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H01L2224/80055

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80055being oxidating

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Patents Grantslast 30 patents

Information Patent Grant
Chemical bonding method, package-type electronic component, and hyb...
- Patent number 11,916,038
- Issue date Feb 27, 2024
- Canon Anelva Corporation
- Takayuki Saitoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Direct bonding method
- Patent number 10,236,210
- Issue date Mar 19, 2019
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Aurélie Tauzin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a structure by assembling at least two elemen...
- Patent number 9,922,953
- Issue date Mar 20, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Paul Gondcharton
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL BONDING METHOD, PACKAGE-TYPE ELECTRONIC COMPONENT, AND HYB...
- Publication number 20230051810
- Publication date Feb 16, 2023
- Canon ANELVA Corporation
- Takayuki SAITOH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integrated Alignment and Bonding System
- Publication number 20100122456
- Publication date May 20, 2010
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS