being oxidating

Industry

CPC
H01L2224/81055

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81055being oxidating

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Interconnect structure for semiconductor with ultra-fine pitch and...
- Patent number 11,742,316
- Issue date Aug 29, 2023
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting Method of a semiconductor device using a colored auxiliary...
- Patent number 10,786,876
- Issue date Sep 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low alpha tin
- Patent number 9,425,164
- Issue date Aug 23, 2016
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joint reflow process for reducing packaging failure rate
- Patent number 9,010,617
- Issue date Apr 21, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method for three-dimensional integrated circuit and three-d...
- Patent number 8,508,041
- Issue date Aug 13, 2013
- National Chiao Tung University
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive bonding material, method for bonding conductor, a...
- Patent number 8,418,910
- Issue date Apr 16, 2013
- Fujitsu Limited
- Takatoyo Yamakami
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic element that includes multilayered bonding interface bet...
- Patent number 7,960,834
- Issue date Jun 14, 2011
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCTURE FOR SEMICONDUCTOR WITH ULTRA-FINE PITCH AND...
- Publication number 20220415846
- Publication date Dec 29, 2022
- Guangdong University of Technology
- Yu ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME
- Publication number 20180236613
- Publication date Aug 23, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING METHOD FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT AND THREE-D...
- Publication number 20130069248
- Publication date Mar 21, 2013
- NATIONAL CHIAO-TUNG UNIVERSITY
- KUAN-NENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, A...
- Publication number 20120211549
- Publication date Aug 23, 2012
- Fujitsu Limited
- Takatoyo YAMAKAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Joint Reflow Process for Reducing Packaging Failure Rate
- Publication number 20120175403
- Publication date Jul 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Element, Electronic Element Device Using the Same, and M...
- Publication number 20090039507
- Publication date Feb 12, 2009
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- H01 - BASIC ELECTRIC ELEMENTS

being oxidating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interconnect structure for semiconductor with ultra-fine pitch and...

Mounting Method of a semiconductor device using a colored auxiliary...

Low alpha tin

Solder joint reflow process for reducing packaging failure rate

Bonding method for three-dimensional integrated circuit and three-d...

Electroconductive bonding material, method for bonding conductor, a...

Electronic element that includes multilayered bonding interface bet...

Patents Applicationslast 30 patents

INTERCONNECT STRUCTURE FOR SEMICONDUCTOR WITH ULTRA-FINE PITCH AND...

AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME

BONDING METHOD FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT AND THREE-D...

ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, A...

Solder Joint Reflow Process for Reducing Packaging Failure Rate

Electronic Element, Electronic Element Device Using the Same, and M...