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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package using hybrid-type adhesive
- Patent number 12,040,300
- Issue date Jul 16, 2024
- Airoha Technology Corp.
- Ying-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor apparatus and semiconductor a...
- Patent number 11,948,910
- Issue date Apr 2, 2024
- Canon Kabushiki Kaisha
- Shinichiro Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film with carbon-based conductive regions an...
- Patent number 11,881,468
- Issue date Jan 23, 2024
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing anisotropic conductive film and anisotropic con...
- Patent number 11,787,976
- Issue date Oct 17, 2023
- Dexerials Corporation
- Seiichiro Shinohara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,784,154
- Issue date Oct 10, 2023
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,710,716
- Issue date Jul 25, 2023
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 11,658,150
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor apparatus and semiconductor a...
- Patent number 11,444,055
- Issue date Sep 13, 2022
- Canon Kabushiki Kaisha
- Shinichiro Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,404,391
- Issue date Aug 2, 2022
- Dexerials Corporation
- Seiichiro Shinohara
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor chip stack arrangement and semiconductor chip for pro...
- Patent number 11,367,709
- Issue date Jun 21, 2022
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,348,891
- Issue date May 31, 2022
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film with carbon-based conductive regions an...
- Patent number 11,189,588
- Issue date Nov 30, 2021
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing anisotropic conductive film and anisotropic con...
- Patent number 11,136,476
- Issue date Oct 5, 2021
- Dexerials Corporation
- Seiichiro Shinohara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic packaging structure
- Patent number 11,114,387
- Issue date Sep 7, 2021
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure and method of manufacturing the same
- Patent number 11,094,661
- Issue date Aug 17, 2021
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Hirofumi Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 11,069,658
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing anisotropic conductive film and anisotropic con...
- Patent number 11,034,863
- Issue date Jun 15, 2021
- Dexerials Corporation
- Seiichiro Shinohara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element and electronic device comprising the same
- Patent number 10,825,787
- Issue date Nov 3, 2020
- Innolux Corporation
- Wei-Cheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,784,226
- Issue date Sep 22, 2020
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device metal joint process
- Patent number 10,734,269
- Issue date Aug 4, 2020
- Dariusz Golda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond materials with enhanced plasma resistant characteristics and a...
- Patent number 10,727,195
- Issue date Jul 28, 2020
- Technetics Group LLC
- Jason Wright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 10,541,227
- Issue date Jan 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package with a solder receiving area and as...
- Patent number 10,529,652
- Issue date Jan 7, 2020
- STMicroelectronics Pte Ltd
- Wing Shenq Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method for manufacturing the same
- Patent number 10,494,549
- Issue date Dec 3, 2019
- Samsung Display Co., Ltd.
- Minseok Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film and connection structure
- Patent number 10,388,624
- Issue date Aug 20, 2019
- Dexerials Corporation
- Shinichi Hayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
- Patent number 10,373,926
- Issue date Aug 6, 2019
- Dexerials Corporation
- Kouichi Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Integrated circuit (IC) package with a solder receiving area and as...
- Patent number 10,297,534
- Issue date May 21, 2019
- STMicroelectronics Pte Ltd
- Wing Shenq Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing anisotropic conductive film and anisotropic con...
- Patent number 10,272,598
- Issue date Apr 30, 2019
- Dexerials Corporation
- Seiichiro Shinohara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Chip mounting structure
- Patent number 10,141,278
- Issue date Nov 27, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE TO REDUCE CHIP SHIFT DURING ASSEMBLY
- Publication number 20240395758
- Publication date Nov 28, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- MC Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE, ELECTRONIC DEVICE AND CHIP PACKAGING METHOD
- Publication number 20240321678
- Publication date Sep 26, 2024
- Smarter Silicon (Shanghai) Technologies Co., Ltd.
- SHIH-YUEH HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM WITH CARBON-BASED CONDUCTIVE REGIONS AN...
- Publication number 20240170435
- Publication date May 23, 2024
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE ADHESIVE ASSEMBLY FOR SEMICONDUCTOR DIE ATTACHMENT
- Publication number 20240063165
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Ramesh NALLAVELLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON CONDUCTIVE FILM, METHOD FOR FORMING NON CONDUCTIVE FILM, CHIP P...
- Publication number 20230215832
- Publication date Jul 6, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- CHIH-WEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING HYBRID-TYPE ADHESIVE
- Publication number 20230136631
- Publication date May 4, 2023
- Airoha Technology Corp.
- Ying-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING SAME
- Publication number 20230017846
- Publication date Jan 19, 2023
- Changxin Memory Technologies, Inc.
- Ling-Yi CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR A...
- Publication number 20220384387
- Publication date Dec 1, 2022
- CANON KABUSHIKI KAISHA
- Shinichiro Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM WITH CARBON-BASED CONDUCTIVE REGIONS AN...
- Publication number 20220077098
- Publication date Mar 10, 2022
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PRINTING
- Publication number 20220059439
- Publication date Feb 24, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Robert Allan Neidorff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
- Publication number 20210280548
- Publication date Sep 9, 2021
- DEXERIALS CORPORATION
- Kenichi SARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STACK ARRANGEMENT AND SEMICONDUCTOR CHIP FOR PRO...
- Publication number 20210193619
- Publication date Jun 24, 2021
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR A...
- Publication number 20210066241
- Publication date Mar 4, 2021
- Canon Kabushiki Kaisha
- Shinichiro Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM WITH CARBON-BASED CONDUCTIVE REGIONS AN...
- Publication number 20200211996
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on Integrated Chips and Methods of Forming Same
- Publication number 20200152604
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190371757
- Publication date Dec 5, 2019
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
- Publication number 20190096844
- Publication date Mar 28, 2019
- DEXERIALS CORPORATION
- Kenichi SARUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...
- Publication number 20190088613
- Publication date Mar 21, 2019
- TECHNETICS GROUP LLC
- Jason Wright
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
- Publication number 20190067234
- Publication date Feb 28, 2019
- DEXERIALS CORPORATION
- Kenichi SARUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEALED SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20180323353
- Publication date Nov 8, 2018
- Lumileds LLC
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE
- Publication number 20180277505
- Publication date Sep 27, 2018
- DEXERIALS CORPORATION
- Shinichi HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...
- Publication number 20180218994
- Publication date Aug 2, 2018
- DEXERIALS CORPORATION
- Kouichi SATO
- B32 - LAYERED PRODUCTS
Information Patent Application
CHIP MOUNTING STRUCTURE
- Publication number 20180076162
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Akihiro HORIBE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING BASE AND SEMICO...
- Publication number 20170229415
- Publication date Aug 10, 2017
- KABUSHIKI KAISHA TOSHIBA
- Yuchen HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED INTERCONNECTS FOR SEMICONDUCTOR PACKAGES
- Publication number 20170033072
- Publication date Feb 2, 2017
- TEXAS INSTRUMENTS INCORPORATED
- BENJAMIN STASSEN COOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160284660
- Publication date Sep 29, 2016
- Toyota Jidosha Kabushiki Kaisha
- Takeshi FUKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140367701
- Publication date Dec 18, 2014
- Mitsubishi Electrict Corporation
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND METHOD OF MAKING CONDUCTIVE CONNECTION
- Publication number 20140290059
- Publication date Oct 2, 2014
- FUJIFILM CORPORATION
- Takeaki KAWASHIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
JOINING METHOD USING METAL FOAM, METHOD OF MANUFACTURING SEMICONDUC...
- Publication number 20140111956
- Publication date Apr 24, 2014
- Fuji Electric Co., Ltd.
- Katsumi TANIGUCHI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

being mutually engaged together

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package using hybrid-type adhesive

Manufacturing method of semiconductor apparatus and semiconductor a...

Anisotropic conductive film with carbon-based conductive regions an...

Method of producing anisotropic conductive film and anisotropic con...

Anisotropic conductive film and method of producing the same

Anisotropic conductive film and method of producing the same

System on integrated chips and methods of forming same

Manufacturing method of semiconductor apparatus and semiconductor a...

Anisotropic conductive film and method of producing the same

Semiconductor chip stack arrangement and semiconductor chip for pro...

Anisotropic conductive film and method of producing the same

Anisotropic conductive film with carbon-based conductive regions an...

Method of producing anisotropic conductive film and anisotropic con...

Electronic packaging structure

Bonded structure and method of manufacturing the same

System on integrated chips and methods of forming same

Method of producing anisotropic conductive film and anisotropic con...

Method and apparatus for creating a bond between objects based on f...

Electronic element and electronic device comprising the same

Semiconductor device

Micro device metal joint process

Bond materials with enhanced plasma resistant characteristics and a...

System on integrated chips and methods of forming same

Integrated circuit (IC) package with a solder receiving area and as...

Anisotropic conductive film and method for manufacturing the same

Anisotropic conductive film and connection structure

Anisotropic conductive film, method for producing anisotropic condu...

Integrated circuit (IC) package with a solder receiving area and as...

Method of producing anisotropic conductive film and anisotropic con...

Chip mounting structure

Patents Applicationslast 30 patents

STRUCTURE TO REDUCE CHIP SHIFT DURING ASSEMBLY

CHIP PACKAGING STRUCTURE, ELECTRONIC DEVICE AND CHIP PACKAGING METHOD

ANISOTROPIC CONDUCTIVE FILM WITH CARBON-BASED CONDUCTIVE REGIONS AN...

CONDUCTIVE ADHESIVE ASSEMBLY FOR SEMICONDUCTOR DIE ATTACHMENT

NON CONDUCTIVE FILM, METHOD FOR FORMING NON CONDUCTIVE FILM, CHIP P...

SEMICONDUCTOR PACKAGE USING HYBRID-TYPE ADHESIVE

PACKAGE STRUCTURE AND METHOD FOR FABRICATING SAME

MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR A...

ANISOTROPIC CONDUCTIVE FILM WITH CARBON-BASED CONDUCTIVE REGIONS AN...

SOLDER PRINTING

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR CHIP STACK ARRANGEMENT AND SEMICONDUCTOR CHIP FOR PRO...

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR A...

ANISOTROPIC CONDUCTIVE FILM WITH CARBON-BASED CONDUCTIVE REGIONS AN...

System on Integrated Chips and Methods of Forming Same

SEMICONDUCTOR DEVICE

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

SEALED SEMICONDUCTOR LIGHT EMITTING DEVICE

ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE

ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...

CHIP MOUNTING STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING BASE AND SEMICO...

PRINTED INTERCONNECTS FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ANISOTROPIC CONDUCTIVE FILM AND METHOD OF MAKING CONDUCTIVE CONNECTION

JOINING METHOD USING METAL FOAM, METHOD OF MANUFACTURING SEMICONDUC...