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H01L2224/85055

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Bonding wire having a silver alloy core, wire bonding method using...
- Patent number 10,658,326
- Issue date May 19, 2020
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing semiconductor device
- Patent number 4,732,313
- Issue date Mar 22, 1988
- Kabushiki Kaisha Toshiba
- Mituo Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonder with controlled atmosphere
- Patent number 4,549,059
- Issue date Oct 22, 1985
- NEC Corporation
- Atsushi Kamijo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING WIRE CLEANING UNIT AND METHOD OF WIRE BONDING USING THE SAME
- Publication number 20090039141
- Publication date Feb 12, 2009
- KULICKE AND SOFFA INDUSTRIES, INC.
- Horst Clauberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding wire cleaning unit and method of wire bonding using same
- Publication number 20060219754
- Publication date Oct 5, 2006
- Horst Clauberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR