TREA

being non uniform

Follow

Industry

  • CPC
  • H01L2224/09132
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/09132being non uniform
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240404970
    • Publication date Dec 5, 2024
    • Samsung Electronics Co., Ltd.
    • MINKI KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME
    • Publication number 20240339382
    • Publication date Oct 10, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • YOU CHYE HOW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230411328
    • Publication date Dec 21, 2023
    • KIOXIA Corporation
    • Shinya ARAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230230946
    • Publication date Jul 20, 2023
    • Samsung Electronics Co., Ltd.
    • Seongyo KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230034654
    • Publication date Feb 2, 2023
    • Samsung Electronics Co., Ltd.
    • Yong Ho KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230005885
    • Publication date Jan 5, 2023
    • Samsung Electronics Co., Ltd.
    • Hyemi Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COUPLING OF INTEGRATED CIRCUITS (ICS) THROUGH A PASSIVATION-DEFINED...
    • Publication number 20220130778
    • Publication date Apr 28, 2022
    • Cirrus Logic International Semiconductor Ltd.
    • Christopher Healy
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    • Publication number 20210280545
    • Publication date Sep 9, 2021
    • Kioxia Corporation
    • Takashi WATANABE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20190385944
    • Publication date Dec 19, 2019
    • AU OPTRONICS CORPORATION
    • Chih-Hao Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONNECTION PADS FOR LOW CROSS-TALK VERTICAL WIREBONDS
    • Publication number 20180323173
    • Publication date Nov 8, 2018
    • Intel Corporation
    • Hungying L. LO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DISPLAY APPARATUS AND METHOD FOR BINDING THE SAME
    • Publication number 20180122758
    • Publication date May 3, 2018
    • BOE TECHNOLOGY GROUP CO., LTD.
    • Liqiang Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20170069588
    • Publication date Mar 9, 2017
    • Kabushiki Kaisha Toshiba
    • Yoshihiro MONMA
    • H01 - BASIC ELECTRIC ELEMENTS