being non uniform along the layer connector

Industry

CPC
H01L2224/32053

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32053being non uniform along the layer connector

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 11,955,453
- Issue date Apr 9, 2024
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, method of manufacturing the same, and camera
- Patent number 9,978,804
- Issue date May 22, 2018
- Canon Kabushiki Kaisha
- Hidemasa Oshige
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 9,805,937
- Issue date Oct 31, 2017
- Renesas Electronics Corporation
- Tomoya Kashiwazaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240038712
- Publication date Feb 1, 2024
- Advanced Semiconductor Engineering, Inc.
- Jung Jui KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240038725
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Keumhee MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230317539
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Bo In NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20230094354
- Publication date Mar 30, 2023
- Rohm Co., Ltd.
- Yosui FUTAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Massively parallel transfer of microLED devices
- Publication number 20180190614
- Publication date Jul 5, 2018
- Ananda H. Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20170372907
- Publication date Dec 28, 2017
- Renesas Electronics Corporation
- Tomoya Kashiwazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING THE SAME, AND CAMERA
- Publication number 20170287973
- Publication date Oct 5, 2017
- Canon Kabushiki Kaisha
- Hidemasa Oshige
- H01 - BASIC ELECTRIC ELEMENTS

being non uniform along the layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device

Electronic device, method of manufacturing the same, and camera

Method of manufacturing semiconductor device and semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

Massively parallel transfer of microLED devices

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE, METHOD OF MANUFACTURING THE SAME, AND CAMERA