being formed on an item to be connected not being a semiconductor or solid-state body

Follow

Industry

CPC
H01L2224/24996

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/24996being formed on an item to be connected not being a semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,908,819
- Issue date Feb 20, 2024
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronics package and method of manufacturing thereof
- Patent number 10,700,035
- Issue date Jun 30, 2020
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230386949
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Jiyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20180130762
- Publication date May 10, 2018
- GENERAL ELECTRIC COMPANY
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS