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being non uniform along the bonding area

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  • CPC
  • H01L2224/08053
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/08053being non uniform along the bonding area
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    BONDING STRUCTURE AND METHOD THEREOF
    • Publication number 20240304580
    • Publication date Sep 12, 2024
    • Taiwan Semiconductor Manufacturing company Ltd.
    • WEN-CHUAN TAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FINE-PITCH JOINING PAD STRUCTURE
    • Publication number 20230317652
    • Publication date Oct 5, 2023
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING STRUCTURE AND METHOD THEREOF
    • Publication number 20230299028
    • Publication date Sep 21, 2023
    • Taiwan Semiconductor Manufacturing company Ltd.
    • WEN-CHUAN TAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PATTERN DECOMPOSITION LITHOGRAPHY TECHNIQUES
    • Publication number 20210375807
    • Publication date Dec 2, 2021
    • Intel Corporation
    • CHARLES H. WALLACE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PATTERN DECOMPOSITION LITHOGRAPHY TECHNIQUES
    • Publication number 20200091101
    • Publication date Mar 19, 2020
    • Intel Corporation
    • CHARLES H. WALLACE
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Application

    PATTERN DECOMPOSITION LITHOGRAPHY TECHNIQUES
    • Publication number 20170207185
    • Publication date Jul 20, 2017
    • Intel Corporation
    • CHARLES H. WALLACE
    • H01 - BASIC ELECTRIC ELEMENTS