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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for multi-color LED pixel unit with vertical li...
- Patent number 12,074,151
- Issue date Aug 27, 2024
- Jade Bird Display (Shanghai) Limited
- Qunchao Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for multi-color LED pixel unit with vertical li...
- Patent number 12,027,509
- Issue date Jul 2, 2024
- Jade Bird Display (Shanghai) Limited
- Qunchao Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for multi-color LED pixel unit with horizontal...
- Patent number 11,967,589
- Issue date Apr 23, 2024
- Jade Bird Display (Shanghai) Limited
- Qunchao Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive and thermal interface material on a plurality of dies cove...
- Patent number 11,894,287
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 11,837,568
- Issue date Dec 5, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive and thermal interface material on a plurality of dies cove...
- Patent number 11,626,344
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bonding substrates
- Patent number 11,309,278
- Issue date Apr 19, 2022
- Applied Materials, Inc.
- Prayudi Lianto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive and thermal interface material on a plurality of dies cove...
- Patent number 11,239,136
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics module
- Patent number 11,183,489
- Issue date Nov 23, 2021
- Audi AG
- Andreas Apelsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame
- Patent number 9,653,385
- Issue date May 16, 2017
- SDI Corporation
- Ya-Cheng Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder, solder joint structure and method of forming solder joint s...
- Patent number 9,308,603
- Issue date Apr 12, 2016
- Industrial Technology Research Institute
- Kuo-Shu Kao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional (3D) integrated circuit with enhanced copper-to-c...
- Patent number 8,546,956
- Issue date Oct 1, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional (3D) integrated circuit with enhanced copper-to-c...
- Patent number 8,431,436
- Issue date Apr 30, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder preform and electronic component
- Patent number 7,800,230
- Issue date Sep 21, 2010
- Denso Corporation
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, circuit board, electro-optic device, electron...
- Patent number 7,375,427
- Issue date May 20, 2008
- Seiko Epson Corporation
- Shuichi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP BONDING FILM, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUC...
- Publication number 20250096184
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Jihwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR MULTI-COLOR LED PIXEL UNIT WITH HORIZONTAL...
- Publication number 20240258294
- Publication date Aug 1, 2024
- Jade Bird Display (Shanghai) Limited
- Qunchao XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVE...
- Publication number 20240234244
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVE...
- Publication number 20230230898
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20220344298
- Publication date Oct 27, 2022
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVE...
- Publication number 20220139802
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AN ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES C...
- Publication number 20220037229
- Publication date Feb 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR MULTI-COLOR LED PIXEL UNIT WITH HORIZONTAL...
- Publication number 20210384182
- Publication date Dec 9, 2021
- Jade Bird Display (Shanghai) Limited
- Qunchao XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR MULTI-COLOR LED PIXEL UNIT WITH VERTICAL LI...
- Publication number 20210384181
- Publication date Dec 9, 2021
- Jade Bird Display (Shanghai) Limited
- Qunchao XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS MODULE
- Publication number 20210091054
- Publication date Mar 25, 2021
- Audi AG
- Andreas APELSMEIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BONDING SUBSTRATES
- Publication number 20200135690
- Publication date Apr 30, 2020
- Applied Materials, Inc.
- PRAYUDI LIANTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20170133341
- Publication date May 11, 2017
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER, SOLDER JOINT STRUCTURE AND METHOD OF FORMING SOLDER JOINT S...
- Publication number 20140134459
- Publication date May 15, 2014
- Industrial Technology Research Institute
- Kuo-Shu Kao
- B32 - LAYERED PRODUCTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140106160
- Publication date Apr 17, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHANG-CHIN WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
- Publication number 20130200520
- Publication date Aug 8, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
- Publication number 20130113106
- Publication date May 9, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20100071946
- Publication date Mar 25, 2010
- SEIKO EPSON CORPORATION
- Nobuaki HASHIMOTO
- G02 - OPTICS
Information Patent Application
Solder Preform and Electronic Component
- Publication number 20090236725
- Publication date Sep 24, 2009
- DENSO Corporation
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, circuit board, electro-optic device, electron...
- Publication number 20060091539
- Publication date May 4, 2006
- Seiko Epson Corporation
- Shuichi Tanaka
- G02 - OPTICS

being stacked

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages with an intermetallic layer

Systems and methods for multi-color LED pixel unit with vertical li...

Systems and methods for multi-color LED pixel unit with vertical li...

Systems and methods for multi-color LED pixel unit with horizontal...

Adhesive and thermal interface material on a plurality of dies cove...

Bonding structures and methods for forming the same

Adhesive and thermal interface material on a plurality of dies cove...

Methods for bonding substrates

Adhesive and thermal interface material on a plurality of dies cove...

Power electronics module

Semiconductor packages with an intermetallic layer

Lead frame

Solder, solder joint structure and method of forming solder joint s...

Three-dimensional (3D) integrated circuit with enhanced copper-to-c...

Electronic component mounting structure

Three-dimensional (3D) integrated circuit with enhanced copper-to-c...

Solder preform and electronic component

Semiconductor device, circuit board, electro-optic device, electron...

Patents Applicationslast 30 patents

CHIP BONDING FILM, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUC...

SYSTEMS AND METHODS FOR MULTI-COLOR LED PIXEL UNIT WITH HORIZONTAL...

ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVE...

ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVE...

BONDING STRUCTURES AND METHODS FOR FORMING THE SAME

ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVE...

AN ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES C...

SYSTEMS AND METHODS FOR MULTI-COLOR LED PIXEL UNIT WITH HORIZONTAL...

SYSTEMS AND METHODS FOR MULTI-COLOR LED PIXEL UNIT WITH VERTICAL LI...

POWER ELECTRONICS MODULE

METHODS FOR BONDING SUBSTRATES

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

SOLDER, SOLDER JOINT STRUCTURE AND METHOD OF FORMING SOLDER JOINT S...

ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...

ELECTRONIC COMPONENT MOUNTING STRUCTURE

Solder Preform and Electronic Component

Semiconductor device, circuit board, electro-optic device, electron...