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H01L2224/85065

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85065being reducing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,840,208
- Issue date Nov 17, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,672,733
- Issue date Jun 2, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,525,555
- Issue date Jan 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,497,663
- Issue date Dec 3, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,461,055
- Issue date Oct 29, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,414,002
- Issue date Sep 17, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silver bonding wire for semiconductor device containing indium, gal...
- Patent number 10,381,320
- Issue date Aug 13, 2019
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,236,272
- Issue date Mar 19, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,137,534
- Issue date Nov 27, 2018
- Nippon Micrometal Corporation
- Takashi Yamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,121,758
- Issue date Nov 6, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method for forming ball in bonding wire
- Patent number 10,121,764
- Issue date Nov 6, 2018
- Nippon Micrometal Corporation
- Noritoshi Araki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,972,598
- Issue date May 15, 2018
- Renesas Electronics Corporation
- Yuki Yagyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 9,887,172
- Issue date Feb 6, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding structure of bonding wire
- Patent number 9,331,049
- Issue date May 3, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 9,112,059
- Issue date Aug 18, 2015
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for obtaining a palladium surface finish for copper wire bon...
- Patent number 8,987,910
- Issue date Mar 24, 2015
- Atotech Deutschland GmbH
- Mustafa Özkök
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor
- Patent number 8,815,019
- Issue date Aug 26, 2014
- Nippon Steel & Sumikin Materials., Ltd.
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor
- Patent number 8,742,258
- Issue date Jun 3, 2014
- Nippon Steel & Sumikin Materials Co., Ltd.
- Shinichi Terashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,586,416
- Issue date Nov 19, 2013
- Renesas Electronics Corporation
- Masahiko Sekihara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit including bond wire directly bonded to pad
- Patent number 8,432,024
- Issue date Apr 30, 2013
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 8,389,860
- Issue date Mar 5, 2013
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 8,299,356
- Issue date Oct 30, 2012
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper on organic solderability preservative (OSP) interconnect and...
- Patent number 8,247,272
- Issue date Aug 21, 2012
- United Test & Assembly Center Ltd.
- Yong Chuan Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding structure and method for forming same
- Patent number 8,247,911
- Issue date Aug 21, 2012
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding wire and wire bonding method
- Patent number 8,102,061
- Issue date Jan 24, 2012
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Work clamp and wire bonding apparatus
- Patent number 7,975,899
- Issue date Jul 12, 2011
- Kaijo Corporation
- Riki Jindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and wire bonding method
- Patent number 7,975,901
- Issue date Jul 12, 2011
- Shinkawa Ltd.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 7,952,028
- Issue date May 31, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
- Publication number 20200013747
- Publication date Jan 9, 2020
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
- Publication number 20190164927
- Publication date May 30, 2019
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180122765
- Publication date May 3, 2018
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR FORMING BALL IN BONDING WIRE
- Publication number 20180096965
- Publication date Apr 5, 2018
- NIPPON MICROMETAL CORPORATION
- Noritoshi ARAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180082977
- Publication date Mar 22, 2018
- RENESAS ELECTRONICS CORPORATION
- Yuki YAGYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR
- Publication number 20130306352
- Publication date Nov 21, 2013
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Shinichi Terashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR OBTAINING A PALLADIUM SURFACE FINISH FOR COPPER WIRE BON...
- Publication number 20130288475
- Publication date Oct 31, 2013
- Atotech Deutschland GmbH
- Mustafa Özkök
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120302009
- Publication date Nov 29, 2012
- RENESAS ELECTRONICS CORPORATION
- Masahiko SEKIHARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR
- Publication number 20120118610
- Publication date May 17, 2012
- NIPPON MICROMETAL CORPORATION
- Shinichi Terashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20120104613
- Publication date May 3, 2012
- NIPPON MICROMETAL CORPORATION
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING BOND WIRE DIRECTLY BONDED TO PAD
- Publication number 20110260307
- Publication date Oct 27, 2011
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR
- Publication number 20110120594
- Publication date May 26, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING STRUCTURE OF BONDING WIRE
- Publication number 20110104510
- Publication date May 5, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING GAS KIT DESIGN FOR COPPER BONDING
- Publication number 20110017806
- Publication date Jan 27, 2011
- Jerry Gomez Cayabyab
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20110011619
- Publication date Jan 20, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD
- Publication number 20100327450
- Publication date Dec 30, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20100294435
- Publication date Nov 25, 2010
- SHINKAWA LTD.
- Toru MAEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20100294532
- Publication date Nov 25, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20100282495
- Publication date Nov 11, 2010
- NIPPON STEEL MATERIALS CO., LTD
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING STRUCTURE OF BONDING WIRE AND METHOD FOR FORMING SAME
- Publication number 20100213619
- Publication date Aug 26, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100200981
- Publication date Aug 12, 2010
- Advanced Semiconductor Engineering, Inc.
- Wen Pin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding apparatus and ball forming method
- Publication number 20100078464
- Publication date Apr 1, 2010
- KABUSHIKI KAISHA SHINKAWA
- Shinichi Nishiura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT AND...
- Publication number 20100025849
- Publication date Feb 4, 2010
- United Test & Assembly Center Ltd.
- Yong Chuan KOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Work Clamp and Wire Bonding Apparatus
- Publication number 20090134201
- Publication date May 28, 2009
- Riki Jindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE CLEANING UNIT AND METHOD OF WIRE BONDING USING THE SAME
- Publication number 20090039141
- Publication date Feb 12, 2009
- KULICKE AND SOFFA INDUSTRIES, INC.
- Horst Clauberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for protecting metal surfaces
- Publication number 20070071900
- Publication date Mar 29, 2007
- Philippe Soussan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of realizing direct bonding between metal wires and copper p...
- Publication number 20070010083
- Publication date Jan 11, 2007
- Jong-Ning Aoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding wire cleaning unit and method of wire bonding using same
- Publication number 20060219754
- Publication date Oct 5, 2006
- Horst Clauberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding wire
- Publication number 20040245320
- Publication date Dec 9, 2004
- Mesato Fukagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump connection and method and apparatus for forming said connection
- Publication number 20020185735
- Publication date Dec 12, 2002
- International Business Machines Corporation
- Hiroyuki Sakurai
- H01 - BASIC ELECTRIC ELEMENTS

being reducing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Cu alloy core bonding wire with Pd coating for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Cu alloy core bonding wire with Pd coating for semiconductor device

Cu alloy core bonding wire with Pd coating for semiconductor device

Bonding wire for semiconductor device

Silver bonding wire for semiconductor device containing indium, gal...

Cu alloy core bonding wire with Pd coating for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Method for forming ball in bonding wire

Method of manufacturing semiconductor device

Bonding wire for semiconductor device

Bonding structure of bonding wire

Bonding wire for semiconductor device

Method for obtaining a palladium surface finish for copper wire bon...

Bonding wire for semiconductor

Bonding wire for semiconductor

Method of manufacturing semiconductor device

Integrated circuit including bond wire directly bonded to pad

Bonding wire for semiconductor devices

Bonding wire for semiconductor devices

Copper on organic solderability preservative (OSP) interconnect and...

Wire bonding structure and method for forming same

Semiconductor device bonding wire and wire bonding method

Work clamp and wire bonding apparatus

Bonding apparatus and wire bonding method

Bonding wire for semiconductor device

Patents Applicationslast 30 patents

Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

METHOD FOR FORMING BALL IN BONDING WIRE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR

METHOD FOR OBTAINING A PALLADIUM SURFACE FINISH FOR COPPER WIRE BON...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR

BONDING WIRE FOR SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT INCLUDING BOND WIRE DIRECTLY BONDED TO PAD

BONDING WIRE FOR SEMICONDUCTOR

BONDING STRUCTURE OF BONDING WIRE

FORMING GAS KIT DESIGN FOR COPPER BONDING

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD

BONDING APPARATUS AND WIRE BONDING METHOD

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING STRUCTURE OF BONDING WIRE AND METHOD FOR FORMING SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Wire bonding apparatus and ball forming method

COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT AND...

Work Clamp and Wire Bonding Apparatus

BONDING WIRE CLEANING UNIT AND METHOD OF WIRE BONDING USING THE SAME

Methods for protecting metal surfaces

Method of realizing direct bonding between metal wires and copper p...

Bonding wire cleaning unit and method of wire bonding using same

Bonding wire

Bump connection and method and apparatus for forming said connection