 2022
TECHNISCHE UNIVERSITAT CHEMNITZ
Johannes Rudolph
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ON PACKAGE STRUCTURE
Publication number
20220173083
Publication date
Jun 2, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Dong-Han Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20220130786
Publication date
Apr 28, 2022
Samsung Electronics Co., Ltd.
Gyoyoung JUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STACKING USING CHIP TO WAFER BONDING
Publication number
20220108976
Publication date
Apr 7, 2022
Intel Corporation
Georg SEIDEMANN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE...
Publication number
20220044991
Publication date
Feb 10, 2022
Amkor Technology Singapore Holding Pte. Ltd
Naoki HAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED COMPONENT AND PORWER SWITCHING DEVICE
Publication number
20220005795
Publication date
Jan 6, 2022
Huawei Technologies Co., Ltd
Zhixiang HU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20210407951
Publication date
Dec 30, 2021
Advanced Semiconductor Engineering, Inc.
Yu-Ping TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IPD Modules with Flexible Connection Scheme in Packaging
Publication number
20210375840
Publication date
Dec 2, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Chia Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20210343674
Publication date
Nov 4, 2021
Powertech Technology Inc.
Jeffrey Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING A SEMICONDUCTOR...
Publication number
20210335739
Publication date
Oct 28, 2021
Thomas Feil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
Publication number
20210327840
Publication date
Oct 21, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Hao-Jan PEI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20210313274
Publication date
Oct 7, 2021
NEPES CO., LTD.
Sang Yong PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20210305226
Publication date
Sep 30, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Chung-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS