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H01L2224/32054

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32054being rectangular or square

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,119,337
- Issue date Oct 15, 2024
- Kioxia Corporation
- Junichi Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,100,635
- Issue date Sep 24, 2024
- Samsung Electronics Co., Ltd.
- Sanghoon Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor arrangement
- Patent number 11,955,450
- Issue date Apr 9, 2024
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method for producing the same
- Patent number 11,688,712
- Issue date Jun 27, 2023
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,658,169
- Issue date May 23, 2023
- Kioxia Corporation
- Junichi Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder mask design for delamination prevention
- Patent number 11,476,174
- Issue date Oct 18, 2022
- Intel Corporation
- James Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts and method for manufacturing the same, circuit assembly...
- Patent number 10,867,945
- Issue date Dec 15, 2020
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts and method for manufacturing the same, circuit assembly...
- Patent number 10,468,362
- Issue date Nov 5, 2019
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts and method for manufacturing the same, circuit assembly...
- Patent number 9,859,240
- Issue date Jan 2, 2018
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,627,350
- Issue date Apr 18, 2017
- Mitsubishi Electric Corporation
- Yasunari Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eutectic solder structure for chip
- Patent number 9,214,443
- Issue date Dec 15, 2015
- Lextar Electronics Corporation
- Yi-Jyun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromechanical method and corresponding assembly for bonding semic...
- Patent number 8,638,000
- Issue date Jan 28, 2014
- Robert Bosch GmbH
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit system with test pads and method of manufacture...
- Patent number 8,614,508
- Issue date Dec 24, 2013
- Stats Chippac Ltd.
- Bao Xusheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaged integrated circuit
- Patent number 8,421,175
- Issue date Apr 16, 2013
- STMicroelectronics ( Research & Development) Limited
- Robert Nicol
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VIA ARRAY IN A REDISTRIBUTION LAYER STRUCTURE FOR STRESS RELIEF
- Publication number 20250015007
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20240421114
- Publication date Dec 19, 2024
- Mitsubishi Electric Corporation
- Norikazu SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING
- Publication number 20240222216
- Publication date Jul 4, 2024
- Intel Corporation
- Zhixin XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20240120306
- Publication date Apr 11, 2024
- UNITED MICROELECTRONICS CORP.
- Kai-Kuang Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POLYMER LAYER
- Publication number 20240071976
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055338
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Byungho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE
- Publication number 20240038795
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Sang-Uk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240038712
- Publication date Feb 1, 2024
- Advanced Semiconductor Engineering, Inc.
- Jung Jui KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE PREVENTING SOLDER OVERFLOW
- Publication number 20230395553
- Publication date Dec 7, 2023
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230282633
- Publication date Sep 7, 2023
- KIOXIA Corporation
- Junichi SHIBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR ARRANGEMENT
- Publication number 20230275059
- Publication date Aug 31, 2023
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230268310
- Publication date Aug 24, 2023
- KIOXIA Corporation
- Satoru ITAKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230163092
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Soohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING ADHESIVE MEMBERS
- Publication number 20230098993
- Publication date Mar 30, 2023
- Samsung Electronics Co., Ltd.
- Jooyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230091217
- Publication date Mar 23, 2023
- Kabushiki Kaisha Toshiba
- Yoko YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220020656
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- Sanghoon JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210296299
- Publication date Sep 23, 2021
- KIOXIA Corporation
- Junichi SHIBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Arrangement and Method for Producing the Same
- Publication number 20200266171
- Publication date Aug 20, 2020
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MASK DESIGN FOR DELAMINATION PREVENTION
- Publication number 20200135602
- Publication date Apr 30, 2020
- Intel Corporation
- James ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY...
- Publication number 20200013737
- Publication date Jan 9, 2020
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY...
- Publication number 20180108628
- Publication date Apr 19, 2018
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE AND SUBSTRATE ASSEMBLY WITH GRADED DENSITY BONDING LAYER
- Publication number 20170294397
- Publication date Oct 12, 2017
- HAMILTON SUNDSTRAND CORPORATION
- Paul F. Croteau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160322327
- Publication date Nov 3, 2016
- Mitsubishi Electric Corporation
- Yasunari HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160276312
- Publication date Sep 22, 2016
- Kabushiki Kaisha Toshiba
- Shinya SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EUTECTIC SOLDER STRUCTURE FOR CHIP
- Publication number 20150108650
- Publication date Apr 23, 2015
- Lextar Electronics Corporation
- Yi-Jyun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL M...
- Publication number 20140291834
- Publication date Oct 2, 2014
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20140224862
- Publication date Aug 14, 2014
- Fuji Electric Co., Ltd.
- Takeshi MATSUSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH TEST PADS AND METHOD OF MANUFACTURE...
- Publication number 20130069063
- Publication date Mar 21, 2013
- Bao Xusheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical Method and Corresponding Assembly for Bonding Semic...
- Publication number 20120280409
- Publication date Nov 8, 2012
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PACKAGED INTEGRATED CIRCUIT
- Publication number 20110057281
- Publication date Mar 10, 2011
- STMicroelectronics (Research & Development) Limited
- ROBERT NICOL
- H01 - BASIC ELECTRIC ELEMENTS

being rectangular or square

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing a semiconductor device

Semiconductor package and method of fabricating the same

Method for producing a semiconductor arrangement

Semiconductor arrangement and method for producing the same

Semiconductor device

Solder mask design for delamination prevention

Chip parts and method for manufacturing the same, circuit assembly...

Chip parts and method for manufacturing the same, circuit assembly...

Chip parts and method for manufacturing the same, circuit assembly...

Method for manufacturing semiconductor device

Eutectic solder structure for chip

Micromechanical method and corresponding assembly for bonding semic...

Integrated circuit system with test pads and method of manufacture...

Wafer level packaged integrated circuit

Patents Applicationslast 30 patents

VIA ARRAY IN A REDISTRIBUTION LAYER STRUCTURE FOR STRESS RELIEF

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE WITH A POLYMER LAYER

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE DEVICE PREVENTING SOLDER OVERFLOW

SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING A SEMICONDUCTOR ARRANGEMENT

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES HAVING ADHESIVE MEMBERS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

Semiconductor Arrangement and Method for Producing the Same

SOLDER MASK DESIGN FOR DELAMINATION PREVENTION

CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY...

CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY...

DIE AND SUBSTRATE ASSEMBLY WITH GRADED DENSITY BONDING LAYER

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

EUTECTIC SOLDER STRUCTURE FOR CHIP

SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL M...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT SYSTEM WITH TEST PADS AND METHOD OF MANUFACTURE...

Micromechanical Method and Corresponding Assembly for Bonding Semic...

WAFER LEVEL PACKAGED INTEGRATED CIRCUIT