being formed on the semiconductor or solid-state body to be connected

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/26122being formed on the semiconductor or solid-state body to be connected

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Patents Grantslast 30 patents

Information Patent Grant
Display panel, preparation method thereof, and display device
- Patent number 12,033,974
- Issue date Jul 9, 2024
- Shanghai Tianma Micro-Electronics Co,. Ltd.
- Quanpeng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die with metallized sidewall and method of manufacturing
- Patent number 10,535,588
- Issue date Jan 14, 2020
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside spacer structures for improved thermal performance
- Patent number 10,153,224
- Issue date Dec 11, 2018
- GLOBALFOUNDRIES Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of integrated-circuit chips and electronic device
- Patent number 9,401,349
- Issue date Jul 26, 2016
- STMicroelectronics (Grenoble 2) SAS
- Angelo Crobu
- G01 - MEASURING TESTING
Information Patent Grant
Escape routes
- Patent number 9,171,809
- Issue date Oct 27, 2015
- Flextronics AP, LLC
- Omar Garcia Lopez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,673,688
- Issue date Mar 18, 2014
- Samsung Electronics Co., Ltd.
- Wonkeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,410,615
- Issue date Apr 2, 2013
- Hitachi, Ltd.
- Mayu Aoki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046747
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...
- Publication number 20240387438
- Publication date Nov 21, 2024
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230402424
- Publication date Dec 14, 2023
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL
- Publication number 20230378124
- Publication date Nov 23, 2023
- Intel Corporation
- Frederick Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230299247
- Publication date Sep 21, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dong Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE
- Publication number 20220052022
- Publication date Feb 17, 2022
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Quanpeng YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AN ELECTRONIC DEVICE
- Publication number 20210125957
- Publication date Apr 29, 2021
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean BRUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND COMMUNICATIONS DEVICE
- Publication number 20200294892
- Publication date Sep 17, 2020
- Huawei Technologies Co., Ltd
- Kairong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WITH METALLIZED SIDEWALL AND METHOD OF MANUFACTURING
- Publication number 20180204786
- Publication date Jul 19, 2018
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE SPACER STRUCTURES FOR IMPROVED THERMAL PERFORMANCE
- Publication number 20180076110
- Publication date Mar 15, 2018
- GLOBALFOUNDRIES INC.
- Rahul AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK OF INTEGRATED-CIRCUIT CHIPS AND ELECTRONIC DEVICE
- Publication number 20150364455
- Publication date Dec 17, 2015
- STMicroelectronics (Grenoble 2) SAS
- Angelo Crobu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING SEMICONDUCTOR SENSOR DEVICE
- Publication number 20150235980
- Publication date Aug 20, 2015
- MITSUMI ELECTRIC CO., LTD.
- Shinya YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESCAPE ROUTES
- Publication number 20140312479
- Publication date Oct 23, 2014
- FLEXTRONICS AP, LLC
- Omar Garcia Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package And Method Of Manufacturing The Same
- Publication number 20120100671
- Publication date Apr 26, 2012
- Samsung Electronics Co., Ltd.
- Wonkeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120068355
- Publication date Mar 22, 2012
- Hitachi, Ltd.
- Mayu Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CHIP AND SUBSTRATE PROVIDING INSULATION PROTECTION BETWE...
- Publication number 20110103034
- Publication date May 5, 2011
- Yao-Sheng Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI CHIP STACKING WITH RELIABLE JOINING
- Publication number 20100129961
- Publication date May 27, 2010
- International Business Machines Corporation
- AKIHIRO HORIBE
- H01 - BASIC ELECTRIC ELEMENTS

being formed on the semiconductor or solid-state body to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display panel, preparation method thereof, and display device

Die with metallized sidewall and method of manufacturing

Backside spacer structures for improved thermal performance

Stack of integrated-circuit chips and electronic device

Escape routes

Semiconductor package and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...

SEMICONDUCTOR PACKAGE

MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

DISPLAY PANEL, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE

METHOD FOR FABRICATING AN ELECTRONIC DEVICE

PACKAGE STRUCTURE AND COMMUNICATIONS DEVICE

DIE WITH METALLIZED SIDEWALL AND METHOD OF MANUFACTURING

BACKSIDE SPACER STRUCTURES FOR IMPROVED THERMAL PERFORMANCE

STACK OF INTEGRATED-CIRCUIT CHIPS AND ELECTRONIC DEVICE

METHOD FOR MOUNTING SEMICONDUCTOR SENSOR DEVICE

ESCAPE ROUTES

Semiconductor Package And Method Of Manufacturing The Same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC CHIP AND SUBSTRATE PROVIDING INSULATION PROTECTION BETWE...

MULTI CHIP STACKING WITH RELIABLE JOINING