being formed on the semiconductor or solid-state body

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H01L2224/02122

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/02122being formed on the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Face-to-face semiconductor device with fan-out porch
- Patent number 12,051,684
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face semiconductor device with fan-out porch
- Patent number 11,749,665
- Issue date Sep 5, 2023
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face semiconductor device with fan-out porch
- Patent number 11,456,289
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 11,239,191
- Issue date Feb 1, 2022
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with interconnect structure and method for pre...
- Patent number 11,177,194
- Issue date Nov 16, 2021
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,741,517
- Issue date Aug 11, 2020
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,204,878
- Issue date Feb 12, 2019
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,748,191
- Issue date Aug 29, 2017
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
3D chip-on-wafer-on-substrate structure with via last process
- Patent number 9,698,081
- Issue date Jul 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,508,630
- Issue date Nov 29, 2016
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,484,287
- Issue date Nov 1, 2016
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,484,286
- Issue date Nov 1, 2016
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
3D chip-on-wafer-on-substrate structure with via last process
- Patent number 9,449,837
- Issue date Sep 20, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die and method of forming noise absorbing regions bet...
- Patent number 9,236,352
- Issue date Jan 12, 2016
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip pad resistant to antenna effect and method
- Patent number 8,872,303
- Issue date Oct 28, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wu-Te Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,865,522
- Issue date Oct 21, 2014
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,803,312
- Issue date Aug 12, 2014
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and electronic device
- Patent number 8,787,033
- Issue date Jul 22, 2014
- Aisin Aw Co., Ltd.
- Hitoshi Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 8,785,318
- Issue date Jul 22, 2014
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 8,552,552
- Issue date Oct 8, 2013
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 8,552,555
- Issue date Oct 8, 2013
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,546,934
- Issue date Oct 1, 2013
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip pad resistant to antenna effect and method
- Patent number 8,470,705
- Issue date Jun 25, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wu-Te Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,202,786
- Issue date Jun 19, 2012
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection device and method for manufacturing the same
- Patent number 8,174,118
- Issue date May 8, 2012
- Sumitomo Electric Industries, Ltd
- Youichi Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip pad resistant to antenna effect and method
- Patent number 8,148,797
- Issue date Apr 3, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wu-Te Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die and method of forming noise absorbing regions bet...
- Patent number 8,093,151
- Issue date Jan 10, 2012
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device connection structure
- Patent number 7,501,708
- Issue date Mar 10, 2009
- International Business Machines Corporation
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,164,208
- Issue date Jan 16, 2007
- Matsushita Electric Industrial Co., Ltd.
- Kazuyuki Kainou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-capacitance bonding pad for semiconductor device
- Patent number 6,717,238
- Issue date Apr 6, 2004
- Industrial Technology Research Institute
- Ming-Dou Ker
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20240387499
- Publication date Nov 21, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20230420440
- Publication date Dec 28, 2023
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF AND POWER CONVERTER
- Publication number 20230253349
- Publication date Aug 10, 2023
- Mitsubishi Electric Corporation
- Yuji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20230013960
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20210202454
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE AND METHOD FOR PRE...
- Publication number 20210193559
- Publication date Jun 24, 2021
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20170338197
- Publication date Nov 23, 2017
- RENESAS ELECTRONICS CORPORATION
- Shinya SUZUKI
- G02 - OPTICS
Information Patent Application
3D Chip-On-Wafer-On-Substrate Structure With Via Last Process
- Publication number 20170005027
- Publication date Jan 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP-ON-WAFER-ON-SUBSTRATE STRUCTURE WITH VIA LAST PROCESS
- Publication number 20150325497
- Publication date Nov 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN EMBEDDED PACKAGES, METHODS OF FABRICATING THE SAME, ELECTRONIC...
- Publication number 20150145121
- Publication date May 28, 2015
- SK HYNIX INC.
- Seung Jee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20140312493
- Publication date Oct 23, 2014
- Shinya Suzuki
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20130344693
- Publication date Dec 26, 2013
- Renesas Electronics Corporation
- Shinya SUZUKI
- G02 - OPTICS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...
- Publication number 20130328183
- Publication date Dec 12, 2013
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Pad Resistant to Antenna Effect and Method
- Publication number 20130277860
- Publication date Oct 24, 2013
- Wu-Te Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...
- Publication number 20130228905
- Publication date Sep 5, 2013
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20130020701
- Publication date Jan 24, 2013
- Renesas Electronics Corporation
- Shinya SUZUKI
- G02 - OPTICS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...
- Publication number 20120248631
- Publication date Oct 4, 2012
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Pad Resistant to Antenna Effect and Method
- Publication number 20120156870
- Publication date Jun 21, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wu-Te Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
- Publication number 20120106116
- Publication date May 3, 2012
- AISIN AW CO., LTD.
- Hitoshi NAKAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die and Method of Forming Noise Absorbing Regions Bet...
- Publication number 20120091567
- Publication date Apr 19, 2012
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...
- Publication number 20120012994
- Publication date Jan 19, 2012
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die and Method of Forming Noise Absorbing Regions Bet...
- Publication number 20100230822
- Publication date Sep 16, 2010
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100171097
- Publication date Jul 8, 2010
- Sumitomo Electric Industries, Ltd.
- Youichi NAGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Pad Resistant to Antenna Effect and Method
- Publication number 20090321871
- Publication date Dec 31, 2009
- Wu-Te Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090184428
- Publication date Jul 23, 2009
- PANASONIC CORPORATION
- Tsuyoshi HAMATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20090121349
- Publication date May 14, 2009
- RENESAS TECHNOLOGY CORP.
- Shinya Suzuki
- G02 - OPTICS
Information Patent Application
MICROELECTRONIC DEVICE CONNECTION STRUCTURE
- Publication number 20080023851
- Publication date Jan 31, 2008
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20070072405
- Publication date Mar 29, 2007
- Matsushita Electric Industrial Co., Ltd.
- Kazuyuki Kainou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20050167832
- Publication date Aug 4, 2005
- Matsushita Electric Industrial Co., Ltd.
- Kazuyuki Kainou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-CAPACITANCE BONDING PAD FOR SEMICONDUCTOR DEVICE
- Publication number 20020017672
- Publication date Feb 14, 2002
- Ming-Dou Ker
- H01 - BASIC ELECTRIC ELEMENTS

being formed on the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Face-to-face semiconductor device with fan-out porch

Face-to-face semiconductor device with fan-out porch

Face-to-face semiconductor device with fan-out porch

Semiconductor device and a method of manufacturing the same

Semiconductor device with interconnect structure and method for pre...

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

3D chip-on-wafer-on-substrate structure with via last process

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

3D chip-on-wafer-on-substrate structure with via last process

Semiconductor die and method of forming noise absorbing regions bet...

Chip pad resistant to antenna effect and method

Method for manufacturing semiconductor devices having a glass subst...

Method for manufacturing semiconductor devices having a glass subst...

Electronic component and electronic device

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Method for manufacturing semiconductor devices having a glass subst...

Chip pad resistant to antenna effect and method

Method for manufacturing semiconductor devices having a glass subst...

Detection device and method for manufacturing the same

Chip pad resistant to antenna effect and method

Semiconductor die and method of forming noise absorbing regions bet...

Microelectronic device connection structure

Semiconductor device and method for manufacturing the same

Low-capacitance bonding pad for semiconductor device

Patents Applicationslast 30 patents

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF AND POWER CONVERTER

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE AND METHOD FOR PRE...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

3D Chip-On-Wafer-On-Substrate Structure With Via Last Process

3D CHIP-ON-WAFER-ON-SUBSTRATE STRUCTURE WITH VIA LAST PROCESS

THIN EMBEDDED PACKAGES, METHODS OF FABRICATING THE SAME, ELECTRONIC...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...

Chip Pad Resistant to Antenna Effect and Method

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...

Chip Pad Resistant to Antenna Effect and Method

ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

Semiconductor Die and Method of Forming Noise Absorbing Regions Bet...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...

Semiconductor Die and Method of Forming Noise Absorbing Regions Bet...

DETECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME

Chip Pad Resistant to Antenna Effect and Method

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

MICROELECTRONIC DEVICE CONNECTION STRUCTURE

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

LOW-CAPACITANCE BONDING PAD FOR SEMICONDUCTOR DEVICE