being the lower part of the bonding apparatus, i.e. holding means for the bodies to be connected

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H01L2224/81149

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81149being the lower part of the bonding apparatus, i.e. holding means for the bodies to be connected

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Patents Grantslast 30 patents

Information Patent Grant
Mounting Method of a semiconductor device using a colored auxiliary...
- Patent number 10,786,876
- Issue date Sep 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems involving soldering
- Patent number 8,939,346
- Issue date Jan 27, 2015
- International Business Machines Corporation
- Julien Sylvestre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME
- Publication number 20180236613
- Publication date Aug 23, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods and Systems Involving Soldering
- Publication number 20120205424
- Publication date Aug 16, 2012
- International Business Machines Corporation
- Julien Sylvestre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR