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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/06151being uniform

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Patents Grantslast 30 patents

Information Patent Grant
Arrayed switch circuit, switching element and system chip package s...
- Patent number 12,154,905
- Issue date Nov 26, 2024
- Industrial Technology Research Institute
- Jie Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal isolator having enhanced creepage characteristics
- Patent number 11,973,008
- Issue date Apr 30, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects for light emitting diode chips
- Patent number 11,817,537
- Issue date Nov 14, 2023
- CreeLED, Inc.
- Michael Check
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,688,726
- Issue date Jun 27, 2023
- Kioxia Corporation
- Yasunori Iwashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects for light emitting diode chips
- Patent number 11,398,591
- Issue date Jul 26, 2022
- CreeLED, Inc.
- Michael Check
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal isolator having enhanced creepage characteristics
- Patent number 11,289,406
- Issue date Mar 29, 2022
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor module, and packaged semiconduc...
- Patent number 11,069,783
- Issue date Jul 20, 2021
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Eiji Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor module, and packaged semiconduc...
- Patent number 11,056,563
- Issue date Jul 6, 2021
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Eiji Yasuda
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Interconnects for light emitting diode chips
- Patent number 10,879,441
- Issue date Dec 29, 2020
- Cree, Inc.
- Michael Check
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts and method for manufacturing the same, circuit assembly...
- Patent number 10,867,945
- Issue date Dec 15, 2020
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects for light emitting diode chips
- Patent number 10,840,423
- Issue date Nov 17, 2020
- Cree, Inc.
- Michael Check
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects for light emitting diode chips
- Patent number 10,804,452
- Issue date Oct 13, 2020
- Cree, Inc.
- Michael Check
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heat-dissipating structure and method of...
- Patent number 10,679,955
- Issue date Jun 9, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory chip, semiconductor memory package, and electr...
- Patent number 10,679,956
- Issue date Jun 9, 2020
- Samsung Electronics Co., Ltd.
- Kyoung Soo Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Chip parts and method for manufacturing the same, circuit assembly...
- Patent number 10,468,362
- Issue date Nov 5, 2019
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory chip, semiconductor memory package, and electr...
- Patent number 10,269,740
- Issue date Apr 23, 2019
- Samsung Electronics Co., Ltd.
- Kyoung Soo Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor devices with redistribution pads
- Patent number 9,859,204
- Issue date Jan 2, 2018
- Samsung Electronics Co., Ltd.
- Myeong Soon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts and method for manufacturing the same, circuit assembly...
- Patent number 9,859,240
- Issue date Jan 2, 2018
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device using gang bonding and s...
- Patent number 9,711,693
- Issue date Jul 18, 2017
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip package including substrate with recess adjoining side...
- Patent number 9,633,935
- Issue date Apr 25, 2017
- Xintec Inc.
- Yen-Shih Ho
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for high-speed, low-profile memory packages and...
- Patent number 9,583,452
- Issue date Feb 28, 2017
- Apple Inc.
- Anthony Fai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including asymmetric electrode arrangement
- Patent number 9,585,197
- Issue date Feb 28, 2017
- Samsung Electronics Co., Ltd.
- Chin-sung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rigid wave pattern design on chip carrier substrate and printed cir...
- Patent number 9,230,919
- Issue date Jan 5, 2016
- SanDisk Technologies Inc.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device using gang bonding and s...
- Patent number 9,054,231
- Issue date Jun 9, 2015
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element unit and reinforcing adhesive agent
- Patent number 8,686,299
- Issue date Apr 1, 2014
- Panasonic Corporation
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor apparatus
- Patent number 8,581,361
- Issue date Nov 12, 2013
- Canon Kabushiki Kaisha
- Masanori Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rigid wave pattern design on chip carrier substrate and printed cir...
- Patent number 8,487,441
- Issue date Jul 16, 2013
- SanDisk Technologies Inc.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-to-chip multi-signaling communication system with common condu...
- Patent number 8,426,980
- Issue date Apr 23, 2013
- National Chiao Tung University
- Chau-Chin Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method of semiconductor s...
- Patent number 8,319,346
- Issue date Nov 27, 2012
- Teramikros, Inc.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rigid wave pattern design on chip carrier substrate and printed cir...
- Patent number 7,355,283
- Issue date Apr 8, 2008
- SanDisk Corporation
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SIGNAL ISOLATOR HAVING ENHANCED CREEPAGE CHARACTERISTICS
- Publication number 20240234257
- Publication date Jul 11, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BONDING PAD
- Publication number 20240178169
- Publication date May 30, 2024
- SK HYNIX INC.
- Byung Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME AND TILED DISPLAY...
- Publication number 20240153966
- Publication date May 9, 2024
- SAMSUNG DISPLAY CO., LTD.
- Se Hun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BILAYER RDL STRUCTURE FOR BUMP COUNT REDUCTION
- Publication number 20230395486
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Step Seal Ring and Methods Forming...
- Publication number 20230386908
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SAME
- Publication number 20230343656
- Publication date Oct 26, 2023
- Changxin Memory Technologies, Inc.
- Qilong WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20220392979
- Publication date Dec 8, 2022
- SAMSUNG DISPLAY CO., LTD.
- Sang Duk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS FOR LIGHT EMITTING DIODE CHIPS
- Publication number 20220246816
- Publication date Aug 4, 2022
- CreeLED, Inc.
- Michael Check
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ISOLATOR HAVING ENHANCED CREEPAGE CHARACTERISTICS
- Publication number 20220165647
- Publication date May 26, 2022
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220085003
- Publication date Mar 17, 2022
- KIOXIA Corporation
- Yasunori IWASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ISOLATOR HAVING ENHANCED CREEPAGE CHARACTERISTICS
- Publication number 20210082789
- Publication date Mar 18, 2021
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS FOR LIGHT EMITTING DIODE CHIPS
- Publication number 20200395524
- Publication date Dec 17, 2020
- Cree, Inc.
- Michael Check
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY...
- Publication number 20200013737
- Publication date Jan 9, 2020
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20190051593
- Publication date Feb 14, 2019
- Japan Display Inc.
- Hiroyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING CONDUCTIVE ADHESIV...
- Publication number 20180342653
- Publication date Nov 29, 2018
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180197831
- Publication date Jul 12, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND S...
- Publication number 20170317247
- Publication date Nov 2, 2017
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR HIGH-SPEED, LOW-PROFILE MEMORY PACKAGES AND...
- Publication number 20170005056
- Publication date Jan 5, 2017
- Apple Inc.
- Anthony Fai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH VARIABLE LENGTH BOND PAD
- Publication number 20150214167
- Publication date Jul 30, 2015
- Rishi Bhooshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIR...
- Publication number 20150054177
- Publication date Feb 26, 2015
- SANDISK TECHNOLOGIES INC.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIR...
- Publication number 20130299959
- Publication date Nov 14, 2013
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND S...
- Publication number 20130264600
- Publication date Oct 10, 2013
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20120153367
- Publication date Jun 21, 2012
- Canon Kabushiki Kaisha
- Masanori Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT
- Publication number 20120111617
- Publication date May 10, 2012
- PANASONIC CORPORATION
- Koji Motomura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CHIP-TO-CHIP MULTI-SIGNALING COMMUNICATION SYSTEM WITH COMMON CONDU...
- Publication number 20120091596
- Publication date Apr 19, 2012
- Chau-Chin SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF SEMICONDUCTOR S...
- Publication number 20110233787
- Publication date Sep 29, 2011
- CASIO COMPUTER CO., LTD.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIR...
- Publication number 20080054445
- Publication date Mar 6, 2008
- SANDISK CORPORATION
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20070210440
- Publication date Sep 13, 2007
- NEC ELECTRONICS CORPORATION
- Futoshi Hosoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rigid wave pattern design on chip carrier substrate and printed cir...
- Publication number 20060231943
- Publication date Oct 19, 2006
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050040503
- Publication date Feb 24, 2005
- NEC ELECTRONICS CORPORATION
- Futoshi Hosoya
- H01 - BASIC ELECTRIC ELEMENTS

being uniform

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Arrayed switch circuit, switching element and system chip package s...

Signal isolator having enhanced creepage characteristics

Interconnects for light emitting diode chips

Semiconductor device

Interconnects for light emitting diode chips

Signal isolator having enhanced creepage characteristics

Semiconductor device, semiconductor module, and packaged semiconduc...

Semiconductor device, semiconductor module, and packaged semiconduc...

Interconnects for light emitting diode chips

Chip parts and method for manufacturing the same, circuit assembly...

Interconnects for light emitting diode chips

Interconnects for light emitting diode chips

Semiconductor package with heat-dissipating structure and method of...

Semiconductor memory chip, semiconductor memory package, and electr...

Chip parts and method for manufacturing the same, circuit assembly...

Semiconductor memory chip, semiconductor memory package, and electr...

Semiconductor devices with redistribution pads

Chip parts and method for manufacturing the same, circuit assembly...

Method of fabricating semiconductor device using gang bonding and s...

Stacked chip package including substrate with recess adjoining side...

Systems and methods for high-speed, low-profile memory packages and...

Semiconductor device including asymmetric electrode arrangement

Rigid wave pattern design on chip carrier substrate and printed cir...

Method of fabricating semiconductor device using gang bonding and s...

Electronic element unit and reinforcing adhesive agent

Semiconductor apparatus

Rigid wave pattern design on chip carrier substrate and printed cir...

Chip-to-chip multi-signaling communication system with common condu...

Semiconductor structure and manufacturing method of semiconductor s...

Rigid wave pattern design on chip carrier substrate and printed cir...

Patents Applicationslast 30 patents

SIGNAL ISOLATOR HAVING ENHANCED CREEPAGE CHARACTERISTICS

SEMICONDUCTOR DEVICE INCLUDING BONDING PAD

DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME AND TILED DISPLAY...

BILAYER RDL STRUCTURE FOR BUMP COUNT REDUCTION

Semiconductor Package Including Step Seal Ring and Methods Forming...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SAME

DISPLAY DEVICE

INTERCONNECTS FOR LIGHT EMITTING DIODE CHIPS

SIGNAL ISOLATOR HAVING ENHANCED CREEPAGE CHARACTERISTICS

SEMICONDUCTOR DEVICE

SIGNAL ISOLATOR HAVING ENHANCED CREEPAGE CHARACTERISTICS

INTERCONNECTS FOR LIGHT EMITTING DIODE CHIPS

CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY...

DISPLAY DEVICE

METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING CONDUCTIVE ADHESIV...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND S...

SYSTEMS AND METHODS FOR HIGH-SPEED, LOW-PROFILE MEMORY PACKAGES AND...

SEMICONDUCTOR DIE WITH VARIABLE LENGTH BOND PAD

RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIR...

RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIR...

METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND S...

SEMICONDUCTOR APPARATUS

ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT

CHIP-TO-CHIP MULTI-SIGNALING COMMUNICATION SYSTEM WITH COMMON CONDU...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF SEMICONDUCTOR S...

RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIR...

Semiconductor device

Rigid wave pattern design on chip carrier substrate and printed cir...

Semiconductor device