being rectangular

Industry

CPC
H01L2224/08054

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/08054being rectangular

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip having chip pads of different surface areas, and...
- Patent number 11,682,643
- Issue date Jun 20, 2023
- SK hynix Inc.
- Ju Il Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switch device having a pulldown transistor and a voltage clamp
- Patent number 11,329,646
- Issue date May 10, 2022
- Infineon Technologies Austria AG
- Kennith Kin Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad on a back side illuminated image sensor
- Patent number 11,011,566
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Volume Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transformer-based driver for power switches
- Patent number 10,958,268
- Issue date Mar 23, 2021
- Infineon Technologies Austria AG
- Kennith Kin Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 10,204,863
- Issue date Feb 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 10,134,718
- Issue date Nov 20, 2018
- Mitsubishi Electric Corporation
- Yasushige Mukunoki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor package structure
- Patent number 9,997,465
- Issue date Jun 12, 2018
- TAIWAN SEMICONDUCTOR MANUFACUTURING CO., LTD.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with an anti-pad peeling structure and associa...
- Patent number 9,711,478
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Kai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die edge side connection
- Patent number 9,209,143
- Issue date Dec 8, 2015
- Intel IP Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CRUCIFORM BONDING STRUCTURE FOR 3D-IC
- Publication number 20240128216
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230317657
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Wonil SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230044711
- Publication date Feb 9, 2023
- Fuji Electric Co., Ltd.
- Tomofumi OOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230005885
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Hyemi Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING CHIP PADS OF DIFFERENT SURFACE AREAS, AND...
- Publication number 20220173061
- Publication date Jun 2, 2022
- SK HYNIX INC.
- Ju Il EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20180294227
- Publication date Oct 11, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20180190636
- Publication date Jul 5, 2018
- MITSUBISHI ELECTRIC CORPORATION
- Yasushige MUKUNOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20180151499
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AN ANTI-PAD PEELING STRUCTURE AND ASSOCIA...
- Publication number 20170110429
- Publication date Apr 20, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-KAI CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Pad on a Back Side Illuminated Image Sensor
- Publication number 20160148967
- Publication date May 26, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Volume Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH OVERLAPPED LEAD TERMINALS
- Publication number 20140361444
- Publication date Dec 11, 2014
- Renesas Electronics Corporation
- Hiroaki NARITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD ON A BACK SIDE ILLUMINATED IMAGE SENSOR
- Publication number 20140225215
- Publication date Aug 14, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- VOLUME CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20110074016
- Publication date Mar 31, 2011
- Renesas Electronics Corporation
- Hiroaki NARITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

being rectangular

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor chip having chip pads of different surface areas, and...

Switch device having a pulldown transistor and a voltage clamp

Bonding pad on a back side illuminated image sensor

Transformer-based driver for power switches

Semiconductor package structure

Power semiconductor module

Semiconductor package structure

Semiconductor device with an anti-pad peeling structure and associa...

Die edge side connection

Patents Applicationslast 30 patents

CRUCIFORM BONDING STRUCTURE FOR 3D-IC

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP HAVING CHIP PADS OF DIFFERENT SURFACE AREAS, AND...

SEMICONDUCTOR PACKAGE STRUCTURE

POWER SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE WITH AN ANTI-PAD PEELING STRUCTURE AND ASSOCIA...

Bonding Pad on a Back Side Illuminated Image Sensor

SEMICONDUCTOR DEVICE WITH OVERLAPPED LEAD TERMINALS

BONDING PAD ON A BACK SIDE ILLUMINATED IMAGE SENSOR

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR