being other than a cuboid

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H01L2924/10155

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/10155being other than a cuboid

Industries

Patents Grantslast 30 patents

Information Patent Grant
Light emitting diode (LED) components and methods
- Patent number 11,769,757
- Issue date Sep 26, 2023
- CreeLED, Inc.
- Jesse Colin Reiherzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and fluidic manufacture thereof
- Patent number 11,721,792
- Issue date Aug 8, 2023
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and substrate structure having chamfers
- Patent number 11,227,842
- Issue date Jan 18, 2022
- Siliconware Precision Industries Co., Ltd.
- Po-Hao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-sensitive silicon package embedding self-powered electronic s...
- Patent number 11,177,246
- Issue date Nov 16, 2021
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Receiver optical module and process of assembling the same
- Patent number 11,152,342
- Issue date Oct 19, 2021
- Sumitomo Electric Device Innovations, Inc.
- Kyohei Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies and cooling structures having metalized exte...
- Patent number 11,121,060
- Issue date Sep 14, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a cooling body with a groove
- Patent number 11,088,045
- Issue date Aug 10, 2021
- Mitsubishi Electric Corporation
- Noboru Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading device and method
- Patent number 11,018,073
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of sensor chip package structure
- Patent number 10,964,839
- Issue date Mar 30, 2021
- PixArt Imaging Inc.
- Chi-Chih Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light emitting device and fluidic manufacture thereof
- Patent number 10,930,819
- Issue date Feb 23, 2021
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth memory (HBM) bandwidth aggregation switch
- Patent number 10,916,516
- Issue date Feb 9, 2021
- Xilinx, Inc.
- Martin Newman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip packaging structure, chip module and electronic terminal
- Patent number 10,854,526
- Issue date Dec 1, 2020
- Shenzhen Goodix Technology Co., Ltd.
- Shengbin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor, in particular a microphone with improved layout
- Patent number 10,822,227
- Issue date Nov 3, 2020
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Philippe Robert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die encapsulation in oxide bonded wafer stack
- Patent number 10,784,234
- Issue date Sep 22, 2020
- Raytheon Company
- John J. Drab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device stacks having interior window wirebonding
- Patent number 10,770,429
- Issue date Sep 8, 2020
- Intel Corporation
- Min-Tih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for electromagnetic interference shielding
- Patent number 10,763,220
- Issue date Sep 1, 2020
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure having chamfers
- Patent number 10,763,223
- Issue date Sep 1, 2020
- Siliconware Precision Industries Co., Ltd.
- Po-Hao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,741,650
- Issue date Aug 11, 2020
- TOSHIBA MEMORY CORPORATION
- Tsutomu Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Receiver optical module and process of assembling the same
- Patent number 10,734,369
- Issue date Aug 4, 2020
- Sumitomo Electric Device Innovations, Inc.
- Kyohei Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing light emitting device
- Patent number 10,714,663
- Issue date Jul 14, 2020
- Nichia Corporation
- Daisuke Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel tile structures and layouts
- Patent number 10,700,052
- Issue date Jun 30, 2020
- Dolby Laboratories Licensing Corporation
- Ajit Ninan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,692,861
- Issue date Jun 23, 2020
- Rohm Co., Ltd.
- Masatoshi Aketa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor module and sensor chip thereof
- Patent number 10,672,937
- Issue date Jun 2, 2020
- PixArt Imaging Inc.
- Chi-Chih Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Selective recess
- Patent number 10,658,313
- Issue date May 19, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making multi-die package with bridge layer
- Patent number 10,643,861
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies and cooling structures having metalized exte...
- Patent number 10,615,100
- Issue date Apr 7, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and light-emitting device
- Patent number 10,608,147
- Issue date Mar 31, 2020
- Nichia Corporation
- Ryoji Naka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,529,744
- Issue date Jan 7, 2020
- Japan Display Inc.
- Tetsuya Okamae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading device and method
- Patent number 10,461,014
- Issue date Oct 29, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Heat Spreading Device and Method
- Publication number 20210280491
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE HAVING CHAMFERS
- Publication number 20200350261
- Publication date Nov 5, 2020
- Siliconware Precision Industries Co., Ltd.
- Po-Hao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECEIVER OPTICAL MODULE AND PROCESS OF ASSEMBLING THE SAME
- Publication number 20200328199
- Publication date Oct 15, 2020
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kyohei MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Making Multi-Die Package With Bridge Layer
- Publication number 20200266074
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS ASSEMBLIES AND COOLING STRUCTURES HAVING METALIZED EXTE...
- Publication number 20200194342
- Publication date Jun 18, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADING DEVICE AND METHOD
- Publication number 20200051888
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE (LED) COMPONENTS AND METHODS
- Publication number 20200043905
- Publication date Feb 6, 2020
- Cree, Inc.
- Jesse Colin Reiherzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20200006327
- Publication date Jan 2, 2020
- Rohm Co., Ltd.
- Masatoshi AKETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTO-SENSITIVE SILICON PACKAGE EMBEDDING SELF-POWERED ELECTRONIC S...
- Publication number 20190385992
- Publication date Dec 19, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-RECTANGULAR ELECTRONIC DEVICE COMPONENTS
- Publication number 20190304931
- Publication date Oct 3, 2019
- Intel Corporation
- Pramod Malatkar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE ENCAPSULATION IN OXIDE BONDED WAFER STACK
- Publication number 20190221547
- Publication date Jul 18, 2019
- Raytheon Company
- John J. Drab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light Emitting Device and Fluidic Manufacture Thereof
- Publication number 20190181304
- Publication date Jun 13, 2019
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND LIGHT-EMITTING DEVICE
- Publication number 20190088826
- Publication date Mar 21, 2019
- Nichia Corporation.
- Ryoji NAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR DETERMINING A CHARACTERISTIC OF A FLUID HAVING A DEVI...
- Publication number 20190079055
- Publication date Mar 14, 2019
- INFINEON TECHNOLOGIES AG
- Rui Miguel Moreira Araujo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCI...
- Publication number 20180350730
- Publication date Dec 6, 2018
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED BANDWIDTH
- Publication number 20180102343
- Publication date Apr 12, 2018
- MEDIATEK INC.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20170287939
- Publication date Oct 5, 2017
- Japan Display Inc.
- Tetsuya OKAMAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCI...
- Publication number 20170278775
- Publication date Sep 28, 2017
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Non-Rectangular Electronic Device Components
- Publication number 20170186705
- Publication date Jun 29, 2017
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT ARRANGEMENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140371744
- Publication date Dec 18, 2014
- Koninklijke Philips N.V.
- Ronald Dekker
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PROCESS FOR FABRICATING A THREE-DIMENSIONAL INTEGRATED STRUCTURE WI...
- Publication number 20140361413
- Publication date Dec 11, 2014
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION DEVICE EMBEDDED WITHIN A MICROELECTRONIC DIE
- Publication number 20140353817
- Publication date Dec 4, 2014
- Manohar S Konchady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140332983
- Publication date Nov 13, 2014
- Yen-Shih HO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140332969
- Publication date Nov 13, 2014
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140264785
- Publication date Sep 18, 2014
- Xintec Inc.
- Yi-Min LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR ARRAY PACKAGE
- Publication number 20140227833
- Publication date Aug 14, 2014
- Apple Inc.
- Shawn X. Arnold
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...
- Publication number 20140225259
- Publication date Aug 14, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SAME
- Publication number 20140225126
- Publication date Aug 14, 2014
- Rohm Co., Ltd.
- Masatoshi Aketa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR FORMING RECESSES OF...
- Publication number 20140217423
- Publication date Aug 7, 2014
- PANASONIC CORPORATION
- Toshiyuki FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREFORM INCLUDING A GROOVE EXTENDING TO AN EDGE OF THE PREFORM
- Publication number 20140206149
- Publication date Jul 24, 2014
- TriQuint Semiconductor, Inc.
- Shixi Louis Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

being other than a cuboid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light emitting diode (LED) components and methods

Light emitting device and fluidic manufacture thereof

Multi-die package with bridge layer

Electronic package and substrate structure having chamfers

Photo-sensitive silicon package embedding self-powered electronic s...

Receiver optical module and process of assembling the same

Electronics assemblies and cooling structures having metalized exte...

Semiconductor device having a cooling body with a groove

Heat spreading device and method

Manufacturing method of sensor chip package structure

Light emitting device and fluidic manufacture thereof

High bandwidth memory (HBM) bandwidth aggregation switch

Chip packaging structure, chip module and electronic terminal

Pressure sensor, in particular a microphone with improved layout

Die encapsulation in oxide bonded wafer stack

Microelectronic device stacks having interior window wirebonding

Systems and methods for electromagnetic interference shielding

Substrate structure having chamfers

Semiconductor device and method of manufacturing the same

Receiver optical module and process of assembling the same

Method of manufacturing light emitting device

Pixel tile structures and layouts

Method of manufacturing a semiconductor device

Optical sensor module and sensor chip thereof

Selective recess

Methods for making multi-die package with bridge layer

Electronics assemblies and cooling structures having metalized exte...

Package and light-emitting device

Display device

Heat spreading device and method

Patents Applicationslast 30 patents

Heat Spreading Device and Method

ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE HAVING CHAMFERS

RECEIVER OPTICAL MODULE AND PROCESS OF ASSEMBLING THE SAME

Methods for Making Multi-Die Package With Bridge Layer

ELECTRONICS ASSEMBLIES AND COOLING STRUCTURES HAVING METALIZED EXTE...

HEAT SPREADING DEVICE AND METHOD

LIGHT EMITTING DIODE (LED) COMPONENTS AND METHODS

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

PHOTO-SENSITIVE SILICON PACKAGE EMBEDDING SELF-POWERED ELECTRONIC S...

NON-RECTANGULAR ELECTRONIC DEVICE COMPONENTS

DIE ENCAPSULATION IN OXIDE BONDED WAFER STACK

Light Emitting Device and Fluidic Manufacture Thereof

PACKAGE AND LIGHT-EMITTING DEVICE

APPARATUS FOR DETERMINING A CHARACTERISTIC OF A FLUID HAVING A DEVI...

SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCI...

SEMICONDUCTOR PACKAGE WITH IMPROVED BANDWIDTH

DISPLAY DEVICE

SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCI...

Non-Rectangular Electronic Device Components

ELECTRONIC CIRCUIT ARRANGEMENT AND METHOD OF MANUFACTURING THE SAME

PROCESS FOR FABRICATING A THREE-DIMENSIONAL INTEGRATED STRUCTURE WI...

HEAT DISSIPATION DEVICE EMBEDDED WITHIN A MICROELECTRONIC DIE

STACKED CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

SENSOR ARRAY PACKAGE

SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...

SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SAME

SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR FORMING RECESSES OF...

PREFORM INCLUDING A GROOVE EXTENDING TO AN EDGE OF THE PREFORM