being pulsed

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H01L2924/40102

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/40102being pulsed

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Patents Grantslast 30 patents

Information Patent Grant
Solar cell and method of manufacturing the same
- Patent number 11,404,597
- Issue date Aug 2, 2022
- MATERIAL CONCEPT, INC.
- Junichi Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing method
- Patent number 11,114,341
- Issue date Sep 7, 2021
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser welding method
- Patent number 10,442,035
- Issue date Oct 15, 2019
- Fuji Electric Co., Ltd.
- Yuta Tamai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal member, metal member surface processing method, semiconductor...
- Patent number 9,517,532
- Issue date Dec 13, 2016
- Denso Corporation
- Wataru Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite substrate manufacturing method, semiconductor element man...
- Patent number 9,455,229
- Issue date Sep 27, 2016
- Namiki Seimitsu Houseki Kabushiki Kaisha
- Hideo Aida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser welding method, laser welding jig, and semiconductor device
- Patent number 9,399,268
- Issue date Jul 26, 2016
- Fuji Electric Co., Ltd.
- Yuta Tamai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION
- Publication number 20230369284
- Publication date Nov 16, 2023
- Pac Tech - Packaging Technologies GmbH
- RICARDO GEELHAAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROCESSING METHOD
- Publication number 20200135563
- Publication date Apr 30, 2020
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND PROCESS FOR EMIB CHIP INTERCONNECTIONS
- Publication number 20170018525
- Publication date Jan 19, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL MEMBER, METAL MEMBER SURFACE PROCESSING METHOD, SEMICONDUCTOR...
- Publication number 20160207148
- Publication date Jul 21, 2016
- Denso Corporation
- Wataru KOBAYASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT COMPRI...
- Publication number 20150348893
- Publication date Dec 3, 2015
- NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- CHIH WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER WELDING METHOD, LASER WELDING JIG, AND SEMICONDUCTOR DEVICE
- Publication number 20150179539
- Publication date Jun 25, 2015
- Fuji Electric Co., Ltd.
- Yuta TAMAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE SUBSTRATE MANUFACTURING METHOD, SEMICONDUCTOR ELEMENT MAN...
- Publication number 20150076662
- Publication date Mar 19, 2015
- NAMIKI SEIMITSU HOUSEKI KABUSHIKIKAISHA
- Hideo Aida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION METHOD AND RECIPE FOR SACRIFICIAL MATERIAL PATTERNIN...
- Publication number 20150072515
- Publication date Mar 12, 2015
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS

being pulsed

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solar cell and method of manufacturing the same

Laser processing method

Laser welding method

Metal member, metal member surface processing method, semiconductor...

Composite substrate manufacturing method, semiconductor element man...

Laser welding method, laser welding jig, and semiconductor device

Patents Applicationslast 30 patents

CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION

LASER PROCESSING METHOD

METHOD AND PROCESS FOR EMIB CHIP INTERCONNECTIONS

METAL MEMBER, METAL MEMBER SURFACE PROCESSING METHOD, SEMICONDUCTOR...

METHOD OF MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT COMPRI...

LASER WELDING METHOD, LASER WELDING JIG, AND SEMICONDUCTOR DEVICE

COMPOSITE SUBSTRATE MANUFACTURING METHOD, SEMICONDUCTOR ELEMENT MAN...

LASER ABLATION METHOD AND RECIPE FOR SACRIFICIAL MATERIAL PATTERNIN...