being non uniform along the bonding area

Industry

CPC
H01L2224/08058

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/08058being non uniform along the bonding area

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,142,544
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 12,068,287
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 11,587,910
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 11,037,909
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having electrode pad and electrode layer inter...
- Patent number 10,985,104
- Issue date Apr 20, 2021
- Kabushiki Kaisha Toshiba
- Seiji Inumiya
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Forming metal bonds with recesses
- Patent number 10,854,574
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit and method of manufacturing th...
- Patent number 10,790,248
- Issue date Sep 29, 2020
- United Microelectronics Corp.
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming metal bonds with recesses
- Patent number 10,685,935
- Issue date Jun 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 10,510,730
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 10,157,889
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,008,462
- Issue date Jun 26, 2018
- Samsung Electronics Co., Ltd.
- Sun-kyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282713
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BONDING PADS AND METHOD FOR FABRICAT...
- Publication number 20240243081
- Publication date Jul 18, 2024
- SK HYNIX INC.
- Byung Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096831
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Enbin Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230378110
- Publication date Nov 23, 2023
- Samsung Electronics Co., Ltd.
- MINKI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Structure and Method
- Publication number 20230207530
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230091632
- Publication date Mar 23, 2023
- Rohm Co., Ltd.
- Satoshi KAGEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Structure and Method
- Publication number 20210225813
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING TH...
- Publication number 20200235063
- Publication date Jul 23, 2020
- United Microelectronics Corp.
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Structure and Method
- Publication number 20200075556
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Metal Bonds with Recesses
- Publication number 20200006288
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Structure and Method
- Publication number 20190123026
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES, AND CORRESPONDING D...
- Publication number 20180053709
- Publication date Feb 22, 2018
- STMicroelectronics S.r.l.
- Paolo Crema
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20170084558
- Publication date Mar 23, 2017
- Samsung Electronics Co., Ltd.
- Sun-kyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20100071946
- Publication date Mar 25, 2010
- SEIKO EPSON CORPORATION
- Nobuaki HASHIMOTO
- G02 - OPTICS

being non uniform along the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Stacked semiconductor structure and method

Stacked semiconductor structure and method

Stacked semiconductor structure and method

Semiconductor device having electrode pad and electrode layer inter...

Forming metal bonds with recesses

Three-dimensional integrated circuit and method of manufacturing th...

Forming metal bonds with recesses

Stacked semiconductor structure and method

Stacked semiconductor structure and method

Semiconductor package

Electronic component mounting structure

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE INCLUDING BONDING PADS AND METHOD FOR FABRICAT...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Stacked Semiconductor Structure and Method

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Stacked Semiconductor Structure and Method

THREE-DIMENSIONAL INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING TH...

Stacked Semiconductor Structure and Method

Forming Metal Bonds with Recesses

Stacked Semiconductor Structure and Method

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES, AND CORRESPONDING D...

SEMICONDUCTOR PACKAGE

ELECTRONIC COMPONENT MOUNTING STRUCTURE