being pressure sensitive

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H01L2924/0782

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/0782being pressure sensitive

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Patents Grantslast 30 patents

Information Patent Grant
Display device and manufacturing method thereof, electronic device
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- Issue date Feb 21, 2023
- BOE Technology Group Co., Ltd.
- Junbo Wei
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Information Patent Grant
Wafer laminate and making method
- Patent number 10,453,732
- Issue date Oct 22, 2019
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Fluoro-silicone compositions as temporary bonding adhesives
- Patent number 10,147,631
- Issue date Dec 4, 2018
- Dow Silicones Corporation
- Peng-Fei Fu
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
FLUORO-SILICONE COMPOSITIONS AS TEMPORARY BONDING ADHESIVES
- Publication number 20180090362
- Publication date Mar 29, 2018
- Dow Corning Corporation
- Peng-Fei FU
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER LAMINATE AND MAKING METHOD
- Publication number 20170154802
- Publication date Jun 1, 2017
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
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