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H01L2224/80065

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80065being reducing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Gas-controlled bonding platform for edge defect reduction during wa...
- Patent number 10,777,433
- Issue date Sep 15, 2020
- ELPIS TECHNOLOGIES INC.
- Wei Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,354,972
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,103,122
- Issue date Oct 16, 2018
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 9,748,198
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding and apparatus for performing the same
- Patent number 9,331,032
- Issue date May 3, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 9,048,283
- Issue date Jun 2, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for bonding of chips on wafers
- Patent number 8,927,335
- Issue date Jan 6, 2015
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming bonded semiconductor structures
- Patent number 8,866,305
- Issue date Oct 21, 2014
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming bonded semiconductor structures
- Patent number 8,481,406
- Issue date Jul 9, 2013
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20190051628
- Publication date Feb 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20170358551
- Publication date Dec 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding and Apparatus for Performing the Same
- Publication number 20140256087
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20140011324
- Publication date Jan 9, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES
- Publication number 20130299997
- Publication date Nov 14, 2013
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING OF CHIPS ON WAFERS
- Publication number 20120184069
- Publication date Jul 19, 2012
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCT...
- Publication number 20120013012
- Publication date Jan 19, 2012
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS

being reducing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Gas-controlled bonding platform for edge defect reduction during wa...

Hybrid bonding systems and methods for semiconductor wafers

Hybrid bonding systems and methods for semiconductor wafers

Hybrid bonding systems and methods for semiconductor wafers

Hybrid bonding and apparatus for performing the same

Chip-on-wafer bonding method and bonding device, and structure comp...

Hybrid bonding systems and methods for semiconductor wafers

Method for bonding of chips on wafers

Methods of forming bonded semiconductor structures

Methods of forming bonded semiconductor structures

Patents Applicationslast 30 patents

Hybrid Bonding Systems and Methods for Semiconductor Wafers

Hybrid Bonding Systems and Methods for Semiconductor Wafers

Hybrid Bonding and Apparatus for Performing the Same

Hybrid Bonding Systems and Methods for Semiconductor Wafers

METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES

METHOD FOR BONDING OF CHIPS ON WAFERS

METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCT...