being elliptic

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CPC
H01L2224/45016

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45016being elliptic

Industries

Patents Grantslast 30 patents

Information Patent Grant
Coated wire
- Patent number 10,960,498
- Issue date Mar 30, 2021
- Heraeus Materials Singapore Pte., Ltd.
- Il Tae Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming shielded radio-frequency modules having reduced...
- Patent number 10,446,503
- Issue date Oct 15, 2019
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded radio-frequency module having reduced area
- Patent number 9,761,537
- Issue date Sep 12, 2017
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core-jacket bonding wire
- Patent number 9,236,166
- Issue date Jan 12, 2016
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Connecting wire and method for manufacturing same
- Patent number 8,450,611
- Issue date May 28, 2013
- Heraeus Materials Technology GmbH & Co. KG
- Rainer Dohle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Release resistant electrical interconnections for MEMS devices
- Patent number 6,858,943
- Issue date Feb 22, 2005
- Sandia Corporation
- Kenneth A. Peterson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wirebonding insulated wire
- Patent number 6,854,637
- Issue date Feb 15, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Fuaida Harun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD FOR BONDED BODY, BONDED BODY, MANUFACTURING ME...
- Publication number 20240339368
- Publication date Oct 10, 2024
- FUJIFILM CORPORATION
- Atsushi NAKAMURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DEVICES RELATED TO SHIELDED RADIO-FREQUENCY MODULES HAVING REDUCED...
- Publication number 20200161255
- Publication date May 21, 2020
- SKYWORKS SOLUTIONS, INC.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC RIBBON FOR POWER MODULE PACKAGING
- Publication number 20180076167
- Publication date Mar 15, 2018
- WIRE TECHNOLOGY CO., LTD.
- Chien-Hsun CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SHIELDED RADIO-FREQUENCY MODULES HAVING REDUCED...
- Publication number 20180005958
- Publication date Jan 4, 2018
- SKYWORKS SOLUTIONS, INC.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED RADIO-FREQUENCY MODULE HAVING REDUCED AREA
- Publication number 20160093577
- Publication date Mar 31, 2016
- SKYWORKS SOLUTIONS, INC.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR ELECTRONIC ASSEMBLY WITH IMPROVED INTERCONNECT AND AS...
- Publication number 20140264783
- Publication date Sep 18, 2014
- Altera Corporation
- Hui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140239359
- Publication date Aug 28, 2014
- Tsuyoshi Seto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE-JACKET BONDING WIRE
- Publication number 20130213689
- Publication date Aug 22, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
CONNECTING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20100108359
- Publication date May 6, 2010
- Rainer Dohle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Center Conductor to Integrated Circuit for High Frequency Applications
- Publication number 20090079042
- Publication date Mar 26, 2009
- AGILENT TECHNOLOGIES, INC.
- Jim Clatterbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE AND CIRCUIT SYSTEM
- Publication number 20090045444
- Publication date Feb 19, 2009
- Holger Huebner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding wire and bond using a bonding wire
- Publication number 20080061450
- Publication date Mar 13, 2008
- Manfred Reinold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wirebonding insulated wire
- Publication number 20040164126
- Publication date Aug 26, 2004
- Fuaida Harun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

being elliptic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Coated wire

Methods for forming shielded radio-frequency modules having reduced...

Shielded radio-frequency module having reduced area

Core-jacket bonding wire

Connecting wire and method for manufacturing same

Release resistant electrical interconnections for MEMS devices

Wirebonding insulated wire

Patents Applicationslast 30 patents

MANUFACTURING METHOD FOR BONDED BODY, BONDED BODY, MANUFACTURING ME...

DEVICES RELATED TO SHIELDED RADIO-FREQUENCY MODULES HAVING REDUCED...

METALLIC RIBBON FOR POWER MODULE PACKAGING

METHODS FOR FORMING SHIELDED RADIO-FREQUENCY MODULES HAVING REDUCED...

SHIELDED RADIO-FREQUENCY MODULE HAVING REDUCED AREA

APPARATUS FOR ELECTRONIC ASSEMBLY WITH IMPROVED INTERCONNECT AND AS...

SEMICONDUCTOR DEVICE

CORE-JACKET BONDING WIRE

CONNECTING WIRE AND METHOD FOR MANUFACTURING SAME

Center Conductor to Integrated Circuit for High Frequency Applications

INTEGRATED DEVICE AND CIRCUIT SYSTEM

Bonding wire and bond using a bonding wire

Wirebonding insulated wire