being formed on the semiconductor or solid-state body to be connected

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H01L2224/10122

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/10122being formed on the semiconductor or solid-state body to be connected

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic package structure and method for manufacturing the same
- Patent number 11,935,855
- Issue date Mar 19, 2024
- Advanced Semiconductor Engineering, Inc.
- Wei-Jen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with capillary flow structures for direct chip at...
- Patent number 11,923,332
- Issue date Mar 5, 2024
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution structures for semiconductor packages and methods of...
- Patent number 11,923,207
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving substrate and manufacturing method thereof, and micro LED b...
- Patent number 11,894,353
- Issue date Feb 6, 2024
- BOE Technology Group Co., Ltd.
- Zhiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,776,838
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising interconnect structures having an inne...
- Patent number 11,676,922
- Issue date Jun 13, 2023
- QUALCOMM Incorporated
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution structures for semiconductor packages and methods of...
- Patent number 11,670,519
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally and electrically conductive interconnects
- Patent number 11,637,068
- Issue date Apr 25, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Anthony K. Stamper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages having a die with an enca...
- Patent number 11,315,891
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with capillary flow structures for direct chip at...
- Patent number 11,264,349
- Issue date Mar 1, 2022
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, manufacturing method of semiconductor device...
- Patent number 11,177,156
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,127,703
- Issue date Sep 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution structures for semiconductor packages and methods of...
- Patent number 11,062,915
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,037,897
- Issue date Jun 15, 2021
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing same
- Patent number 10,964,656
- Issue date Mar 30, 2021
- Nepes Co., Ltd.
- Yong Tae Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,510,700
- Issue date Dec 17, 2019
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondcutor device and manufacturing method thereof
- Patent number 10,276,528
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,685,419
- Issue date Jun 20, 2017
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,466,583
- Issue date Oct 11, 2016
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly having a heat spreader for a plurality of die
- Patent number 9,431,380
- Issue date Aug 30, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Tab A. Stephens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly having a heat spreader for a plurality of die
- Patent number 9,070,653
- Issue date Jun 30, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Tab A. Stephens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure, semiconductor structure and method of manufacturing a se...
- Patent number 9,000,585
- Issue date Apr 7, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip capable of improving mounting reliability and se...
- Patent number 8,836,054
- Issue date Sep 16, 2014
- SK Hynix Inc.
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mock bump system for flip chip integrated circuits
- Patent number 8,633,586
- Issue date Jan 21, 2014
- Stats Chippac Ltd.
- Oh Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,436,467
- Issue date May 7, 2013
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with mechanically decoupled ball connections
- Patent number 8,324,695
- Issue date Dec 4, 2012
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Stephane Caplet
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure, semiconductor structure and method of manufacturing a se...
- Patent number 8,114,767
- Issue date Feb 14, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable width resilient conductive contact structures
- Patent number 7,435,108
- Issue date Oct 14, 2008
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Grant
Wafer scale thin film package
- Patent number 7,348,261
- Issue date Mar 25, 2008
- International Business Machines Corporation
- David Vincent Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer scale thin film package
- Patent number 6,627,998
- Issue date Sep 30, 2003
- International Business Machines Corporation
- David Vincent Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BUMP STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20240047397
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Yu CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230360949
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Structures for Semiconductor Packages and Methods of...
- Publication number 20230268196
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, MODULE, AND METHOD OF MANUFACTURING ELECTRONI...
- Publication number 20230197632
- Publication date Jun 22, 2023
- Murata Manufacturing Co., Ltd.
- Ryohei OKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230163091
- Publication date May 25, 2023
- Advanced Semiconductor Engineering, Inc.
- Wei-Jen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Semiconductor Packages Having a Die with an Enca...
- Publication number 20220246559
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH CAPILLARY FLOW STRUCTURES FOR DIRECT CHIP AT...
- Publication number 20220108970
- Publication date Apr 7, 2022
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220076982
- Publication date Mar 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Structures for Semiconductor Packages and Methods of...
- Publication number 20210327726
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH CAPILLARY FLOW STRUCTURES FOR DIRECT CHIP AT...
- Publication number 20210193610
- Publication date Jun 24, 2021
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING INTERCONNECT STRUCTURES HAVING AN INNE...
- Publication number 20210125951
- Publication date Apr 29, 2021
- QUALCOMM Incorporated
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND MICRO LED B...
- Publication number 20210091057
- Publication date Mar 25, 2021
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhiwei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE...
- Publication number 20210057259
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20200098713
- Publication date Mar 26, 2020
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20190378807
- Publication date Dec 12, 2019
- NEPES CO., LTD.
- Yong Tae KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Structures for Semiconductor Packages and Methods of...
- Publication number 20190304803
- Publication date Oct 3, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20190295972
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20190229081
- Publication date Jul 25, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190027452
- Publication date Jan 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20180301429
- Publication date Oct 18, 2018
- ROHM CO., LTD.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20150325541
- Publication date Nov 12, 2015
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20140332954
- Publication date Nov 13, 2014
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY HAVING A HEAT SPREADER FOR A PLURALITY OF DIE
- Publication number 20140197541
- Publication date Jul 17, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Tab A. STEPHENS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20130256881
- Publication date Oct 3, 2013
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED DEVICE
- Publication number 20130234251
- Publication date Sep 12, 2013
- LAPIS Semiconductor Co., Ltd.
- Chikashi FUCHIGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20120153410
- Publication date Jun 21, 2012
- Hynix Semiconductor Inc.
- Kwon Whan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE, SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING A SE...
- Publication number 20120104600
- Publication date May 3, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH MECHANICALLY DECOUPLED BALL CONNECTIONS
- Publication number 20100244246
- Publication date Sep 30, 2010
- COMMISS. A L'ENERGIE ATOM. ET AUX ENER. ALTERN.
- Stephane Caplet
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100187685
- Publication date Jul 29, 2010
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOCK BUMP SYSTEM FOR FLIP CHIP INTEGRATED CIRCUITS
- Publication number 20090243091
- Publication date Oct 1, 2009
- Oh Han Kim
- H01 - BASIC ELECTRIC ELEMENTS

being formed on the semiconductor or solid-state body to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic package structure and method for manufacturing the same

Semiconductor die with capillary flow structures for direct chip at...

Redistribution structures for semiconductor packages and methods of...

Driving substrate and manufacturing method thereof, and micro LED b...

Semiconductor package and manufacturing method thereof

Integrated device comprising interconnect structures having an inne...

Redistribution structures for semiconductor packages and methods of...

Thermally and electrically conductive interconnects

Methods of forming semiconductor packages having a die with an enca...

Semiconductor die with capillary flow structures for direct chip at...

Semiconductor package, manufacturing method of semiconductor device...

Semiconductor devices

Redistribution structures for semiconductor packages and methods of...

Semiconductor device

Semiconductor package and method of manufacturing same

Semiconductor device

Semicondcutor device and manufacturing method thereof

Semiconductor device

Semiconductor device

Microelectronic assembly having a heat spreader for a plurality of die

Microelectronic assembly having a heat spreader for a plurality of die

Structure, semiconductor structure and method of manufacturing a se...

Semiconductor chip capable of improving mounting reliability and se...

Mock bump system for flip chip integrated circuits

Semiconductor device

Electronic component with mechanically decoupled ball connections

Structure, semiconductor structure and method of manufacturing a se...

Variable width resilient conductive contact structures

Wafer scale thin film package

Wafer scale thin film package

Patents Applicationslast 30 patents

BUMP STRUCTURE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Redistribution Structures for Semiconductor Packages and Methods of...

ELECTRONIC COMPONENT, MODULE, AND METHOD OF MANUFACTURING ELECTRONI...

ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Methods of Forming Semiconductor Packages Having a Die with an Enca...

SEMICONDUCTOR DIE WITH CAPILLARY FLOW STRUCTURES FOR DIRECT CHIP AT...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Redistribution Structures for Semiconductor Packages and Methods of...

SEMICONDUCTOR DIE WITH CAPILLARY FLOW STRUCTURES FOR DIRECT CHIP AT...

INTEGRATED DEVICE COMPRISING INTERCONNECT STRUCTURES HAVING AN INNE...

DRIVING SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND MICRO LED B...

SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE...

Semiconductor Device

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

Redistribution Structures for Semiconductor Packages and Methods of...

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

SEMICONDUCTOR DEVICES

SEMICONDCUTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor Device

Semiconductor Device

Semiconductor Device

MICROELECTRONIC ASSEMBLY HAVING A HEAT SPREADER FOR A PLURALITY OF DIE

Semiconductor Device

SEMICONDUCTOR INTEGRATED DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING THE SAME

STRUCTURE, SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING A SE...

ELECTRONIC COMPONENT WITH MECHANICALLY DECOUPLED BALL CONNECTIONS

SEMICONDUCTOR DEVICE

MOCK BUMP SYSTEM FOR FLIP CHIP INTEGRATED CIRCUITS