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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,142,544
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test bumps
- Patent number 12,125,753
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Taehyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,990,441
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Infrared sensor and imaging apparatus
- Patent number 11,901,389
- Issue date Feb 13, 2024
- NEC Corporation
- Tomo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-conductor package structure
- Patent number 11,710,713
- Issue date Jul 25, 2023
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package assembly with enhanced solder resist crack resistance
- Patent number 11,315,858
- Issue date Apr 26, 2022
- Xilinx, Inc.
- Yu Hsiang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-conductor package structure
- Patent number 11,257,778
- Issue date Feb 22, 2022
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump layout for coplanarity improvement
- Patent number 11,211,318
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling-Wei Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Protrusion bump pads for bond-on-trace processing
- Patent number 10,804,192
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Company
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-conductor package structure
- Patent number 10,720,400
- Issue date Jul 21, 2020
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 10,510,720
- Issue date Dec 17, 2019
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-conductor package structure
- Patent number 10,490,522
- Issue date Nov 26, 2019
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-conductor package structure
- Patent number 10,224,302
- Issue date Mar 5, 2019
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protrusion bump pads for bond-on-trace processing
- Patent number 10,163,774
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company
- Yu-Min Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having conductive bumps of varying heights
- Patent number 10,163,844
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate, component mounted board, and method for produ...
- Patent number 9,972,567
- Issue date May 15, 2018
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 9,960,147
- Issue date May 1, 2018
- Hitachi Automotive Systems, Ltd.
- Shiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package with protective circuitry layout and a subs...
- Patent number 9,859,187
- Issue date Jan 2, 2018
- Powertech Technology Inc.
- Yong-Cheng Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an integrated circuit package and apparatus pr...
- Patent number 9,853,007
- Issue date Dec 26, 2017
- Microsemi Solutions (U.S.), Inc.
- John Plasterer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-conductor package structure
- Patent number 9,659,895
- Issue date May 23, 2017
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protrusion bump pads for bond-on-trace processing
- Patent number 9,275,967
- Issue date Mar 1, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package equipped with semiconductor chip and method for producing same
- Patent number 7,649,267
- Issue date Jan 19, 2010
- Panasonic Corporation
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240297139
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Namhoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE BUMPS OF A PACKAGE SUBSTRATE
- Publication number 20240203860
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Ashish RAJ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE HAVING BALL GRID ARRAY SUBSTRATE WITH SIGNAL AND PO...
- Publication number 20240145363
- Publication date May 2, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Vivek SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND BUMP ARRANGEMENT METHOD
- Publication number 20240021557
- Publication date Jan 18, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuo SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER
- Publication number 20230317545
- Publication date Oct 5, 2023
- Intel Corporation
- Pilin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230230946
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Seongyo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230034654
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-CONDUCTOR PACKAGE STRUCTURE
- Publication number 20220173065
- Publication date Jun 2, 2022
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220165696
- Publication date May 26, 2022
- Samsung Electronics Co., Ltd.
- NAMHOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING TEST BUMPS
- Publication number 20220148994
- Publication date May 12, 2022
- Samsung Electronics Co., Ltd.
- Taehyeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFRARED SENSOR AND IMAGING APPARATUS
- Publication number 20210375974
- Publication date Dec 2, 2021
- NEC Corporation
- Tomo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-CONDUCTOR PACKAGE STRUCTURE
- Publication number 20200243471
- Publication date Jul 30, 2020
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP LAYOUT FOR COPLANARITY IMPROVEMENT
- Publication number 20200105654
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ling-Wei Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMI-CONDUCTOR PACKAGE STRUCTURE
- Publication number 20190123010
- Publication date Apr 25, 2019
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-CONDUCTOR PACKAGE STRUCTURE
- Publication number 20180323164
- Publication date Nov 8, 2018
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-CONDUCTOR PACKAGE STRUCTURE
- Publication number 20180096959
- Publication date Apr 5, 2018
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180061810
- Publication date Mar 1, 2018
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20180005986
- Publication date Jan 4, 2018
- Hitachi Automotive Systems, Ltd.
- Shiro YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE, COMPONENT MOUNTED BOARD, AND METHOD FOR PRODU...
- Publication number 20170271243
- Publication date Sep 21, 2017
- Murata Manufacturing Co., Ltd.
- Kuniaki YOSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY PACKAGE WITH PROTECTIVE CIRCUITRY LAYOUT AND A SUBS...
- Publication number 20170194231
- Publication date Jul 6, 2017
- Powertech Technology Inc.
- Yong-Cheng CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-CONDUCTOR PACKAGE STRUCTURE
- Publication number 20170005061
- Publication date Jan 5, 2017
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN INTEGRATED CIRCUIT PACKAGE AND APPARATUS PR...
- Publication number 20160190084
- Publication date Jun 30, 2016
- PMC-SIERRA US, INC.
- John PLASTERER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Protrusion Bump Pads for Bond-on-Trace Processing
- Publication number 20150194404
- Publication date Jul 9, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Equipped with Semiconductor Chip and Method for Producing Same
- Publication number 20080265437
- Publication date Oct 30, 2008
- Tsukasa Shiraishi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

being non uniform

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Semiconductor package including test bumps

Semiconductor package

Infrared sensor and imaging apparatus

Semi-conductor package structure

Chip package assembly with enhanced solder resist crack resistance

Semi-conductor package structure

Bump layout for coplanarity improvement

Protrusion bump pads for bond-on-trace processing

Semi-conductor package structure

Electronic package and method for fabricating the same

Semi-conductor package structure

Semi-conductor package structure

Protrusion bump pads for bond-on-trace processing

Semiconductor device having conductive bumps of varying heights

Multilayer substrate, component mounted board, and method for produ...

Power module

Ball grid array package with protective circuitry layout and a subs...

Method for producing an integrated circuit package and apparatus pr...

Semi-conductor package structure

Protrusion bump pads for bond-on-trace processing

Package equipped with semiconductor chip and method for producing same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

PACKAGE BUMPS OF A PACKAGE SUBSTRATE

FAN-OUT PACKAGE HAVING BALL GRID ARRAY SUBSTRATE WITH SIGNAL AND PO...

SEMICONDUCTOR DEVICE AND BUMP ARRANGEMENT METHOD

PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMI-CONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING TEST BUMPS

INFRARED SENSOR AND IMAGING APPARATUS

SEMI-CONDUCTOR PACKAGE STRUCTURE

BUMP LAYOUT FOR COPLANARITY IMPROVEMENT

SEMI-CONDUCTOR PACKAGE STRUCTURE

SEMI-CONDUCTOR PACKAGE STRUCTURE

SEMI-CONDUCTOR PACKAGE STRUCTURE

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

POWER MODULE

MULTILAYER SUBSTRATE, COMPONENT MOUNTED BOARD, AND METHOD FOR PRODU...

BALL GRID ARRAY PACKAGE WITH PROTECTIVE CIRCUITRY LAYOUT AND A SUBS...

SEMI-CONDUCTOR PACKAGE STRUCTURE

METHOD FOR PRODUCING AN INTEGRATED CIRCUIT PACKAGE AND APPARATUS PR...

Protrusion Bump Pads for Bond-on-Trace Processing

Package Equipped with Semiconductor Chip and Method for Producing Same