being formed on an item to be connected not being a semiconductor or solid-state body

Industry

CPC
H01L2224/10152

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/10152being formed on an item to be connected not being a semiconductor or solid-state body

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Corner guard for improved electroplated first level interconnect bu...
- Patent number 11,776,864
- Issue date Oct 3, 2023
- Intel Corporation
- Jacob Vehonsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with conductive underfill ground plane
- Patent number 11,270,972
- Issue date Mar 8, 2022
- NXP B.V.
- Nishant Lakhera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-forming film, semiconductor device and manufacturing method th...
- Patent number 10,943,879
- Issue date Mar 9, 2021
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
All intermetallic compound with stand off feature and method to make
- Patent number 9,793,232
- Issue date Oct 17, 2017
- International Business Machines Corporation
- Charles L. Arvin
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Packaging structures and methods for semiconductor devices
- Patent number 8,847,369
- Issue date Sep 30, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chih Yew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 8,076,769
- Issue date Dec 13, 2011
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, connecting member, method for manufacturing a...
- Patent number 7,791,197
- Issue date Sep 7, 2010
- Fujitsu Limited
- Daisuke Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device with reduced damage t...
- Patent number 7,615,474
- Issue date Nov 10, 2009
- Seiko Epson Corporation
- Yasunori Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240371739
- Publication date Nov 7, 2024
- Advanced Semiconductor Engineering, Inc.
- Pin-Yao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METH...
- Publication number 20240282733
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORNER GUARD FOR IMPROVED ELECTROPLATED FIRST LEVEL INTERCONNECT BU...
- Publication number 20210020532
- Publication date Jan 21, 2021
- Intel Corporation
- Jacob VEHONSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH CONDUCTIVE UNDERFILL GROUND PLANE
- Publication number 20200395332
- Publication date Dec 17, 2020
- NXP USA, Inc.
- Nishant Lakhera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP-FORMING FILM, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD TH...
- Publication number 20180218990
- Publication date Aug 2, 2018
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN EMBEDDED PACKAGES, METHODS OF FABRICATING THE SAME, ELECTRONIC...
- Publication number 20150145121
- Publication date May 28, 2015
- SK HYNIX INC.
- Seung Jee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Metal Bump Die Assembly
- Publication number 20140193952
- Publication date Jul 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structures and Methods for Semiconductor Devices
- Publication number 20140021594
- Publication date Jan 23, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20090243092
- Publication date Oct 1, 2009
- Fujitsu Microelectronics Limited
- Takao NISHIMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTED ON SUBSTRATE, AND MANUFACTURING METHOD...
- Publication number 20080224309
- Publication date Sep 18, 2008
- NEC Corporation
- Eiji Hori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, connecting member, method for manufacturing a...
- Publication number 20080197492
- Publication date Aug 21, 2008
- FUJITSU LIMITED
- Daisuke Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20080119045
- Publication date May 22, 2008
- SEIKO EPSON CORPORATION
- Yasunori Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS

being formed on an item to be connected not being a semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Corner guard for improved electroplated first level interconnect bu...

Package with conductive underfill ground plane

Bump-forming film, semiconductor device and manufacturing method th...

All intermetallic compound with stand off feature and method to make

Packaging structures and methods for semiconductor devices

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device, connecting member, method for manufacturing a...

Method for manufacturing semiconductor device with reduced damage t...

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE

SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METH...

CORNER GUARD FOR IMPROVED ELECTROPLATED FIRST LEVEL INTERCONNECT BU...

PACKAGE WITH CONDUCTIVE UNDERFILL GROUND PLANE

BUMP-FORMING FILM, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD TH...

THIN EMBEDDED PACKAGES, METHODS OF FABRICATING THE SAME, ELECTRONIC...

Methods for Metal Bump Die Assembly

Packaging Structures and Methods for Semiconductor Devices

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MOUNTED ON SUBSTRATE, AND MANUFACTURING METHOD...

Semiconductor device, connecting member, method for manufacturing a...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE