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H01L2224/85075

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85075being inert

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,840,208
- Issue date Nov 17, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu alloy bonding wire for semiconductor device
- Patent number 10,790,259
- Issue date Sep 29, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,672,733
- Issue date Jun 2, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,525,555
- Issue date Jan 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,497,663
- Issue date Dec 3, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,468,370
- Issue date Nov 5, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,461,055
- Issue date Oct 29, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,414,002
- Issue date Sep 17, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silver bonding wire for semiconductor device containing indium, gal...
- Patent number 10,381,320
- Issue date Aug 13, 2019
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,236,272
- Issue date Mar 19, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,137,534
- Issue date Nov 27, 2018
- Nippon Micrometal Corporation
- Takashi Yamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,121,758
- Issue date Nov 6, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method for forming ball in bonding wire
- Patent number 10,121,764
- Issue date Nov 6, 2018
- Nippon Micrometal Corporation
- Noritoshi Araki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,032,741
- Issue date Jul 24, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,972,598
- Issue date May 15, 2018
- Renesas Electronics Corporation
- Yuki Yagyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 9,887,172
- Issue date Feb 6, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor wire bonding machine cleaning device and method
- Patent number 9,825,000
- Issue date Nov 21, 2017
- International Test Solutions, Inc.
- Alan E. Humphrey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure of bonding wire
- Patent number 9,331,049
- Issue date May 3, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 9,112,059
- Issue date Aug 18, 2015
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ag—Au—Pd ternary alloy bonding wire
- Patent number 9,103,001
- Issue date Aug 11, 2015
- Tanaka Denshi Kogyo K.K.
- Jun Chiba
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method for obtaining a palladium surface finish for copper wire bon...
- Patent number 8,987,910
- Issue date Mar 24, 2015
- Atotech Deutschland GmbH
- Mustafa Özkök
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor
- Patent number 8,815,019
- Issue date Aug 26, 2014
- Nippon Steel & Sumikin Materials., Ltd.
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor
- Patent number 8,742,258
- Issue date Jun 3, 2014
- Nippon Steel & Sumikin Materials Co., Ltd.
- Shinichi Terashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor device with copper wire ball-bonded to electrode pad...
- Patent number 8,692,370
- Issue date Apr 8, 2014
- Semiconductor Components Industries, LLC
- Takashi Kitazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,586,416
- Issue date Nov 19, 2013
- Renesas Electronics Corporation
- Masahiko Sekihara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit including bond wire directly bonded to pad
- Patent number 8,432,024
- Issue date Apr 30, 2013
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 8,389,860
- Issue date Mar 5, 2013
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gas delivery system for reducing oxidation in wire bonding operations
- Patent number 8,313,015
- Issue date Nov 20, 2012
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20200168578
- Publication date May 28, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya OYAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
- Publication number 20200013747
- Publication date Jan 9, 2020
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
- Publication number 20190164927
- Publication date May 30, 2019
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WIRE BONDING MACHINE CLEANING DEVICE AND METHOD
- Publication number 20180308821
- Publication date Oct 25, 2018
- International Test Solutions, Inc.
- Alan E. Humphrey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180122765
- Publication date May 3, 2018
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR FORMING BALL IN BONDING WIRE
- Publication number 20180096965
- Publication date Apr 5, 2018
- NIPPON MICROMETAL CORPORATION
- Noritoshi ARAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180082977
- Publication date Mar 22, 2018
- RENESAS ELECTRONICS CORPORATION
- Yuki YAGYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170323864
- Publication date Nov 9, 2017
- Nippon Micrometal Corporation
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR
- Publication number 20130306352
- Publication date Nov 21, 2013
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Shinichi Terashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR OBTAINING A PALLADIUM SURFACE FINISH FOR COPPER WIRE BON...
- Publication number 20130288475
- Publication date Oct 31, 2013
- Atotech Deutschland GmbH
- Mustafa Özkök
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120302009
- Publication date Nov 29, 2012
- RENESAS ELECTRONICS CORPORATION
- Masahiko SEKIHARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ag-Au-Pd TERNARY ALLOY BONDING WIRE
- Publication number 20120263624
- Publication date Oct 18, 2012
- TANAKA DENSHI KOGYO K.K.
- Jun Chiba
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR
- Publication number 20120118610
- Publication date May 17, 2012
- NIPPON MICROMETAL CORPORATION
- Shinichi Terashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20120104613
- Publication date May 3, 2012
- NIPPON MICROMETAL CORPORATION
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS
- Publication number 20120031877
- Publication date Feb 9, 2012
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20110304046
- Publication date Dec 15, 2011
- ON SEMICONDUCTOR TRADING, LTD. a Bermuda limited company
- Takashi Kitazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING BOND WIRE DIRECTLY BONDED TO PAD
- Publication number 20110260307
- Publication date Oct 27, 2011
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR
- Publication number 20110120594
- Publication date May 26, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING STRUCTURE OF BONDING WIRE
- Publication number 20110104510
- Publication date May 5, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS
- Publication number 20110073635
- Publication date Mar 31, 2011
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE-BONDING MACHINE WITH COVER-GAS SUPPLY DEVICE
- Publication number 20110049219
- Publication date Mar 3, 2011
- Advanced Semiconductor Engineering, Inc.
- Kai Lin HUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMING GAS KIT DESIGN FOR COPPER BONDING
- Publication number 20110017806
- Publication date Jan 27, 2011
- Jerry Gomez Cayabyab
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20110011619
- Publication date Jan 20, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD
- Publication number 20100327450
- Publication date Dec 30, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20100294435
- Publication date Nov 25, 2010
- SHINKAWA LTD.
- Toru MAEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20100294532
- Publication date Nov 25, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20100282495
- Publication date Nov 11, 2010
- NIPPON STEEL MATERIALS CO., LTD
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCED OXIDATION SYSTEM FOR WIRE BONDING
- Publication number 20100230476
- Publication date Sep 16, 2010
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING STRUCTURE OF BONDING WIRE AND METHOD FOR FORMING SAME
- Publication number 20100213619
- Publication date Aug 26, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100200981
- Publication date Aug 12, 2010
- Advanced Semiconductor Engineering, Inc.
- Wen Pin HUANG
- H01 - BASIC ELECTRIC ELEMENTS

being inert

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding wire for semiconductor device

Cu alloy bonding wire for semiconductor device

Bonding wire for semiconductor device

Cu alloy core bonding wire with Pd coating for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Cu alloy core bonding wire with Pd coating for semiconductor device

Bonding wire for semiconductor device

Cu alloy core bonding wire with Pd coating for semiconductor device

Bonding wire for semiconductor device

Silver bonding wire for semiconductor device containing indium, gal...

Cu alloy core bonding wire with Pd coating for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Method for forming ball in bonding wire

Bonding wire for semiconductor device

Method of manufacturing semiconductor device

Bonding wire for semiconductor device

Semiconductor wire bonding machine cleaning device and method

Bonding structure of bonding wire

Bonding wire for semiconductor device

Ag—Au—Pd ternary alloy bonding wire

Method for obtaining a palladium surface finish for copper wire bon...

Bonding wire for semiconductor

Bonding wire for semiconductor

Semiconductor device with copper wire ball-bonded to electrode pad...

Method of manufacturing semiconductor device

Integrated circuit including bond wire directly bonded to pad

Bonding wire for semiconductor devices

Gas delivery system for reducing oxidation in wire bonding operations

Patents Applicationslast 30 patents

Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE

Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR WIRE BONDING MACHINE CLEANING DEVICE AND METHOD

BONDING WIRE FOR SEMICONDUCTOR DEVICE

METHOD FOR FORMING BALL IN BONDING WIRE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR

METHOD FOR OBTAINING A PALLADIUM SURFACE FINISH FOR COPPER WIRE BON...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Ag-Au-Pd TERNARY ALLOY BONDING WIRE

BONDING WIRE FOR SEMICONDUCTOR

BONDING WIRE FOR SEMICONDUCTOR DEVICE

GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

INTEGRATED CIRCUIT INCLUDING BOND WIRE DIRECTLY BONDED TO PAD

BONDING WIRE FOR SEMICONDUCTOR

BONDING STRUCTURE OF BONDING WIRE

GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS

WIRE-BONDING MACHINE WITH COVER-GAS SUPPLY DEVICE

FORMING GAS KIT DESIGN FOR COPPER BONDING

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD

BONDING APPARATUS AND WIRE BONDING METHOD

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICE

REDUCED OXIDATION SYSTEM FOR WIRE BONDING

BONDING STRUCTURE OF BONDING WIRE AND METHOD FOR FORMING SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME