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being non uniform along the bonding area
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H01L2224/08058
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/08058
being non uniform along the bonding area
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last 30 patents
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Stacked semiconductor structure and method
Patent number
11,587,910
Issue date
Feb 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Szu-Ying Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Stacked semiconductor structure and method
Patent number
11,037,909
Issue date
Jun 15, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Szu-Ying Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device having electrode pad and electrode layer inter...
Patent number
10,985,104
Issue date
Apr 20, 2021
Kabushiki Kaisha Toshiba
Seiji Inumiya
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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Forming metal bonds with recesses
Patent number
10,854,574
Issue date
Dec 1, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
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Three-dimensional integrated circuit and method of manufacturing th...
Patent number
10,790,248
Issue date
Sep 29, 2020
United Microelectronics Corp.
Chun-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
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Forming metal bonds with recesses
Patent number
10,685,935
Issue date
Jun 16, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Stacked semiconductor structure and method
Patent number
10,510,730
Issue date
Dec 17, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Szu-Ying Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Stacked semiconductor structure and method
Patent number
10,157,889
Issue date
Dec 18, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Szu-Ying Chen
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package
Patent number
10,008,462
Issue date
Jun 26, 2018
Samsung Electronics Co., Ltd.
Sun-kyoung Seo
H01 - BASIC ELECTRIC ELEMENTS
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Electronic component mounting structure
Patent number
8,497,432
Issue date
Jul 30, 2013
Seiko Epson Corporation
Nobuaki Hashimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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last 30 patents
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SEMICONDUCTOR PACKAGE
Publication number
20240096831
Publication date
Mar 21, 2024
Samsung Electronics Co., Ltd.
Enbin Jo
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Publication number
20230378110
Publication date
Nov 23, 2023
Samsung Electronics Co., Ltd.
MINKI KIM
H01 - BASIC ELECTRIC ELEMENTS
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Stacked Semiconductor Structure and Method
Publication number
20230207530
Publication date
Jun 29, 2023
Taiwan Semiconductor Manufacturing Co, LTD.
Szu-Ying Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20230091632
Publication date
Mar 23, 2023
Rohm Co., Ltd.
Satoshi KAGEYAMA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Stacked Semiconductor Structure and Method
Publication number
20210225813
Publication date
Jul 22, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Szu-Ying Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING TH...
Publication number
20200235063
Publication date
Jul 23, 2020
United Microelectronics Corp.
Chun-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Stacked Semiconductor Structure and Method
Publication number
20200075556
Publication date
Mar 5, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Szu-Ying Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Forming Metal Bonds with Recesses
Publication number
20200006288
Publication date
Jan 2, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Stacked Semiconductor Structure and Method
Publication number
20190123026
Publication date
Apr 25, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Szu-Ying Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES, AND CORRESPONDING D...
Publication number
20180053709
Publication date
Feb 22, 2018
STMicroelectronics S.r.l.
Paolo Crema
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20170084558
Publication date
Mar 23, 2017
Samsung Electronics Co., Ltd.
Sun-kyoung Seo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
Publication number
20100071946
Publication date
Mar 25, 2010
SEIKO EPSON CORPORATION
Nobuaki HASHIMOTO
G02 - OPTICS