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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/30131being uniform

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device including connection pad part and electronic compone...
- Patent number 12,057,430
- Issue date Aug 6, 2024
- Samsung Display Co., Ltd.
- Jungyun Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 11,552,041
- Issue date Jan 10, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 10,840,205
- Issue date Nov 17, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attachment for packaged semiconductor device
- Patent number 10,217,698
- Issue date Feb 26, 2019
- NXP USA, INC.
- Akhilesh K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for coating conductive substrate with adhesive
- Patent number 10,056,534
- Issue date Aug 21, 2018
- G-SMATT CO., LTD.
- Hak Ryul Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the diffusion soldering of an electronic component to a...
- Patent number 10,004,147
- Issue date Jun 19, 2018
- Siemens Aktiengesellschaft
- Joerg Strogies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attachment for packaged semiconductor device
- Patent number 9,559,077
- Issue date Jan 31, 2017
- NXP USA, INC.
- Akhilesh K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer package-on-package structure
- Patent number 9,406,636
- Issue date Aug 2, 2016
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromechanical method and corresponding assembly for bonding semic...
- Patent number 8,638,000
- Issue date Jan 28, 2014
- Robert Bosch GmbH
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for mounting electronic components
- Patent number 8,230,590
- Issue date Jul 31, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for manufacturing improved yield semiconductor...
- Patent number 7,199,463
- Issue date Apr 3, 2007
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip mounting substrate and semiconductor device usin...
- Patent number 6,965,162
- Issue date Nov 15, 2005
- Texas Instruments Incorporated
- Makoto Yoshino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for manufacturing improved yield semiconductor...
- Patent number 6,902,956
- Issue date Jun 7, 2005
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for manufacturing improved yield semiconductor...
- Patent number 6,774,480
- Issue date Aug 10, 2004
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for manufacturing improved yield semiconductor...
- Patent number 6,586,277
- Issue date Jul 1, 2003
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for packaging semiconductor chip
- Patent number 6,130,480
- Issue date Oct 10, 2000
- Oki Electric Industry Co., Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE INCLUDING BONDING MEMBER CONNECTING BETWEEN LIGHT EM...
- Publication number 20240079365
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Seungryong HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING SAME
- Publication number 20230387373
- Publication date Nov 30, 2023
- Nichia Corporation.
- Hiroki TOMINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20230268308
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20220216177
- Publication date Jul 7, 2022
- JUNGYUN JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20210066233
- Publication date Mar 4, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman FOUNTAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20190096842
- Publication date Mar 28, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman FOUNTAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE
- Publication number 20160284958
- Publication date Sep 29, 2016
- G-SMATT CO., LTD.
- Hak Ryul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical Method and Corresponding Assembly for Bonding Semic...
- Publication number 20120280409
- Publication date Nov 8, 2012
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electronic Apparatus Manufacturing Method, Electronic Component, an...
- Publication number 20120085575
- Publication date Apr 12, 2012
- Nobuhiro Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MOUNTING ELECTRONIC COMPONENTS
- Publication number 20080196245
- Publication date Aug 21, 2008
- Fujitsu Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and structure for manufacturing improved yield semiconductor...
- Publication number 20050285279
- Publication date Dec 29, 2005
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip mounting substrate and semiconductor device usin...
- Publication number 20030039102
- Publication date Feb 27, 2003
- Makoto Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structure for manufacturing improved yield semiconductor...
- Publication number 20020058358
- Publication date May 16, 2002
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structure for manufacturing improved yield semiconductor...
- Publication number 20020013014
- Publication date Jan 31, 2002
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS

being uniform

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device including connection pad part and electronic compone...

Chemical mechanical polishing for hybrid bonding

Chemical mechanical polishing for hybrid bonding

Die attachment for packaged semiconductor device

Method for coating conductive substrate with adhesive

Method for the diffusion soldering of an electronic component to a...

Die attachment for packaged semiconductor device

Interposer package-on-package structure

Micromechanical method and corresponding assembly for bonding semic...

Method for mounting electronic components

Method and structure for manufacturing improved yield semiconductor...

Semiconductor chip mounting substrate and semiconductor device usin...

Method and structure for manufacturing improved yield semiconductor...

Method and structure for manufacturing improved yield semiconductor...

Method and structure for manufacturing improved yield semiconductor...

Structure for packaging semiconductor chip

Patents Applicationslast 30 patents

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

DISPLAY MODULE INCLUDING BONDING MEMBER CONNECTING BETWEEN LIGHT EM...

LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING SAME

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE

Micromechanical Method and Corresponding Assembly for Bonding Semic...

Electronic Apparatus Manufacturing Method, Electronic Component, an...

METHOD FOR MOUNTING ELECTRONIC COMPONENTS

Method and structure for manufacturing improved yield semiconductor...

Semiconductor chip mounting substrate and semiconductor device usin...

Method and structure for manufacturing improved yield semiconductor...

Method and structure for manufacturing improved yield semiconductor...