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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/14141being uniform

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,916,033
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices including coax-like electrical connections and methods for...
- Patent number 11,837,565
- Issue date Dec 5, 2023
- Infineon Technologies AG
- Saqib Kaleem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,239,192
- Issue date Feb 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 10,734,343
- Issue date Aug 4, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup module and endoscope
- Patent number 10,660,511
- Issue date May 26, 2020
- Olympus Corporation
- Takuro Suyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elongated bump structure for semiconductor devices
- Patent number 9,093,332
- Issue date Jul 28, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an electronic assembly
- Patent number 7,421,778
- Issue date Sep 9, 2008
- Intel Corporation
- Jason A. Garcia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated device and electronic system
- Patent number 7,221,053
- Issue date May 22, 2007
- Infineon Technologies AG
- Thorsten Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly having multi-material interconnects
- Patent number 7,183,493
- Issue date Feb 27, 2007
- Intel Corporation
- Jason A. Garcia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,164,208
- Issue date Jan 16, 2007
- Matsushita Electric Industrial Co., Ltd.
- Kazuyuki Kainou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus to compliantly interconnect area grid arrays a...
- Patent number 6,493,238
- Issue date Dec 10, 2002
- General Dynamics Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic parts loaded module including thermal stress absorbing p...
- Patent number 5,422,516
- Issue date Jun 6, 1995
- Hitachi, Ltd.
- Takashi Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20220157755
- Publication date May 19, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES INCLUDING COAX-LIKE ELECTRICAL CONNECTIONS AND METHODS FOR...
- Publication number 20220059487
- Publication date Feb 24, 2022
- INFINEON TECHNOLOGIES AG
- Saqib KALEEM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20200357763
- Publication date Nov 12, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elongated Bump Structure for Semiconductor Devices
- Publication number 20120199966
- Publication date Aug 9, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20070072405
- Publication date Mar 29, 2007
- Matsushita Electric Industrial Co., Ltd.
- Kazuyuki Kainou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated device and electronic system
- Publication number 20060208357
- Publication date Sep 21, 2006
- Thorsten Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic assembly having multi-material interconnects
- Publication number 20060162959
- Publication date Jul 27, 2006
- Jason A. Garcia
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic assembly having multi-material interconnects
- Publication number 20060001159
- Publication date Jan 5, 2006
- Jason A. Garcia
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20050167832
- Publication date Aug 4, 2005
- Matsushita Electric Industrial Co., Ltd.
- Kazuyuki Kainou
- H01 - BASIC ELECTRIC ELEMENTS

being uniform

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and system for packing optimization of semiconductor devices

Devices including coax-like electrical connections and methods for...

Method and system for packing optimization of semiconductor devices

Method and system for packing optimization of semiconductor devices

Image pickup module and endoscope

Elongated bump structure for semiconductor devices

Method of making an electronic assembly

Integrated device and electronic system

Electronic assembly having multi-material interconnects

Semiconductor device and method for manufacturing the same

Method and apparatus to compliantly interconnect area grid arrays a...

Electronic parts loaded module including thermal stress absorbing p...

Patents Applicationslast 30 patents

Method and System for Packing Optimization of Semiconductor Devices

DEVICES INCLUDING COAX-LIKE ELECTRICAL CONNECTIONS AND METHODS FOR...

Method and System for Packing Optimization of Semiconductor Devices

Elongated Bump Structure for Semiconductor Devices

Semiconductor device and method for manufacturing the same

Integrated device and electronic system

Electronic assembly having multi-material interconnects

Electronic assembly having multi-material interconnects

Semiconductor device and method for manufacturing the same