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H01L2224/08055

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/08055being square

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip bonding method and semiconductor chip structure
- Patent number 12,119,315
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having chip pads of different surface areas, and...
- Patent number 11,682,643
- Issue date Jun 20, 2023
- SK hynix Inc.
- Ju Il Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 10,134,718
- Issue date Nov 20, 2018
- Mitsubishi Electric Corporation
- Yasushige Mukunoki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device
- Patent number 9,570,446
- Issue date Feb 14, 2017
- Samsung Electronics Co., Ltd.
- Hyo Seok Woo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-WAFER BONDING FOR NAND SCALING
- Publication number 20240250007
- Publication date Jul 25, 2024
- SANDISK TECHNOLOGIES LLC
- Hiroki Yabe
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME
- Publication number 20240203855
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Jaemok JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR THERMAL MANAGEMENT IN HYBRID BONDING
- Publication number 20240153894
- Publication date May 9, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240079362
- Publication date Mar 7, 2024
- SK HYNIX INC.
- Jin Won PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POLYMER LAYER
- Publication number 20240071976
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STORAGE DEVICE
- Publication number 20230411327
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Masayoshi TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411328
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Shinya ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230378110
- Publication date Nov 23, 2023
- Samsung Electronics Co., Ltd.
- MINKI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230369178
- Publication date Nov 16, 2023
- RENESAS ELECTRONICS CORPORATION
- Toshiyuki HATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230317657
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Wonil SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230230946
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Seongyo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230215827
- Publication date Jul 6, 2023
- MURATA MANUFACTURING CO., LTD.
- Kiyohiro KASHIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASTELLATION, HATCHING, AND OTHER SURFACE PATTERNS IN DIELECTRIC SU...
- Publication number 20230060594
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING METHOD AND SEMICONDUCTOR CHIP STRUCTURE
- Publication number 20230011840
- Publication date Jan 12, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- CHIH-WEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230005885
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Hyemi Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...
- Publication number 20220336394
- Publication date Oct 20, 2022
- SANDISK TECHNOLOGIES LLC
- Kensuke ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING CHIP PADS OF DIFFERENT SURFACE AREAS, AND...
- Publication number 20220173061
- Publication date Jun 2, 2022
- SK HYNIX INC.
- Ju Il EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20180190636
- Publication date Jul 5, 2018
- MITSUBISHI ELECTRIC CORPORATION
- Yasushige MUKUNOKI
- H01 - BASIC ELECTRIC ELEMENTS

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Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip bonding method and semiconductor chip structure

Semiconductor chip having chip pads of different surface areas, and...

Power semiconductor module

Semiconductor device

Patents Applicationslast 30 patents

MULTI-WAFER BONDING FOR NAND SCALING

SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME

STRUCTURE FOR THERMAL MANAGEMENT IN HYBRID BONDING

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH A POLYMER LAYER

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STORAGE DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

ELECTRONIC COMPONENT

CASTELLATION, HATCHING, AND OTHER SURFACE PATTERNS IN DIELECTRIC SU...

CHIP BONDING METHOD AND SEMICONDUCTOR CHIP STRUCTURE

SEMICONDUCTOR PACKAGE

BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...

SEMICONDUCTOR CHIP HAVING CHIP PADS OF DIFFERENT SURFACE AREAS, AND...

POWER SEMICONDUCTOR MODULE