being formed on an item to be connected not being a semiconductor or solid-state body

Follow

Industry

CPC
H01L2224/48996

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48996being formed on an item to be connected not being a semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit package...
- Patent number 10,727,085
- Issue date Jul 28, 2020
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit delamina...
- Patent number 10,347,508
- Issue date Jul 9, 2019
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relief layer providing high thermal conduction for a semicon...
- Patent number 5,134,463
- Issue date Jul 28, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuji Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for welding by means of laser light
- Patent number 4,697,061
- Issue date Sep 29, 1987
- Siemens Aktiengesellschaft
- Lothar Spaeter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT FOR IC PACKAGE
- Publication number 20230170285
- Publication date Jun 1, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann Merto Camenforte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE PACKAGE HAVING A SMALL LIGHT EMITTING SURFACE
- Publication number 20220077353
- Publication date Mar 10, 2022
- Tek Beng LOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE HIGH PACKAGE PRESSURE SEMICONDUCTOR PACKAGE
- Publication number 20120326323
- Publication date Dec 27, 2012
- MICROSEMI CORPORATION
- Tracy Autry
- H01 - BASIC ELECTRIC ELEMENTS