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being the lower part of the bonding apparatus, i.e. holding means for the bodies to be connected

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  • CPC
  • H01L2224/80149
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80149being the lower part of the bonding apparatus, i.e. holding means for the bodies to be connected
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Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD FOR BONDING WAFERS AND BONDING TOOL
    • Publication number 20190148333
    • Publication date May 16, 2019
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chien-Chih CHEN
    • H01 - BASIC ELECTRIC ELEMENTS