being formed on the semiconductor or solid-state body to be connected

Follow

Industry

CPC
H01L2224/48991

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48991being formed on the semiconductor or solid-state body to be connected

Industries

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board structure having pads and conductive wire
- Patent number 11,069,646
- Issue date Jul 20, 2021
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,978,419
- Issue date Apr 13, 2021
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing the same
- Patent number 10,643,969
- Issue date May 5, 2020
- Mitsubishi Electric Corporation
- Yusaku Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating chip elements provided with wire insertion g...
- Patent number 8,258,044
- Issue date Sep 4, 2012
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR EQUIPMENT
- Publication number 20240047438
- Publication date Feb 8, 2024
- Rohm Co., Ltd.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210111145
- Publication date Apr 15, 2021
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD STRUCTURE HAVING PADS AND CONDUCTIVE WIRE
- Publication number 20210098413
- Publication date Apr 1, 2021
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190043827
- Publication date Feb 7, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Yusaku ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING CHIP ELEMENTS PROVIDED WITH WIRE INSERTION G...
- Publication number 20110287606
- Publication date Nov 24, 2011
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS