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H01L2224/17151

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Method and encapsulant for flip-chip assembly
- Patent number 9,064,820
- Issue date Jun 23, 2015
- MEKIEC MANUFACTURING CORPORATION (THAILAND) LTD
- Sathid Jitjongruck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package equipped with semiconductor chip and method for producing same
- Patent number 7,649,267
- Issue date Jan 19, 2010
- Panasonic Corporation
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20150187722
- Publication date Jul 2, 2015
- Siliconware Precision Industries Co., Ltd.
- Cheng-Chia Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PILLARS FOR EMBEDDING SEMICONDUCTOR DIE
- Publication number 20150187745
- Publication date Jul 2, 2015
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND ENCAPSULANT FOR FLIP-CHIP ASSEMBLY
- Publication number 20150054154
- Publication date Feb 26, 2015
- MEKTEC MANUFACTURING CORPORATION (THAILAND) LTD
- Sathid Jitjongruck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Equipped with Semiconductor Chip and Method for Producing Same
- Publication number 20080265437
- Publication date Oct 30, 2008
- Tsukasa Shiraishi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...