being formed on an item to be connected not being a semiconductor or solid-state body

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H01L2224/26152

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/26152being formed on an item to be connected not being a semiconductor or solid-state body

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Patents Grantslast 30 patents

Information Patent Grant
Display panel, preparation method thereof, and display device
- Patent number 12,033,974
- Issue date Jul 9, 2024
- Shanghai Tianma Micro-Electronics Co,. Ltd.
- Quanpeng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film in substrate for releasing z stack-up constraint
- Patent number 12,027,496
- Issue date Jul 2, 2024
- Intel Corporation
- Jianfeng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor component and method for producing a power semi...
- Patent number 11,955,402
- Issue date Apr 9, 2024
- Vitesco Technologies GbmH
- Christina Quest-Matt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 9,373,562
- Issue date Jun 21, 2016
- Toyota Jidosha Kabushiki Kaisha
- Shoji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,673,688
- Issue date Mar 18, 2014
- Samsung Electronics Co., Ltd.
- Wonkeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate anchor structure and method
- Patent number 8,361,598
- Issue date Jan 29, 2013
- International Business Machines Corporation
- Timothy Harrison Daubenspeck
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wiring substrate and display device including the same
- Patent number 8,013,454
- Issue date Sep 6, 2011
- Sharp Kabushiki Kaisha
- Kenichi Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate anchor structure and method
- Patent number 7,935,408
- Issue date May 3, 2011
- International Business Machines Corporation
- Timothy Harrison Daubenspeck
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Submounts with Stud Protrusions for Semiconductor Packages
- Publication number 20250038055
- Publication date Jan 30, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-SUBSTRATE INTERFACE INCLUDING LOCKING FEATURES
- Publication number 20250015044
- Publication date Jan 9, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hao YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE TRANSFER FILM AND METHOD FOR MANUFACTURING POWER MODULE SU...
- Publication number 20230178509
- Publication date Jun 8, 2023
- AMOSENSE CO., LTD.
- Younghwan JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH DIRECT ATTACH TO CIRCUIT BOARDS
- Publication number 20230082706
- Publication date Mar 16, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM IN SUBSTRATE FOR RELEASING Z STACK-UP CONSTRAINT
- Publication number 20220093568
- Publication date Mar 24, 2022
- Intel Corporation
- Jianfeng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE
- Publication number 20220052022
- Publication date Feb 17, 2022
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Quanpeng YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150270191
- Publication date Sep 24, 2015
- Toyota Jidosha Kabushiki Kaisha
- Shoji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package And Method Of Manufacturing The Same
- Publication number 20120100671
- Publication date Apr 26, 2012
- Samsung Electronics Co., Ltd.
- Wonkeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ANCHOR STRUCTURE AND METHOD
- Publication number 20110100685
- Publication date May 5, 2011
- International Business Machines Corporation
- Timothy Harrison Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20090153765
- Publication date Jun 18, 2009
- Sharp Kabushiki Kaisha
- Kenichi Yamashita
- G02 - OPTICS
Information Patent Application
SUBSTRATE ANCHOR STRUCTURE AND METHOD
- Publication number 20090110881
- Publication date Apr 30, 2009
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20090039495
- Publication date Feb 12, 2009
- Sharp Kabushiki Kaisha
- Kenichi Yamashita
- G02 - OPTICS

being formed on an item to be connected not being a semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display panel, preparation method thereof, and display device

Film in substrate for releasing z stack-up constraint

Power semiconductor component and method for producing a power semi...

Semiconductor device and method of manufacturing semiconductor device

Semiconductor package and method of manufacturing the same

Substrate anchor structure and method

Wiring substrate and display device including the same

Substrate anchor structure and method

Patents Applicationslast 30 patents

Submounts with Stud Protrusions for Semiconductor Packages

DIE-SUBSTRATE INTERFACE INCLUDING LOCKING FEATURES

ADHESIVE TRANSFER FILM AND METHOD FOR MANUFACTURING POWER MODULE SU...

MICROELECTRONIC ASSEMBLIES WITH DIRECT ATTACH TO CIRCUIT BOARDS

FILM IN SUBSTRATE FOR RELEASING Z STACK-UP CONSTRAINT

DISPLAY PANEL, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Package And Method Of Manufacturing The Same

SUBSTRATE ANCHOR STRUCTURE AND METHOD

WIRING SUBSTRATE AND DISPLAY DEVICE INCLUDING THE SAME

SUBSTRATE ANCHOR STRUCTURE AND METHOD

WIRING SUBSTRATE AND DISPLAY DEVICE INCLUDING THE SAME