Bending a rigid substrate Breaking rigid substrates by bending

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CPC
H05K2203/302

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

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H05K2203/302Bending a rigid substrate Breaking rigid substrates by bending

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 12,048,089
- Issue date Jul 23, 2024
- AT&SAustria Technologie & Systemtechnik
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device manufacturing apparatus with rotator and display dev...
- Patent number 11,937,490
- Issue date Mar 19, 2024
- Samsung Display Co., Ltd.
- Myung Gil Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 11,605,609
- Issue date Mar 14, 2023
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 11,483,923
- Issue date Oct 25, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoforming an electronic device with surface curvature
- Patent number 11,310,915
- Issue date Apr 19, 2022
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Edsger Constant Pieter Smits
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Separable modules PCB modules
- Patent number 11,277,906
- Issue date Mar 15, 2022
- SIGNIFY HOLDING B.V.
- Remco Christianus Wilhelmus Leermakers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnection system and method for electrically inter...
- Patent number 11,165,178
- Issue date Nov 2, 2021
- Lear Corporation
- Marc Tena Gil
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Printed circuit board and method for producing the printed circuit...
- Patent number 11,134,565
- Issue date Sep 28, 2021
- ENDRESS+HAUSER SE+CO.KG
- Harald Schäuble
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with a bent connecting section and method for...
- Patent number 11,067,622
- Issue date Jul 20, 2021
- Vitesco Technologies GmbH
- Detlev Bagung
- G01 - MEASURING TESTING
Information Patent Grant
Printable 3D electronic structure
- Patent number 11,064,609
- Issue date Jul 13, 2021
- X Display Company Technology Limited
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board interposer
- Patent number 11,006,524
- Issue date May 11, 2021
- Apple Inc.
- Scott A. Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection for printed circuit board assemblies
- Patent number 10,971,880
- Issue date Apr 6, 2021
- Neptune Technology Group Inc.
- Wilson Philip Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 10,939,547
- Issue date Mar 2, 2021
- Samsung Display Co., Ltd.
- Ah-Ram Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate and semiconductor apparatus
- Patent number 10,743,412
- Issue date Aug 11, 2020
- Shin-Etsu Chemical Co., Ltd.
- Saiko Akahane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a plurality of printed circuit boards from a singl...
- Patent number 10,714,885
- Issue date Jul 14, 2020
- Canon Kabushiki Kaisha
- Norikazu Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 10,607,957
- Issue date Mar 31, 2020
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing conductor for touch panel, conductive film...
- Patent number 10,514,787
- Issue date Dec 24, 2019
- FUJIFILM Corporation
- Haruhiko Miyamoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for producing an electronic module assembly and electronic m...
- Patent number 10,462,921
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Luminous means having LEDs arranged on fold-out surfaces
- Patent number 10,422,485
- Issue date Sep 24, 2019
- Ledvance GmbH
- Krister Bergenek
- F21 - LIGHTING
Information Patent Grant
Metal PCB assembly for vehicle lamp and manufacturing method thereof
- Patent number 10,337,687
- Issue date Jul 2, 2019
- SEJONG MATERIALS CO., LTD
- Jaedeok Sung
- F21 - LIGHTING
Information Patent Grant
Printed circuit board and a method for producing a printed circuit...
- Patent number 10,251,276
- Issue date Apr 2, 2019
- Conti Temic Microelectronic GmbH
- Johannes Bock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method of producing the same
- Patent number 10,212,810
- Issue date Feb 19, 2019
- Toppan Printing Co., Ltd.
- Takanori Ohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit substrate with temporary supports and equalized la...
- Patent number 10,199,323
- Issue date Feb 5, 2019
- Apple Inc.
- Yung-Yu Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Operating unit for a coffee machine
- Patent number 10,148,267
- Issue date Dec 4, 2018
- Eugster/Frismag AG
- Stefan Reinhart
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Grant
Fabrication of intra-structure conductive traces and interconnects...
- Patent number 10,039,195
- Issue date Jul 31, 2018
- Facebook, Inc.
- Baback Elmieh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed circuit board, and lighting device and backlight unit inclu...
- Patent number 9,874,335
- Issue date Jan 23, 2018
- LG Innotek Co., Ltd
- Seung Kwon Hong
- G02 - OPTICS
Information Patent Grant
Circuit board comprising at least one fold
- Patent number 9,872,381
- Issue date Jan 16, 2018
- Philips Lighting Holding B.V.
- Ruslan Akhmedovich Sepkhanov
- F21 - LIGHTING
Information Patent Grant
Manufacturing method of semiconductor apparatus, semiconductor appa...
- Patent number 9,866,738
- Issue date Jan 9, 2018
- Olympus Corporation
- Kazuaki Kojima
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 9,806,051
- Issue date Oct 31, 2017
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and lighting device having the circuit board
- Patent number 9,807,880
- Issue date Oct 31, 2017
- LG Innotek Co., Ltd
- Hyun Gyu Park
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE MANUFACTURING APPARATUS AND DISPLAY DEVICE MANUFACTU...
- Publication number 20240155929
- Publication date May 9, 2024
- SAMSUNG DISPLAY CO., LTD.
- Myung Gil CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER FOLDED 3D ELECTRONICS
- Publication number 20240090126
- Publication date Mar 14, 2024
- U.S. Army DEVCOM, Army Research Laboratory
- Nathan S. Lazarus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-PATTERN SUBSTRATE, FUNCTIONAL MODULE, AND PRODUCTION METHOD F...
- Publication number 20230309239
- Publication date Sep 28, 2023
- Canon Kabushiki Kaisha
- Minoru Kambegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laminated Component Carrier With a Thermoplastic Structure
- Publication number 20230054846
- Publication date Feb 23, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE MANUFACTURING APPARATUS AND DISPLAY DEVICE MANUFACTU...
- Publication number 20220173364
- Publication date Jun 2, 2022
- SAMSUNG DISPLAY CO., LTD.
- Myung Gil CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARABLE MODULES PCB MODULES
- Publication number 20210385945
- Publication date Dec 9, 2021
- SIGNIFY HOLDING B.V.
- REMCO CHRISTIANUS WILHELMUS LEERMAKERS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOFORMING AN ELECTRONIC DEVICE WITH SURFACE CURVATURE
- Publication number 20210368627
- Publication date Nov 25, 2021
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Edsger Constant Pieter SMITS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL INTERCONNECTION SYSTEM AND METHOD FOR ELECTRICALLY INTER...
- Publication number 20210135384
- Publication date May 6, 2021
- LEAR CORPORATION
- Marc TENA GIL
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRONIC COMPONENT MODULE PROVIDED WITH SUBSTRATE ON WHICH ELECTR...
- Publication number 20200258805
- Publication date Aug 13, 2020
- Denso Corporation
- Tomohiro YOKOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
- Publication number 20200185349
- Publication date Jun 11, 2020
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A PLURALITY OF PRINTED CIRCUIT BOARDS FROM A SINGL...
- Publication number 20200052450
- Publication date Feb 13, 2020
- Canon Kabushiki Kaisha
- Norikazu Sugiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING THE PRINTED CIRCUIT...
- Publication number 20190387618
- Publication date Dec 19, 2019
- Endress+Hauser SE+Co. KG
- Harald Schäuble
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190269011
- Publication date Aug 29, 2019
- SAMSUNG DISPLAY CO., LTD.
- Ah-Ram LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board With A Bent Connecting Section And Method For...
- Publication number 20190235016
- Publication date Aug 1, 2019
- CPT GROUP GMBH
- DETLEV BAGUNG
- G01 - MEASURING TESTING
Information Patent Application
Laminated Component Carrier With A Thermoplastic Structure
- Publication number 20190116664
- Publication date Apr 18, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection for Printed Circuit Board Assemblies
- Publication number 20180123304
- Publication date May 3, 2018
- Neptune Technology Group Inc.
- Wilson Philip PARKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CONDUCTOR FOR TOUCH PANEL, CONDUCTIVE FILM...
- Publication number 20180067573
- Publication date Mar 8, 2018
- FUJIFILM CORPORATION
- Haruhiko MIYAMOTO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD AND A METHOD FOR PRODUCING A PRINTED CIRCUIT...
- Publication number 20180070450
- Publication date Mar 8, 2018
- Conti Temic microelectronic GmbH
- Johannes Bock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CONDUCTIVE LAMINATE, CONDUCTIVE LAMINATE, P...
- Publication number 20180057943
- Publication date Mar 1, 2018
- FUJIFILM CORPORATION
- Naoki TSUKAMOTO
- B32 - LAYERED PRODUCTS
Information Patent Application
ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
- Publication number 20180033762
- Publication date Feb 1, 2018
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PCB ASSEMBLY FOR VEHICLE LAMP AND MANUFACTURING METHOD THEREOF
- Publication number 20180010775
- Publication date Jan 11, 2018
- SEJONG MATERIALS CO., LTD
- Jaedeok SUNG
- F21 - LIGHTING
Information Patent Application
METHOD FOR MAKING AN LED LIGHTING FIXTURE
- Publication number 20160334067
- Publication date Nov 17, 2016
- TAIWAN GREEN POINT ENTERPRISES CO., LTD.
- Sheng-Hung YI
- F21 - LIGHTING
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS, SEMICONDUCTOR APPA...
- Publication number 20150312457
- Publication date Oct 29, 2015
- OLYMPUS CORPORATION
- Kazuaki KOJIMA
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
LIGHT ENGINE
- Publication number 20140264393
- Publication date Sep 18, 2014
- ABL IP HOLDING LLC
- Forrest Starnes McCanless
- F21 - LIGHTING
Information Patent Application
BENDABLE CIRCUIT BOARD FOR LED MOUNTING AND INTERCONNECTION
- Publication number 20140226347
- Publication date Aug 14, 2014
- E I DU PONT DE NEMOURS AND COMPANY
- Daniel I. Amey
- F21 - LIGHTING
Information Patent Application
PROCESS AND STRUCTURE TO UNCURL EMBOSSED THIN FLEX CIRCUITS
- Publication number 20140210123
- Publication date Jul 31, 2014
- Xerox Corporation
- Bryan R. Dolan
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PROTECTION CIRCUIT MODULE INTEGRATED CAP ASSEMBLY, AND METHOD OF MA...
- Publication number 20140212699
- Publication date Jul 31, 2014
- Samsung SDI Co., Ltd.
- Yu-Sik Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backlight Module, Printed Circuit Board Used for Backlight Module,...
- Publication number 20140192514
- Publication date Jul 10, 2014
- SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Che-chang Hu
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICES WITH YIELDING SUBSTRATES
- Publication number 20140191257
- Publication date Jul 10, 2014
- Michael A. Tischler
- G02 - OPTICS
Information Patent Application
PRINTED CIRCUIT BOARD, AND LIGHTING DEVICE AND BACKLIGHT UNIT INCLU...
- Publication number 20140153221
- Publication date Jun 5, 2014
- LG Innotek Co., Ltd.
- Seung Kwon HONG
- G02 - OPTICS

Bending a rigid substrate Breaking rigid substrates by bending

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Laminated component carrier with a thermoplastic structure

Display device manufacturing apparatus with rotator and display dev...

Ultra-thin embedded semiconductor device package and method of manu...

Laminated component carrier with a thermoplastic structure

Thermoforming an electronic device with surface curvature

Separable modules PCB modules

Electrical interconnection system and method for electrically inter...

Printed circuit board and method for producing the printed circuit...

Printed circuit board with a bent connecting section and method for...

Printable 3D electronic structure

Circuit board interposer

Connection for printed circuit board assemblies

Display device and method of manufacturing the same

Substrate and semiconductor apparatus

Method of making a plurality of printed circuit boards from a singl...

Ultra-thin embedded semiconductor device package and method of manu...

Method for manufacturing conductor for touch panel, conductive film...

Method for producing an electronic module assembly and electronic m...

Luminous means having LEDs arranged on fold-out surfaces

Metal PCB assembly for vehicle lamp and manufacturing method thereof

Printed circuit board and a method for producing a printed circuit...

Printed wiring board and method of producing the same

Flexible circuit substrate with temporary supports and equalized la...

Operating unit for a coffee machine

Fabrication of intra-structure conductive traces and interconnects...

Printed circuit board, and lighting device and backlight unit inclu...

Circuit board comprising at least one fold

Manufacturing method of semiconductor apparatus, semiconductor appa...

Ultra-thin embedded semiconductor device package and method of manu...

Circuit board and lighting device having the circuit board

Patents Applicationslast 30 patents

DISPLAY DEVICE MANUFACTURING APPARATUS AND DISPLAY DEVICE MANUFACTU...

LASER FOLDED 3D ELECTRONICS

MULTI-PATTERN SUBSTRATE, FUNCTIONAL MODULE, AND PRODUCTION METHOD F...

Laminated Component Carrier With a Thermoplastic Structure

DISPLAY DEVICE MANUFACTURING APPARATUS AND DISPLAY DEVICE MANUFACTU...

SEPARABLE MODULES PCB MODULES

THERMOFORMING AN ELECTRONIC DEVICE WITH SURFACE CURVATURE

ELECTRICAL INTERCONNECTION SYSTEM AND METHOD FOR ELECTRICALLY INTER...

ELECTRONIC COMPONENT MODULE PROVIDED WITH SUBSTRATE ON WHICH ELECTR...

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

METHOD OF MAKING A PLURALITY OF PRINTED CIRCUIT BOARDS FROM A SINGL...

PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING THE PRINTED CIRCUIT...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

Printed Circuit Board With A Bent Connecting Section And Method For...

Laminated Component Carrier With A Thermoplastic Structure

Connection for Printed Circuit Board Assemblies

METHOD FOR MANUFACTURING CONDUCTOR FOR TOUCH PANEL, CONDUCTIVE FILM...

PRINTED CIRCUIT BOARD AND A METHOD FOR PRODUCING A PRINTED CIRCUIT...

METHOD OF MANUFACTURING CONDUCTIVE LAMINATE, CONDUCTIVE LAMINATE, P...

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

METAL PCB ASSEMBLY FOR VEHICLE LAMP AND MANUFACTURING METHOD THEREOF

METHOD FOR MAKING AN LED LIGHTING FIXTURE

MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS, SEMICONDUCTOR APPA...

LIGHT ENGINE

BENDABLE CIRCUIT BOARD FOR LED MOUNTING AND INTERCONNECTION

PROCESS AND STRUCTURE TO UNCURL EMBOSSED THIN FLEX CIRCUITS

PROTECTION CIRCUIT MODULE INTEGRATED CAP ASSEMBLY, AND METHOD OF MA...

Backlight Module, Printed Circuit Board Used for Backlight Module,...

ELECTRONIC DEVICES WITH YIELDING SUBSTRATES

PRINTED CIRCUIT BOARD, AND LIGHTING DEVICE AND BACKLIGHT UNIT INCLU...