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  • H01L2224/06142
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/06142being non uniform
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Patents Grantslast 30 patents

  • Information Patent Grant

    Electronic system with expansion feature
    • Patent number 8,703,541
    • Issue date Apr 22, 2014
    • Stats Chippac Ltd.
    • Haengcheol Choi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Enhanced bump pitch scaling
    • Patent number 8,508,054
    • Issue date Aug 13, 2013
    • Broadcom Corporation
    • Mengzhi Pang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic system with expansion feature
    • Patent number 8,178,392
    • Issue date May 15, 2012
    • Stats Chippac Ltd.
    • Haengcheol Choi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER
    • Publication number 20230054800
    • Publication date Feb 23, 2023
    • Shinko Electric Industries Co., Ltd.
    • Kengo YAMAMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Enhanced Bump Pitch Scaling
    • Publication number 20120319269
    • Publication date Dec 20, 2012
    • BROADCOM CORPORATION
    • Mengzhi Pang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC SYSTEM WITH EXPANSION FEATURE
    • Publication number 20120193132
    • Publication date Aug 2, 2012
    • Haengcheol Choi
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    SEMICONDUCTOR PACKAGES, ELECTRONIC DEVICES AND ELECTRONIC SYSTEMS E...
    • Publication number 20120068350
    • Publication date Mar 22, 2012
    • Samsung Electronics Co., Ltd.
    • Tong-Suk Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC SYSTEM WITH EXPANSION FEATURE
    • Publication number 20080283998
    • Publication date Nov 20, 2008
    • Haengcheol Choi
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...