being the upper part of the bonding apparatus

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H01L2224/80169

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80169being the upper part of the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Method for bonding semiconductor chips to a landing wafer
- Patent number 10,797,016
- Issue date Oct 6, 2020
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnet assisted alignment method for wafer bonding and wafer level...
- Patent number 9,012,265
- Issue date Apr 21, 2015
- Ge Yi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUSES AND METHODS THEREOF
- Publication number 20150155210
- Publication date Jun 4, 2015
- Samsung Electronics Co., Ltd.
- Byung Joon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnet Assisted Alignment Method for Wafer Bonding and Wafer Level...
- Publication number 20130252375
- Publication date Sep 26, 2013
- Ge Yi
- H01 - BASIC ELECTRIC ELEMENTS