TREA

being the upper part of the bonding apparatus, i.e. bonding head

Follow

Industry

  • CPC
  • H01L2224/85169
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85169being the upper part of the bonding apparatus, i.e. bonding head
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    BRAZE BONDED NAIL HEAD LEAD
    • Publication number 20200043882
    • Publication date Feb 6, 2020
    • LUCAS-MILHAUPT, INC.
    • Dean W Kick
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SIGNAL ROUTING IN COMPLEX QUANTUM SYSTEMS
    • Publication number 20190287946
    • Publication date Sep 19, 2019
    • International Business Machines Corporation
    • Martin O. Sandberg
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    SYSTEM AND METHOD FOR ROUTING SIGNALS IN COMPLEX QUANTUM SYSTEMS
    • Publication number 20190164935
    • Publication date May 30, 2019
    • International Business Machines Corporation
    • Martin O. Sandberg
    • G06 - COMPUTING CALCULATING COUNTING