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  • H01L23/4332
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/4332Bellows
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    EVAPORATOR STACKS AND ELECTRONIC ASSEMBLIES
    • Publication number 20210320047
    • Publication date Oct 14, 2021
    • Deere & Company
    • Thomas J. ROAN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRESSURE CONTROLLABLE ENCAPSULATED LIQUID THERMAL INTERFACE
    • Publication number 20210183742
    • Publication date Jun 17, 2021
    • International Business Machines Corporation
    • Sri M. Sri-Jayantha
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WATERPROOF CASING
    • Publication number 20200161213
    • Publication date May 21, 2020
    • DENSO CORPORATION
    • Satoshi YAMAURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WATER COOLING MODULE
    • Publication number 20190326197
    • Publication date Oct 24, 2019
    • Wen-Ji Lan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER CONVERTER
    • Publication number 20180042104
    • Publication date Feb 8, 2018
    • Omron Corporation
    • Shingo NAGAOKA
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    SEMICONDUCTOR MODULE AND ELECTRONIC DEVICE
    • Publication number 20170207144
    • Publication date Jul 20, 2017
    • Fujitsu Limited
    • Mitsutaka YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR COOLING APPARATUS
    • Publication number 20130255917
    • Publication date Oct 3, 2013
    • Raytheon Company
    • Christopher R. KOONTZ
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR COOLING APPARATUS
    • Publication number 20130255925
    • Publication date Oct 3, 2013
    • Raytheon Company
    • Christopher R. KOONTZ
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COMPLIANT VAPOR CHAMBER CHIP PACKAGING
    • Publication number 20120170221
    • Publication date Jul 5, 2012
    • International Business Machines Corporation
    • Lawrence S. Mok
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    ASSEMBLY TO PROVIDE THERMAL COOLING
    • Publication number 20120063098
    • Publication date Mar 15, 2012
    • Raytheon Company
    • Jeffrey Paquette
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Flexible Heat Exchanger
    • Publication number 20110303403
    • Publication date Dec 15, 2011
    • International Business Machines Corporation
    • Maurice F. Holahan
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    Compliant vapor chamber chip packaging
    • Publication number 20080053640
    • Publication date Mar 6, 2008
    • International Business Machines Corporation
    • Lawrence S. Mok
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    Apparatus and system for cooling heat producing components
    • Publication number 20070146996
    • Publication date Jun 28, 2007
    • Dean Frederick Herring
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Liquid cooling device
    • Publication number 20070044943
    • Publication date Mar 1, 2007
    • Foxconn Technology Co., Ltd
    • Li He
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Electronic apparatus and television receiver
    • Publication number 20060139887
    • Publication date Jun 29, 2006
    • Kabushiki Kaisha Toshiba
    • Tsuneo Kameda
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Electronic apparatus having liquid cooling system therein
    • Publication number 20050180107
    • Publication date Aug 18, 2005
    • Takashi Naganawa
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    Conformal heat sink
    • Publication number 20050039884
    • Publication date Feb 24, 2005
    • Ivan Pawlenko
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    Circuit cooling apparatus
    • Publication number 20040240184
    • Publication date Dec 2, 2004
    • Rudy A. Rivera
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    HIGH EFFICIENCY HEAT SINK/AIR COOLER SYSTEM FOR HEAT-GENERATING COM...
    • Publication number 20040190248
    • Publication date Sep 30, 2004
    • International Business Machines Corporation
    • Janak G. Patel
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    High-power multi-device liquid cooling
    • Publication number 20040109290
    • Publication date Jun 10, 2004
    • John Dunn
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Circuit cooling apparatus
    • Publication number 20040052052
    • Publication date Mar 18, 2004
    • Rudy A. Rivera
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    Flexible coupling for heat sink
    • Publication number 20030024698
    • Publication date Feb 6, 2003
    • International Business Machines Corporation
    • Henry C. Bosak
    • H01 - BASIC ELECTRIC ELEMENTS