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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05014being square

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding method and semiconductor chip structure
- Patent number 12,119,315
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad layout including floating conductive sections
- Patent number 11,887,949
- Issue date Jan 30, 2024
- Macronix International Co., Ltd.
- Su-Chueh Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,862,586
- Issue date Jan 2, 2024
- Kioxia Corporation
- Mizuki Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device structure
- Patent number 11,742,307
- Issue date Aug 29, 2023
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package connector structure and method therefor
- Patent number 11,721,642
- Issue date Aug 8, 2023
- NXP USA, INC.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for semiconductor packaging
- Patent number 11,705,414
- Issue date Jul 18, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,699,641
- Issue date Jul 11, 2023
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for improving bonding reliability
- Patent number 11,658,139
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device structure
- Patent number 11,264,344
- Issue date Mar 1, 2022
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 11,257,767
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of lead frames electrically connected to inductor chip
- Patent number 11,177,198
- Issue date Nov 16, 2021
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,063,009
- Issue date Jul 13, 2021
- Renesas Electronics Corporation
- Kenji Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,037,897
- Issue date Jun 15, 2021
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadless semiconductor packages, leadframes therefor, and methods o...
- Patent number 10,756,006
- Issue date Aug 25, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device structure
- Patent number 10,756,036
- Issue date Aug 25, 2020
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on glass package assembly
- Patent number 10,692,815
- Issue date Jun 23, 2020
- Novatek Microelectronics Corp.
- Wei-Kuo Mai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory chip, semiconductor memory package, and electr...
- Patent number 10,679,956
- Issue date Jun 9, 2020
- Samsung Electronics Co., Ltd.
- Kyoung Soo Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 10,510,700
- Issue date Dec 17, 2019
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and ball bonder
- Patent number 10,497,662
- Issue date Dec 3, 2019
- ABLIC Inc.
- Tomomitsu Risaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with first and second semiconductor chips conn...
- Patent number 10,497,644
- Issue date Dec 3, 2019
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with partially encapsulated cooling channel for cooling an...
- Patent number 10,461,017
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Andreas Grassmann
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device including a clip
- Patent number 10,424,534
- Issue date Sep 24, 2019
- Infineon Technologies AG
- Xavier Arokiasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated package containing MEMS acoustic sensor and pressure sensor
- Patent number 10,351,419
- Issue date Jul 16, 2019
- Invensense, Inc.
- Jia Gao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 10,340,226
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge interconnect packaging of integrated circuits for power systems
- Patent number 10,325,875
- Issue date Jun 18, 2019
- North Carolina State University
- Jason M. Kulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory chip, semiconductor memory package, and electr...
- Patent number 10,269,740
- Issue date Apr 23, 2019
- Samsung Electronics Co., Ltd.
- Kyoung Soo Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and electronic device
- Patent number 10,157,878
- Issue date Dec 18, 2018
- Renesas Electronics Corporation
- Tadatoshi Danno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,109,565
- Issue date Oct 23, 2018
- Renesas Electronics Corporation
- Keita Takada
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062199
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240274556
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Won CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD
- Publication number 20240234366
- Publication date Jul 11, 2024
- NHK Spring Co., Ltd.
- Ryo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD
- Publication number 20240136325
- Publication date Apr 25, 2024
- NHK Spring Co., Ltd.
- Ryo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...
- Publication number 20240063151
- Publication date Feb 22, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE HAVING ORGANIC INTERPOSER LAYER AND METHOD FOR...
- Publication number 20240063029
- Publication date Feb 22, 2024
- SJ Semiconductor(Jiangyin) Corporation
- Chengchung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...
- Publication number 20240063153
- Publication date Feb 22, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240055406
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Yeongseon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH THIN FILM RESISTER STRUCTURE
- Publication number 20240047510
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STORAGE DEVICE
- Publication number 20230411327
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Masayoshi TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASIN-SHAPED UNDERBUMP PLATES AND METHODS OF FORMING THE SAME
- Publication number 20230352428
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yen-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
- Publication number 20230299027
- Publication date Sep 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOTTED BOND PAD IN STACKED WAFER STRUCTURE
- Publication number 20230245987
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230132054
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Wooram MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
- Publication number 20230119548
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD LAYOUT INCLUDING FLOATING CONDUCTIVE SECTIONS
- Publication number 20230056520
- Publication date Feb 23, 2023
- Macronix International Co., Ltd.
- Su-Chueh LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING METHOD AND SEMICONDUCTOR CHIP STRUCTURE
- Publication number 20230011840
- Publication date Jan 12, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- CHIH-WEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL HYBRID BONDING SURFACE LAYER USING AN ADAPTABLE INTERCONN...
- Publication number 20220415839
- Publication date Dec 29, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE CONNECTOR STRUCTURE AND METHOD THEREFOR
- Publication number 20220406728
- Publication date Dec 22, 2022
- NXP USA, Inc.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220406739
- Publication date Dec 22, 2022
- KIOXIA Corporation
- Mizuki TAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
- Publication number 20220157753
- Publication date May 19, 2022
- Ovonyx Memory Technology, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR IMPROVING BONDING RELIABILITY
- Publication number 20220037273
- Publication date Feb 3, 2022
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
- Publication number 20200357761
- Publication date Nov 12, 2020
- Ovonyx Memory Technology, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20200098713
- Publication date Mar 26, 2020
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200066619
- Publication date Feb 27, 2020
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Crack Arrestor Structure and Methods
- Publication number 20190326228
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
- Publication number 20190319001
- Publication date Oct 17, 2019
- Ovonyx Memory Technology, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
- Publication number 20190109105
- Publication date Apr 11, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON GLASS PACKAGE ASSEMBLY
- Publication number 20190057938
- Publication date Feb 21, 2019
- NOVATEK MICROELECTRONICS CORP.
- Wei-Kuo Mai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device
- Publication number 20180301429
- Publication date Oct 18, 2018
- ROHM CO., LTD.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS

being square

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Chip bonding method and semiconductor chip structure

Bond pad layout including floating conductive sections

Semiconductor device and method of manufacturing the same

Semiconductor memory device structure

Semiconductor device package connector structure and method therefor

Structure and method for semiconductor packaging

Semiconductor device

Semiconductor package for improving bonding reliability

Semiconductor memory device structure

Interconnect crack arrestor structure and methods

Plurality of lead frames electrically connected to inductor chip

Semiconductor device

Semiconductor device

Contact structures with porous networks for solder connections, and...

Leadless semiconductor packages, leadframes therefor, and methods o...

Semiconductor memory device structure

Chip on glass package assembly

Semiconductor memory chip, semiconductor memory package, and electr...

Semiconductor device

Semiconductor device and ball bonder

Semiconductor device with first and second semiconductor chips conn...

Package with partially encapsulated cooling channel for cooling an...

Semiconductor device including a clip

Integrated package containing MEMS acoustic sensor and pressure sensor

Interconnect crack arrestor structure and methods

Edge interconnect packaging of integrated circuits for power systems

Semiconductor memory chip, semiconductor memory package, and electr...

Semiconductor device and electronic device

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

CIRCUIT BOARD AND MANUFACTURING METHOD

CIRCUIT BOARD AND MANUFACTURING METHOD

SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...

PACKAGING STRUCTURE HAVING ORGANIC INTERPOSER LAYER AND METHOD FOR...

SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT WITH THIN FILM RESISTER STRUCTURE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STORAGE DEVICE

BASIN-SHAPED UNDERBUMP PLATES AND METHODS OF FORMING THE SAME

STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING

SLOTTED BOND PAD IN STACKED WAFER STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

BOND PAD LAYOUT INCLUDING FLOATING CONDUCTIVE SECTIONS

CHIP BONDING METHOD AND SEMICONDUCTOR CHIP STRUCTURE

UNIVERSAL HYBRID BONDING SURFACE LAYER USING AN ADAPTABLE INTERCONN...

SEMICONDUCTOR DEVICE PACKAGE CONNECTOR STRUCTURE AND METHOD THEREFOR

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR MEMORY DEVICE STRUCTURE

SEMICONDUCTOR PACKAGE FOR IMPROVING BONDING RELIABILITY

SEMICONDUCTOR MEMORY DEVICE STRUCTURE

Semiconductor Device

SEMICONDUCTOR DEVICE

Interconnect Crack Arrestor Structure and Methods

SEMICONDUCTOR MEMORY DEVICE STRUCTURE

STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING

CHIP ON GLASS PACKAGE ASSEMBLY

Semiconductor Device